Abstract: In a method for detecting and picking up dies from a wafer, when a defective die is detected inside a predetermined reversing range defined on the wafer, the die detection and pick-up movement is shifted one pitch to the next row of dies so as to detect the first die of the next row. If the first die of the next row is not a defective die, the die detection and pick-up movement proceeds toward the edge of the wafer in the X direction and successively detects and picks up dies on that row. Then, when a defective die is detected on that row, the direction of the die detection and pick-up movement is reversed without picking up the defective die, so that the die located immediately at the inner side of the first die of that row is detected and picked up, and non-defective dies on that row are successively detected and picked up.