Patents by Inventor Masaki Chiba

Masaki Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170001660
    Abstract: Filters output a vibration-suppression gain for suppressing resonance of a sub frame or shimmy by performing a filter processing on a rotational angle of a motor. The filters have respective frequency characteristics that a gain becomes a maximum magnitude and a phase advances by 90° at a cut-off angle frequency. The cut-off angle frequency of the filter is fixedly set at a resonance frequency of the sub frame. The cut-off angle frequency of the filter is variably set in accordance with a tire rotation frequency. A gain adder adds the respective gains of the filters and outputs an added magnitude to a correcting mechanism as a vibration-suppression gain. The correcting mechanism corrects a motor torque set by an assist map by using the vibration-suppression gain outputted by the gain adder.
    Type: Application
    Filed: June 20, 2016
    Publication date: January 5, 2017
    Applicant: MAZDA MOTOR CORPORATION
    Inventor: Masaki CHIBA
  • Patent number: 9511649
    Abstract: There are provided view adjustment areas respectively at an upper edge part, a lower edge part, and right-and-left side edge parts of a windshield glass, wherein the view adjustment areas are configured to be respectively switchable between in a transparent state in which forward visibility is ensured and in a translucent or non-transparent state in which the forward visibility is limited (for example, adhesion of a liquid-crystal film). Thereby, the size or the shape of the window-frame structure of the windshield glass which is physically unchangeable can be visually changed.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: December 6, 2016
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Yoshihisa Okamoto, Takahide Nouzawa, Kazuo Nishikawa, Atsuhide Kishi, Takayoshi Nakamoto, Naoki Yamada, Hironobu Yonezawa, Toshihiro Yoshida, Hiroko Kajikawa, Masaki Chiba
  • Publication number: 20160295749
    Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.
    Type: Application
    Filed: November 14, 2014
    Publication date: October 6, 2016
    Inventors: Minoru YOSHIKAWA, Kenichi INABA, Masanori SATO, Akira SHOUJIGUCHI, Arihiro MATSUNAGA, Masaki CHIBA
  • Publication number: 20160290691
    Abstract: It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage.
    Type: Application
    Filed: November 10, 2014
    Publication date: October 6, 2016
    Inventors: Masaki CHIBA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Kenichi INABA, Arihiro MATSUNAGA, Masanori SATO, Tadao HOSAKA, Yasuhito NAKAMURA
  • Patent number: 9459031
    Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: October 4, 2016
    Assignee: NEC Corporation
    Inventors: Kenichi Inaba, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Arihiro Matsunaga
  • Publication number: 20160282023
    Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.
    Type: Application
    Filed: December 5, 2014
    Publication date: September 29, 2016
    Applicants: NEC Corporation, NEC Platforms, Ltd.
    Inventors: Arihiro MATSUNAGA, Masaki CHIBA, Minoru YOSHIKAWA, Tadao HOSAKA, Shunsuke FUJII, Akira SHOUJIGUCHI, Kenichi INABA, Masanori SATO
  • Patent number: 9456528
    Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: September 27, 2016
    Assignee: NEC Corporation
    Inventors: Arihiro Matsunaga, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba
  • Patent number: 9433129
    Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: August 30, 2016
    Assignee: NEC Corporation
    Inventors: Arihiro Matsunaga, Minoru Yoshikawa, Hitoshi Sakamoto, Akira Shoujiguchi, Masaki Chiba, Kenichi Inaba
  • Publication number: 20160174417
    Abstract: A control mechanism becomes complex when an optimum volume of refrigerant is stably supplied to a plurality of objects to be cooled that have differing heat generation values. The present invention is a cooling system which comprises a first refrigerant tank that stores a liquid-phase refrigerant, a plurality of evaporators that gasify the liquid-phase refrigerant supplied from the first refrigerant tank, a condenser that liquefies the gas-phase refrigerant that was gasified by the evaporators, a vapor pipe that connects the evaporators and the condenser and in which the gas-phase refrigerant flows, and a liquid pipe that connects the condenser and the first refrigerant tank and connects the first refrigerant tank and the plurality of evaporators and in which the liquid-phase refrigerant flows, wherein the condenser is located higher than the plurality of evaporators, and the first refrigerant tank is located lower than the condenser.
