Abstract: A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.

Abstract: A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin having the same composition. The plural insulation layers are formed with a filler having the same composition. The filler content of each of the plural insulation layers ranges from 30 vol % or more to 65 vol % or less. The thermal expansion coefficient of each of the plural insulation layers ranges from 12 ppm/° C. or more to 35 ppm/° C. or less.

Abstract: In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad which is disposed on one of the wiring layers that is on the inner side of an outermost wiring layer; and an external connection terminal which is disposed on the connection pad, and which is projected from the surface of the wiring board. The external connection terminal is passed through the outermost wiring layer.

Abstract: A wiring substrate includes plural wiring layers and plural insulation layers being alternately stacked one on top of the other. The plural insulation layers are formed with insulation resin having the same composition. The plural insulation layers are formed with a filler having the same composition. The filler content of each of the plural insulation layers ranges from 30 vol % or more to 65 vol % or less. The thermal expansion coefficient of each of the plural insulation layers ranges from 12 ppm/° C. or more to 35 ppm/° C. or less.

Abstract: A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface side, and exhibiting a black color or a gray color, and a second connection pad formed to expose from the second insulating layer, wherein a connection hole having a side wall surface formed like a curved surface is formed in the second insulating layer, and the second connection pad is exposed to a bottom part of the connection hole.

Abstract: An object of the present invention is to provide a nucleic acid delivery carrier composition of low toxicity and high safety, the carrier composition, when used to administer a nucleic acid such as an siRNA into an animal-derived cell or organism, being capable of delivering efficiently the nucleic acids into the cells while protecting it from being degraded; and a nucleic acid deliver composition containing the carrier and a nucleic acid. The carrier composition for delivery of a nucleic acid is prepared by mixing (A) a cationic lipid having a steroid skeleton with (B) a tertiary ammonium salt-type cationic lipid. The nucleic acid delivery composition is prepared by mixing the nucleic acid delivery carrier with a nucleic acid.

Abstract: In a wiring board, a plurality of wiring layers and a plurality of insulating layers are alternately stacked. The wiring layers are electrically connected to one another through via holes formed in the insulating layers. The wiring board includes: a connection pad which is disposed on one of the wiring layers that is on the inner side of an outermost wiring layer; and an external connection terminal which is disposed on the connection pad, and which is projected from the surface of the wiring board. The external connection terminal is passed through the outermost wiring layer.

Abstract: An object of the present invention is to provide a nucleic acid delivery carrier composition of low toxicity and high safety, the carrier composition, when used to administer a nucleic acid such as an siRNA into an animal-derived cell or organism, being capable of delivering efficiently the nucleic acids into the cells while protecting it from being degraded; and a nucleic acid deliver composition containing the carrier and a nucleic acid. The carrier composition for delivery of a nucleic acid is prepared by mixing (A) a cationic lipid having a steroid skeleton with (B) a tertiary ammonium salt-type cationic lipid. The nucleic acid delivery composition is prepared by mixing the nucleic acid delivery carrier with a nucleic acid.

Abstract: A solid state image pickup device includes: a semiconductor substrate defining light receiving areas; pixels formed in the light receiving areas, each pixel including a high and a low sensitivity photoelectric conversion element; a light shielding film formed above the light receiving areas and having an opening above each pixel, the opening exposing at least a partial area of the high and the low sensitivity photoelectric conversion element; an on-chip micro lens formed above each opening, the on-chip micro lens converging incidence light; and an inner lens formed between the light shielding film and the on-chip micro lens and above the opening, the inner lens being disposed so that the inner lens receives light converged by the on-chip micro lens, excluding a portion of the light, and further converges the received light to make the portion of the light propagate toward the opening without passing through the inner lens.

Abstract: A solid state image pickup device includes: a semiconductor substrate defining light receiving areas; pixels formed in the light receiving areas, each pixel including a high and a low sensitivity photoelectric conversion element; a light shielding film formed above the light receiving areas and having an opening above each pixel, the opening exposing at least a partial area of the high and the low sensitivity photoelectric conversion element; an on-chip micro lens formed above each opening, the on-chip micro lens converging incidence light; and an inner lens formed between the light shielding film and the on-chip micro lens and above the opening, the inner lens being disposed so that the inner lens receives light converged by the on-chip micro lens, excluding a portion of the light, and further converges the received light to make the portion of the light propagate toward the opening without passing through the inner lens.

Abstract: Communication control apparatus capable of communicating among plural users when the plural users bring respective equipment into proximity of each other includes a transmission section to transmit terminal discriminating information to discriminate a particular terminal. A receiving section receives terminal discriminating information transmitted by another terminal or terminals. A discrimination section discriminates other terminal(s) capable of communicating with the particular terminal in accordance with the terminal discriminating information received by the receiving section. A group-set section sets one terminal or plural terminals among terminals discriminated by the discrimination means as members of the same group. An information sending section sends the same information to the terminals set by the group-set means.