Patents by Inventor Masakazu Yamano

Masakazu Yamano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for mounting electronic components
    Patent number: 7296727
    Abstract: After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: November 20, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida, Takaharu Mae, Makoto Akita, Shozo Minamitani
  • Apparatus and method for mounting electronic components
    Publication number: 20050098610
    Abstract: After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
    Type: Application
    Filed: December 20, 2002
    Publication date: May 12, 2005
    Inventors: Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida, Takaharu Mae, Makoto Akita, Shozo Minamitani