    Type: Application
    Filed: July 10, 2014
    Publication date: June 16, 2016
    Applicant: NEC Corporation
    Inventors: Mahiro HACHIYA, Minoru YOSHIKAWA, Hitoshi SAKAMOTO, Akira SHOUJIGUCHI, Masaki CHIBA, Kenichi INABA, Arihiro MATSUNAGA
  • Patent number: 9363886
    Abstract: An electronic substrate has a tabular base material which can install a heater element and a cooling structure that cools the heater element. The electronic substrate can be plugged in/out in a case in the direction which is almost parallel to the face of the base material. The cooling structure has a first heat radiation part with a hollow shape and a heat transfer part. The first heat radiation part radiates the generated heat of a heater element installed in the base material. A heat transfer part transfers the generated heat to the first heat radiation part. The first heat radiation part has a first joint surface formed along a face which is almost vertical to the insert and removal direction of the base material. The first heat radiation part is connected to a second radiation part set up in the case thermally through the first joint surface.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: June 7, 2016
    Assignee: NEC Corporation
    Inventors: Hitoshi Sakamoto, Minoru Yoshikawa, Masaki Chiba, Kenichi Inaba, Arihiro Matsunaga
  • Publication number: 20160147034
    Abstract: A cooling structure of a sealed casing according to the present invention includes sealed containers for housing heat-generation components irradiated with light from a light source to generate heat, an evaporation unit disposed in the sealed container to store a refrigerant, a condensation unit configured to liquefy the refrigerant gasified by the heat received from the heat-generation component, a steam pipe configured to connect the evaporation unit and the condensation unit, through which the gasified refrigerant flows, and a liquid pipe configured to connect the evaporation unit and the condensation unit to each other, through which the liquefied refrigerant flows. Thus, a cooling structure capable of preventing performance deterioration of a cooling target device can be achieved.
    Type: Application
    Filed: July 16, 2014
    Publication date: May 26, 2016
    Applicant: NEC Corporation
    Inventors: Akira SHOUJIGUCHI, Minoru YOSHIKAWA, Hitoshi SAKAMOTO, Masaki CHIBA, Kenichi INABA, Arihiro MATSUNAGA
  • Publication number: 20160116225
    Abstract: This cooling device has: an evaporation section for storing a refrigerant; a condensation section for radiating the heat of a gas-phase refrigerant, which has been gasified by the evaporation section, by condensing and liquefying the gas-phase refrigerant; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant, which has been condensed by the condensation section, to the evaporation section; and a mounting plate provided with a connection structure connected to the device side which is to be cooled. The evaporation section is disposed on one surface of the mounting plate, and the condensation section is disposed on the other side of the mounting plate.
    Type: Application
    Filed: May 26, 2014
    Publication date: April 28, 2016
    Inventors: AKIRA SHOUJIGUCHI, MINORU YOSHIKAWA, HITOSHI SAKAMOTO, MASAKI CHIBA, KENICHI INABA, ARIHIRO MATSUNAGA, MAHIRO HACHIYA
  • Publication number: 20160089961
    Abstract: A view adjustment device of a vehicle which adjusts a view recognized by a driver through a windshield glass comprises a visual-stimulation indicating mechanism capable of indicating shielding portions in a view area of the diver and a controller to control an indication manner of the visual-stimulation indicator. The controller comprises a traveling-direction determination portion to determine a traveling direction of the vehicle, a traveling-speed determination portion to determine a traveling speed of the vehicle, and an indication control portion to control the visual-stimulation indicating mechanism. The indication control portion is configured such that when it is determined that the vehicle travels in a straight direction, the high-speed shielding portion is indicated at a position located relatively on a leftward side, in a vehicle width direction, compared to the low-speed shielding portion or the middle-speed shielding portion.
