Patents by Inventor MASAKO HINATSU

MASAKO HINATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230263866
    Abstract: The present invention has revealed that an antiviral agent containing a serine protease such as subtilisin, nattokinase, and trypsin has an effect of inactivating non-envelope type viruses, and that combining such an antiviral agent containing a serine protease with a cationic polymer enhances the inactivation effect of the antiviral agent against non-envelope type viruses. As a result, an antiviral agent that is highly safe, that has a high virus inactivation ability, and that contains a component that is inexpensive in terms the manufacturing cost and a cationic polymer, was discovered.
    Type: Application
    Filed: May 14, 2021
    Publication date: August 24, 2023
    Applicant: JNC CORPORATION
    Inventors: Nana YOKOTA, Tomomi NAKANO, Masako HINATSU, Jun HIRAKI, Hideaki FUKUSHI
  • Patent number: 10679922
    Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: June 9, 2020
    Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
  • Patent number: 10202530
    Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: February 12, 2019
    Assignees: JNC CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
  • Publication number: 20190032909
    Abstract: The invention relates to a radiator, an electronic device, an illumination device, and a method for manufacturing the radiator. The radiator has two or more heat dissipation fins. The heat dissipation fins each are a laminate including metal foil, a graphite sheet and metal foil in that order. All the heat dissipation fins included in the radiator each have a join surface joined with adjacent heat dissipation fins, and a non-contact part not in contact with the adjacent heat dissipation fins. At least two of the heat dissipation fins each included in the radiator has a blade portion having a predetermined angle with respect to the join surface in at least part of the non-contact part.
    Type: Application
    Filed: November 11, 2016
    Publication date: January 31, 2019
    Applicant: JNC CORPORATION
    Inventors: Shin KOGA, Masako HINATSU, Kento UJIIYE, Yasuhiro SHIRAISHI
  • Publication number: 20190023900
    Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
    Type: Application
    Filed: February 28, 2017
    Publication date: January 24, 2019
    Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Masako HINATSU, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
  • Publication number: 20180251639
    Abstract: Provided is a heat-dissipating coating composition having capability of forming a coating film having a high heat-dissipating effect, and having capability of forming the coating film also excellent in heat resistance and UV resistance. The heat-dissipating coating composition of the present application contains a filler of an orthorhombic silicate mineral; and an acrylic resin and a curing agent. Either the acrylic resin or the curing agent is silicone-modified.
    Type: Application
    Filed: September 1, 2016
    Publication date: September 6, 2018
    Applicant: JNC CORPORATION
    Inventors: MASAKO HINATSU, TAKESHI FUJIWARA
  • Publication number: 20170306207
    Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.
    Type: Application
    Filed: August 26, 2015
    Publication date: October 26, 2017
    Applicants: JNC CORPORATION, OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE
    Inventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, MASAKO HINATSU, AKINORI OKADA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA