Patents by Inventor Masaki Migita
Masaki Migita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220384510Abstract: A sensor array and a read-out circuit are prepared. The sensor array and the read-out circuit are aligned such that each first electrode and each second electrode face each other in a state where a connection material is disposed between a second area of the sensor array and a fourth area of the read-out circuit. The read-out circuit is pressed against the sensor array with a first load such that the sensor array and the readout circuit are bonded by the connection material with a gap provided between each first electrode and each second electrode. The read-out circuit is pressed against the sensor array with a second load larger than the first load so that each first electrode and each second electrode are connected. Before the pressing with the second load, either one of the first electrode and the second electrode has a conical shape.Type: ApplicationFiled: March 16, 2022Publication date: December 1, 2022Applicant: Sumitomo Electric Industries, Ltd.Inventor: Masaki MIGITA
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Patent number: 10431727Abstract: A light emitting apparatus includes: a module including a Peltier device with a first face opposite a second face, a supporting member with a principal surface, and a light emitting semiconductor device, and a package housing the module. The supporting member principal surface has a first area that supports the first face of the Peliter device, and a second area adjacent to the first area that supports the light emitting semiconductor device. The supporting member has a circuit board with different levels to which the Peliter device and the light emitting semiconductor device are connected.Type: GrantFiled: May 14, 2018Date of Patent: October 1, 2019Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Masaki Migita
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Publication number: 20180337319Abstract: A light emitting apparatus includes: a module including a Peltier device with a first face and a second face, a supporting member with a principal surface, and a light emitting semiconductor device, the first face being opposite to the second face; and a package housing the module, the principal surface having a first area and a second area adjacent to the first area, the supporting member supporting the first face of the Peltier device on the first area of the principal surface, and the supporting member supporting the light emitting semiconductor device on the second area of the principal surface.Type: ApplicationFiled: May 14, 2018Publication date: November 22, 2018Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Masaki MIGITA
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Publication number: 20180337165Abstract: An optical module includes: a light emitting semiconductor device producing light in a middle and long wavelength infrared range; a photodetector sensitive to middle and long wavelength infrared light; and a container including a supporting member and a package. The supporting member has a first area and a second area different from the first area. The package has an optical window transmissive to middle and long wavelength infrared light; the light emitting semiconductor device is disposed on the first area; the photodetector is disposed on the second area; and the package supports the supporting member so as to allow the light emitting semiconductor device to emit the light to the optical window and allow the photodetector to receive light through the optical window.Type: ApplicationFiled: May 14, 2018Publication date: November 22, 2018Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Masaki MIGITA
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Patent number: 10128294Abstract: A light-receiving apparatus includes: a light-receiving device array including a semiconductor structure including a plurality of semiconductor mesas, a plurality of grooves each of which defines one of the semiconductor mesas, a plurality of first electrodes disposed on upper surfaces of the semiconductor mesas, a plurality of first bump electrodes disposed on the first electrodes, and a metal body disposed on a bottom surface of at least one of the grooves, the metal body being spaced apart from the first electrodes and the first bump electrodes; a semiconductor device processing an electric signal from the light-receiving device array; and an underfill disposed between the light-receiving device array and the semiconductor device. The metal body is spaced apart from a surface of the semiconductor device. The semiconductor device is joined to the light-receiving device array through the first bump electrodes.Type: GrantFiled: October 3, 2017Date of Patent: November 13, 2018Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Masaki Migita
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Publication number: 20180151617Abstract: A light-receiving apparatus includes: a light-receiving device array including a semiconductor structure including a plurality of semiconductor mesas, a plurality of grooves each of which defines one of the semiconductor mesas, a plurality of first electrodes disposed on upper surfaces of the semiconductor mesas, a plurality of first bump electrodes disposed on the first electrodes, and a metal body disposed on a bottom surface of at least one of the grooves, the metal body being spaced apart from the first electrodes and the first bump electrodes; a semiconductor device processing an electric signal from the light-receiving device array; and an underfill disposed between the light-receiving device array and the semiconductor device. The metal body is spaced apart from a surface of the semiconductor device. The semiconductor device is joined to the light-receiving device array through the first bump electrodes.Type: ApplicationFiled: October 3, 2017Publication date: May 31, 2018Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Masaki MIGITA
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Patent number: 9264645Abstract: An optical sensor apparatus includes a package having a window; a sensor chip having an array of light receiving devices and a pixel electrode connected to each light receiving device, the sensor chip having an incidence surface that faces the window of the package; and a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to each pixel electrode of the sensor chip. The sensor chip and the read-out circuit are housed in the package. In plan view from the sensor chip, the read-out circuit is overlapped by the sensor chip, and the read-out circuit has no portion extending off the sensor chip.Type: GrantFiled: July 31, 2014Date of Patent: February 16, 2016Assignee: SUMITOMO ELECTRIC INDUSTRIES, INC.Inventors: Hiroshi Inada, Masaki Migita, Yasuhiro Iguchi
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Patent number: 9240429Abstract: An image pickup device includes a light-receiving device unit, a processing portion, a first connection body, and a second connection body. The first connection body electrically connects a first electrode of the light-receiving device unit to a corresponding second electrode of the processing portion. The first connection body includes an indium-containing solder portion disposed between the first electrode and the second electrode, and a barrier layer for suppressing alloying of the solder portion with the first electrode and the second electrode. The second connection body includes an alloy portion formed by alloying with a solder containing a material having a melting point equal to or higher than a melting point of the first connection body and a hardness higher than that of the first connection body.Type: GrantFiled: July 6, 2012Date of Patent: January 19, 2016Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hiroki Mori, Masaki Migita, Youichi Nagai
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Patent number: 9123605Abstract: An image sensor includes a package having a window; a sensor chip facing the window, the sensor chip having a pixel region, the sensor chip having an electrode; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit having a read-out electrode connected to the electrode of the sensor chip; and a shielding plate disposed outside the pixel region of the sensor chip. The shielding plate is configured to block transmission of light.Type: GrantFiled: June 5, 2014Date of Patent: September 1, 2015Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Yasuhiro Iguchi, Hiroshi Inada, Masaki Migita
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Publication number: 20150035989Abstract: An optical sensor apparatus includes a package having a window; a sensor chip having an array of light receiving devices and a pixel electrode connected to the light receiving device, the sensor chip having an incidence surface that faces the window of the package; and a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to the pixel electrode of the sensor chip. The sensor chip and the read-out circuit are housed in the package. In plan view from the sensor chip, the read-out circuit is overlapped with the sensor chip, and the read-out circuit has no portion extending off the sensor chip.Type: ApplicationFiled: July 31, 2014Publication date: February 5, 2015Inventors: HIROSHI INADA, Masaki MIGITA, Yasuhiro IGUCHI
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Publication number: 20140367818Abstract: An image sensor includes a package having a window; a sensor chip facing the window, the sensor chip having a pixel region, the sensor chip having an electrode; a read-out circuit disposed farther from the window than the sensor chip, the read-out circuit having a read-out electrode connected to the electrode of the sensor chip; and a shielding plate disposed outside the pixel region of the sensor chip. The shielding plate is configured to block transmission of light.Type: ApplicationFiled: June 5, 2014Publication date: December 18, 2014Inventors: Yasuhiro IGUCHI, Hiroshi INADA, Masaki MIGITA
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Publication number: 20140327101Abstract: An image pickup device includes a light-receiving device unit, a processing portion, a first connection body, and a second connection body. The first connection body electrically connects a first electrode of the light-receiving device unit to a corresponding second electrode of the processing portion. The first connection body includes an indium-containing solder portion disposed between the first electrode and the second electrode, and a barrier layer for suppressing alloying of the solder portion with the first electrode and the second electrode. The second connection body includes an alloy portion formed by alloying with a solder containing a material having a melting point equal to or higher than a melting point of the first connection body and a hardness higher than that of the first connection body.Type: ApplicationFiled: July 6, 2012Publication date: November 6, 2014Inventors: Hiroki Mori, Masaki Migita, Youichi Nagai
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Publication number: 20110317965Abstract: An optical subassembly (OSA) with a newly arranged optical device is disclosed. The OSA provides a ceramic package that installs a semiconductor optical device, a joint portion welded to a lid of the ceramic package, and an optical coupling portion that receives an external optical fiber. In the OSA, the seal ring put between the top of the multi-layered ceramic package and the lid is isolated from the optical device; accordingly, the lid, the joint portion and the optical coupling portion are electrically isolated from the semiconductor optical device even when the OSA is installed in an optical apparatus such as an optical transceiver.Type: ApplicationFiled: May 12, 2010Publication date: December 29, 2011Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Yasushi Fujimura, Keiji Tanaka, Shunsuke Sato, Masaki Migita
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Patent number: 7415187Abstract: The present invention is to provide an optical module that installs a laser diode and a Peltier device, and to provide a method for manufacturing the optical module. The invention may relax the restriction of the solder used in the assembly thereof and may prevent the thermoelectric device from degrading the performance and the reliability thereof. The laser module includes a base, the thermoelectric device, and the carrier. The thermoelectric device is fixed to the base with a first solder, while the carrier is fixed to the thermoelectric device with a second solder whose melting point is smaller than the melting point of the first solder. When the first solder is melted to fix the thermoelectric device, the second solder is also melted to fix the carrier on the thermoelectric device.Type: GrantFiled: February 6, 2006Date of Patent: August 19, 2008Assignee: Sumitomo Electric Industries, Ltd.Inventors: Hirotaka Oomori, Masaki Migita
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Publication number: 20060198600Abstract: The present invention is to provide an optical module that installs a laser diode and a Peltier device, and to provide a method for manufacturing the optical module. The invention may relax the restriction of the solder used in the assembly thereof and may prevent the thermoelectric device from degrading the performance and the reliability thereof. The laser module includes a base, the thermoelectric device, and the carrier. The thermoelectric device is fixed to the base with a first solder, while the carrier is fixed to the thermoelectric device with a second solder whose melting point is smaller than the melting point of the first solder. When the first solder is melted to fix the thermoelectric device, the second solder is also melted to fix the carrier on the thermoelectric device.Type: ApplicationFiled: February 6, 2006Publication date: September 7, 2006Inventors: Hirotaka Oomori, Masaki Migita