    Type: Application
    Filed: August 21, 2015
    Publication date: March 31, 2016
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Kazuki NAKAMURA, Masaki CHIBA, Kumiko MAEBASHI
  • Patent number: 9288931
    Abstract: A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrige
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: March 15, 2016
    Assignee: NEC Corporation
    Inventors: Kenichi Inaba, Minoru Yoshikawa, Hitoshi Sakamoto, Masaki Chiba, Arihiro Matsunaga
  • Publication number: 20160039271
    Abstract: There are provided view adjustment areas respectively at an upper edge part, a lower edge part, and right-and-left side edge parts of a windshield glass, wherein the view adjustment areas are configured to be respectively switchable between in a transparent state in which forward visibility is ensured and in a translucent or non-transparent state in which the forward visibility is limited (for example, adhesion of a liquid-crystal film). Thereby, the size or the shape of the window-frame structure of the windshield glass which is physically unchangeable can be visually changed.
    Type: Application
    Filed: August 4, 2015
    Publication date: February 11, 2016
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Yoshihisa OKAMOTO, Takahide NOUZAWA, Kazuo NISHIKAWA, Atsuhide KISHI, Takayoshi NAKAMOTO, Naoki YAMADA, Hironobu YONEZAWA, Toshihiro YOSHIDA, Hiroko KAJIKAWA, Masaki CHIBA
  • Publication number: 20160018143
    Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.
    Type: Application
    Filed: February 13, 2013
    Publication date: January 21, 2016
    Inventors: Kenichi INABA, Minoru YOSHIKAWA, Hitoshi SAKAMOTO, Akira SHOUJIGUCHI, Masaki CHIBA, Arihiro MATSUNAGA
  • Publication number: 20160014928
    Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510.
    Type: Application
    Filed: February 19, 2014
    Publication date: January 14, 2016
    Applicant: NEC CORPORATION
    Inventors: Hitoshi SAKAMOTO, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Masaki CHIBA, Kenichi INABA, Arihiro MATSUNAGA
  • Publication number: 20160014933
    Abstract: [Problem] To provide an electronic apparatus cooling system having superior cooling characteristics and portability. [Solution] A rack 2 is installed within a container 1. A heat receiving apparatus 3 is disposed on a lateral face of the rack 2, and receives heat emitted within the rack 2 by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube 6 is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus 3. A heat radiating apparatus 4 is disposed above the rack 2 outside the container 1, and radiates the heat which the heat receiving apparatus 3 has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube 6, making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube 7 transports the liquid-phase cooling medium from the heat radiating apparatus 4 to the heat receiving apparatus 3.
    Type: Application
    Filed: February 19, 2014
    Publication date: January 14, 2016
    Applicant: NEC Corporation
    Inventors: Arihiro MATSUNAGA, Minoru YOSHIKAWA, Hitoshi SAKAMOTO, Masaki CHIBA, Akira SHOUJIGUCHI, Kenichi INABA
  • Publication number: 20150351286
    Abstract: The present invention includes: a heat receiving portion that receives heat generated by an electronic apparatus and causes a phase of a first heating medium to change from a liquid phase to a gas; a heat radiating portion that causes a phase of the first heating medium to change from the gas to the liquid and supplies the first heating medium to the heat receiving portion; and a compressor that raises a temperature of the first heating medium supplied from the heat receiving portion and supplies the first heating medium to the heat radiating portion.
    Type: Application
    Filed: December 3, 2013
    Publication date: December 3, 2015
    Applicant: NEC CORPORATION
    Inventors: Hitoshi SAKAMOTO, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Masaki CHIBA, Kenichi INABA, Arihiro MATSUNAGA
  • Publication number: 20150305209
    Abstract: A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.
    Type: Application
    Filed: December 3, 2013
    Publication date: October 22, 2015
    Applicants: NEC CORPORATION, NEC CORPORATION
    Inventors: Kenichi INABA, Minoru YOSHIKAWA, Hitoshi SAKAMOTO, Akira SHOUJIGUCHI, Arihiro MATSUNAGA, Masaki CHIBA