Abstract: Provided is a semiconductor device. A semiconductor device includes a substrate, a buffer layer provided on the substrate, a semiconductor layer provided on the buffer layer, a body region provided at a part of a surface layer of the semiconductor layer, a source region provided at a part of a surface layer of the body region, a drain region provided at a part of the surface layer of the semiconductor layer outside the body region, a gate insulating layer provided to extend from the surface layer of the body region to a predetermined depth, a gate electrode provided on the gate insulating layer, a source electrode provided on the source region, a drain electrode provided on the drain region, and an isolation region provided to extend from the surface layer of the semiconductor layer to above the predetermined depth.

Abstract: A method and a system for measuring the thermal stability factor of a magnetic tunnel junction device, a semiconductor integrated circuit, and a production management method for the semiconductor integrated circuit, capable of measuring the thermal stability factors of individual devices in a relatively short period of time and quickly performing quality control during material development and at a production site. A meter measures change in resistance value of an evaluation MTJ for a predetermined period while causing a predetermined current to flow into the evaluation MTJ maintained at a predetermined temperature. An analyzer calculates a time constant in which a low-resistance state is maintained and a time constant in which a high-resistance state is maintained from the measured change in resistance value. A thermal stability factor of the evaluation MTJ is calculated on the basis of the calculated time constants and the predetermined current flowing into the evaluation MTJ.

Abstract: A method and a system for measuring the thermal stability factor of a magnetic tunnel junction device, a semiconductor integrated circuit, and a production management method for the semiconductor integrated circuit, capable of measuring the thermal stability factors of individual devices in a relatively short period of time and quickly performing quality control during material development and at a production site. A meter measures change in resistance value of an evaluation MTJ for a predetermined period while causing a predetermined current to flow into the evaluation MTJ maintained at a predetermined temperature. An analyzer calculates a time constant in which a low-resistance state is maintained and a time constant in which a high-resistance state is maintained from the measured change in resistance value. A thermal stability factor of the evaluation MTJ is calculated on the basis of the calculated time constants and the predetermined current flowing into the evaluation MTJ.

Abstract: Provided is a semiconductor device. A semiconductor device includes a substrate, a buffer layer provided on the substrate, a semiconductor layer provided on the buffer layer, a body region provided at a part of a surface layer of the semiconductor layer, a source region provided at a part of a surface layer of the body region, a drain region provided at a part of the surface layer of the semiconductor layer outside the body region, a gate insulating layer provided to extend from the surface layer of the body region to a predetermined depth, a gate electrode provided on the gate insulating layer, a source electrode provided on the source region, a drain electrode provided on the drain region, and an isolation region provided to extend from the surface layer of the semiconductor layer to above the predetermined depth.