Abstract: A toner carrier includes a metal core, a barrel formed on an outer circumference of the metal core and including at least an elastic layer, and a coating formed on outer circumferences of both ends of the barrel. The coating has a thickness and a width of an outer circumference of the coating is different from a width of an inner circumference of the coating. The width is from an end surface of the barrel along an axis of the barrel, and the width of the outer circumference is larger than the width of the inner circumference so that the end surface of the coating is reversely inclined.

Abstract: A toner including: a binder resin containing a non-crystalline resin and a crystalline resin; a colorant; and, a releasing agent, wherein the releasing agent has a melting point of 55° C. to 80° C., and wherein the toner satisfies the following Expressions 1 and 2: (Expression 1): 20,000 Pa·s?G1?50,000 Pa·s; and (Expression 2): (G4/G2)/(G3/G1) 1.00, where G1 is a storage modulus, G2 is a loss modulus, G3 is a storage modulus and G4 is a loss modulus, and the storage modulus G1 and the loss modulus G2 are measured at 80° C. when the toner is heated from 70° C. to 150° C. and the storage modulus G3 and the loss modulus G4 are measured at 80° C. when the toner heated to 150° C. is cooled to 70° C.

Abstract: A motor assembly includes a motor, an inverter for changing rotational speed of the motor, a cooling fan coupled to a rotational shaft of the motor, a guide cover for guiding a gas flow generated by rotation of the cooling fan to the inverter, and at least two support members coupling the inverter to a side surface of the motor. The support members are located on both sides of a center line connecting a central axis of the motor to a center of the inverter as viewed from an axial direction of the motor. A space serving as a passage of the gas flow from the cooling fan is formed between the support members.

Abstract: This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate.

Abstract: To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.

Abstract: An ultrasonography apparatus includes transmitting circuitry, and processing circuitry. The transmitting circuitry configured to cause an ultrasound probe to transmit a displacement-generation ultrasonic wave to cause a displacement in a tissue of a living body, and cause the probe to transmit an observation ultrasonic wave to observe a displacement of a tissue of a living body in a predetermined scan region, the displacement caused based on the displacement-generation ultrasonic wave. The processing circuitry configured to accept a setting instruction that corresponds to the region, and that is related to an acquisition frequency of an image based on a reflected wave signal that is acquired by the probe by transmission and reception of the observation ultrasonic wave, determine a transmission condition for at least one of the displacement-generation ultrasonic wave and the observation ultrasonic wave, according to the setting instruction, and control the transmission circuitry based on the condition.

Abstract: A toner including a binder resin, a colorant and a phenol multimer represented by the following General Formula (1): where R1 to R6, R11, R12, R14 to R16, R21, R22, and R24 to R26 each are a hydrogen atom or a substituent; and n is an integer.

Abstract: Layer stack object formation method, including; forming layer of powder material containing calcium phosphate; and delivering hardening liquid to predetermined region of the layer to harden the region, wherein these steps are repeated, wherein 1) powder material satisfies A) or B), and hardened product of powder material has hydroxyapatite (HAp) transformation rate of ?1%: A) organic compound having phosphate or carboxyl group is imparted over surface of calcium phosphate powder, and organic compound imparting amount is ?10,000 ppm; and B) powder material further contains powder made of organic compound having phosphate or carboxyl group, and organic compound mixing amount to calcium phosphate powder is ?50% by mass, or wherein 2) hardening liquid contains at least organic compound having phosphate or carboxyl group, acid value of organic compound is ?0.45 gKOH/g, and content of organic compound to whole amount of hardening liquid is ?20% by mass.

Abstract: To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.

Abstract: An ultrasonic diagnosis apparatus according to an embodiment includes a transmission unit, a reception unit, a generator, and a display controller. The transmission unit causes an ultrasonic probe to transmit a displacement-producing ultrasonic wave and causes the probe to transmit a displacement-observing ultrasonic wave. The reception unit generates reflected-wave data based on a reflected wave received by the probe. The generator calculates displacement at each of a plurality of positions in the scan area over a plurality of time phases, based on the reflected-wave data, determines a time phase when the calculated displacement is substantially maximum, for each of the positions, and generates image data representing positions where the determined time phases are substantially the same as each other, among the positions. The display controller superimposes an image based on the image data on a medical image corresponding to an area including the scan area.

Abstract: A toner, including: a binder resin; and a releasing agent, wherein the toner includes a pressure plastic material as the binder resin, wherein the releasing agent includes a plurality of particulate releasing agents, and wherein the particulate releasing agents forming domain phases are dispersed in the pressure plastic material forming a continuous phase.

Abstract: A toner carrier includes a metal core, a barrel formed on an outer circumference of the metal core and including at least an elastic layer, and a coating formed on outer circumferences of both ends of the barrel. The coating has a thickness and a width of an outer circumference of the coating is different from a width of an inner circumference of the coating. The width is from an end surface of the barrel along an axis of the barrel, and the width of the outer circumference is larger than the width of the inner circumference so that the end surface of the coating is reversely inclined.

Abstract: To provide a semiconductor device characterized in that lands for mounting thereon solder balls placed in an inner area of a chip mounting area have an NSMD structure. This means that lands for mounting thereon solder balls placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view have an NSMD structure. According to the invention, a semiconductor device to be mounted on a mounting substrate with balls has improved reliability.

Abstract: A toner set, including: at least one chromatic toner containing a colorant; and a transparent toner containing no colorant, wherein the chromatic toner and the transparent toner each include a releasing agent and a binder resin, and wherein an amount of a tetrahydrofuran insoluble matter in the transparent toner is smaller than an amount of a tetrahydrofuran insoluble matter in the chromatic toner.

Abstract: To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding.

Abstract: A toner carrier includes a metal core, a barrel formed on an outer circumference of the metal core and including at least an elastic layer, and a coating formed on outer circumferences of both ends of the barrel. The coating has a thickness and a width of an outer circumference of the coating is different from a width of an inner circumference of the coating. The width is from an end surface of the barrel along an axis of the barrel, and the width of the outer circumference is larger than the width of the inner circumference so that the end surface of the coating is reversely inclined.

Abstract: A semiconductor device includes lands having an NSMD (non-solder mask defined) structure for mounting thereon solder balls placed in an inner area of a chip mounting area. The lands for mounting thereon solder balls are placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view. The semiconductor device is mounted on a mounting substrate with the balls.

Abstract: A toner for developing an electrostatic image, including: toner base particles each including a binder resin and a releasing agent; and inorganic fine particles, wherein the toner includes the inorganic fine particles as an external additive on a surface of the toner base particle, wherein the toner base particles have a BET specific surface area of 2.5 m2/g to 5.0 m2/g, and wherein the inorganic fine particles comprise inorganic fine particles (A) which are each a secondary particle where a plurality of primary particles are coalesced together.

Abstract: A method for producing core-shell type particles, including: ring-opening polymerizing a ring-opening polymerizable monomer in a first mixture containing the ring-opening polymerizable monomer, porous particles, and a compressive fluid; and injecting a second mixture containing a polymer obtained in the ring-opening polymerizing, the porous particles, and the compressive fluid to thereby granulate into the core-shell type particles.

Abstract: A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).