Abstract: The present invention aims to provide a rigid polyurethane resin for cutting, which has high heat resistance, no scorching, and reduced expansion due to absorption of moisture in the air. The rigid polyurethane resin-forming composition (P) for cutting of the present invention includes: a polyol component (A); an isocyanate component (B); an inorganic filler (C); and a dehydrating agent (D). The polyol component (A) includes: 45 to 99% by weight of a polyphenol (j) alkylene oxide adduct (a), the polyphenol (j) having k functional groups where k is an integer of 2 or 3; and 1 to 55% by weight of a polyol (b). The polyphenol (j) alkylene oxide adduct (a) includes a total of not more than 39% by weight of a polyphenol (j) alkylene oxide adduct (ak) with at most k moles of alkylene oxide, based on 100% by weight of the polyphenol (j) alkylene oxide adduct (a), and has a hydroxyl value of 100 to 295 mg KOH/g.

Abstract: The present invention aims to provide a rigid polyurethane resin for cutting, which has high heat resistance, no scorching, and reduced expansion due to absorption of moisture in the air. The rigid polyurethane resin-forming composition (P) for cutting of the present invention includes: a polyol component (A); an isocyanate component (B); an inorganic filler (C); and a dehydrating agent (D). The polyol component (A) includes: 45 to 99% by weight of a polyphenol (j) alkylene oxide adduct (a), the polyphenol (j) having k functional groups where k is an integer of 2 or 3; and 1 to 55% by weight of a polyol (b). The polyphenol (j) alkylene oxide adduct (a) includes a total of not more than 39% by weight of a polyphenol (j) alkylene oxide adduct (ak) with at most k moles of alkylene oxide, based on 100% by weight of the polyphenol (j) alkylene oxide adduct (a), and has a hydroxyl value of 100 to 295 mg KOH/g.

Abstract: A machinable resin molded product having a charge half-life of 1 to 60 seconds and a water content of 0.05 to 1.0 wt %, a model obtained by cutting the resin molded product, and a machinable resin-forming material comprising a hard resin component (A) and a non-silicone surfactant (B) are provided, whereby a machinable resin-forming material such that powder or dust generated from the same in a cutting process does not adversely affect electronically controlled circuits of a processing machine, thereby not causing malfunctions, accidental stops, etc. of the processing machine, a machinable resin molded product made of the foregoing resin-forming material, and a model obtained by cutting the molded product are provided.