Patents by Inventor Masami Enomoto
Masami Enomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11351504Abstract: A hollow fiber membrane module includes: a tubular case; a hollow fiber membrane bundle; and a pair of sealing and fixing portions, in which an outside-membrane channel that passes by an outer wall of each of the hollow fiber membranes and an inside-membrane channel that passes through the hollow inside of each of the hollow fiber membranes are formed, moist air flows through the outside-membrane channel, and dry air flows through the inside-membrane channel, whereby moisture in the moist air is supplied to the dry air by a membrane separation effect of the hollow fiber membranes, wherein a plurality of spaces are disposed between the case inner wall and the hollow fiber membrane bundle, and a restriction portion that restricts the hollow fiber membrane from entering into the spaces is partially disposed between the hollow fiber membrane bundle and each of the spaces.Type: GrantFiled: July 22, 2019Date of Patent: June 7, 2022Assignee: NOK CORPORATIONInventor: Masami Enomoto
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Publication number: 20200353416Abstract: A hollow fiber membrane module includes: a tubular case; a hollow fiber membrane bundle; and a pair of sealing and fixing portions, in which an outside-membrane channel that passes by an outer wall of each of the hollow fiber membranes and an inside-membrane channel that passes through the hollow inside of each of the hollow fiber membranes are formed, moist air flows through the outside-membrane channel, and dry air flows through the inside-membrane channel, whereby moisture in the moist air is supplied to the dry air by a membrane separation effect of the hollow fiber membranes, wherein a plurality of spaces are disposed between the case inner wall and the hollow fiber membrane bundle, and a restriction portion that restricts the hollow fiber membrane from entering into the spaces is partially disposed between the hollow fiber membrane bundle and each of the spaces.Type: ApplicationFiled: July 22, 2019Publication date: November 12, 2020Applicant: NOK CORPORATIONInventor: Masami ENOMOTO
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Patent number: 5432234Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.Type: GrantFiled: August 2, 1994Date of Patent: July 11, 1995Assignee: Nippon Oil Co., Ltd.Inventors: Masami Enomoto, Hitoshi Yuasa, Fumiaki Oshimi, Yutaka Otsuki
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Patent number: 5412002Abstract: An epoxy resin composition contains an epoxy resin represented by the formula (I) and a curing accelerator: ##STR1## wherein R.sup.1 stands for ##STR2## where G stands for a glycidyl group, R.sup.2 stands for an alkyl group having 1 to 4 carbon atoms, R.sup.3 and R.sup.4 stand for the same or different groups and each denote a hydrogen atom or a glycidyl group, m and x each denote an integer of 0 to 10, n denotes an integer of 0 to 2, provided that m.gtoreq.x and, if m=0, then x=0, in which case at least one of R.sup.3 and R.sup.4 denotes a glycidyl group on the condition that when m.gtoreq.1 and m>x, R.sup.1 may each stand for different groups.Type: GrantFiled: December 9, 1992Date of Patent: May 2, 1995Assignee: Nippon Oil Co., Ltd.Inventors: Masami Enomoto, Susumu Kubota, Hitoshi Yuasa, Fumiaki Oshimi, Yutaka Otsuki
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Patent number: 5360870Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.Type: GrantFiled: August 19, 1991Date of Patent: November 1, 1994Assignee: Nippon Oil Co., Ltd.Inventors: Masami Enomoto, Hitoshi Yuasa, Fumiaki Oshimi, Yutaka Otsuki
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Patent number: 5344899Abstract: A phenolic resin is represented by the formula (1) ##STR1## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2. A method for producing the phenolic resin involves reacting in the presence of an acid catalyst 3a,4,7,7a-tetrahydroindene and a phenol represented by the formula (2) ##STR2## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and n denotes 0, 1 or 2. An epoxy resin composition for encapsulation contains: (a) a curable epoxy resin, (b) the above phenolic resin, (c) a curing promotor, and (d) an inorganic filler.Type: GrantFiled: February 16, 1993Date of Patent: September 6, 1994Assignee: Nippon Oil Co., Ltd.Inventors: Masami Enomoto, Susumu Kubota, Fumiaki Oshimi, Hitoshi Yuasa, Yutaka Otsuki
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Patent number: 5336752Abstract: A method is provided for producing a phenolic resin represented by the formula (I) ##STR1## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R.sup.2 is a divalent cyclic hydrocarbon residue having 5 to 18 carbon atoms, p is a number of from 0 to 10 and q is a number of 1 or 2. The method involves reacting a phenol with an unsaturated cyclic hydrocarbon compound having two or more carbon-carbon double bonding in the presence of an acid catalyst; and processing a resulting reaction product by a hydrotalcite compound represented by the formula (II)M.sub.1-x.sup.2+ M.sub.x.sup.3+ (OH).sub.2+x-ny A.sub.y.sup.n-.m(H.sub.2 O)(II)where M.sup.2+ is a divalent, magnesium ion, a divalent zinc ion, a divalent calcium ion, a divalent nickel ion, a divalent cobalt ion, a divalent manganese ion or a divalent copper ion, M.sup.3+ is a trivalent aluminum ion, a trivalent iron ion or a trivalent chromium ion, A.sup.n- is HCO.sub.3.sup.-, CO.sub.3.sup.2- or OH.sup.-, and x, y and m each are 0.Type: GrantFiled: January 28, 1993Date of Patent: August 9, 1994Assignee: Nippon Oil Co., Ltd.Inventors: Fumiaki Oshimi, Susumu Kubota, Masami Enomoto, Yutaka Otsuki
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Patent number: 4639503Abstract: A thermosetting resin composition having an improved crack resistance comprising 100 weight parts of a curable epoxy resin and 30 to 300 weight parts of a phenol compound-added conjugated diolefin polymer, which is prepared in the presence of aluminum phenoxide as the catalyst. The composition is suitable for resin encapsulation of electronic components.Type: GrantFiled: November 15, 1985Date of Patent: January 27, 1987Assignee: Nippon Oil Co., Ltd.Inventors: Hajime Hara, Shingo Orii, Kazuho Aoyama, Masami Enomoto
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Patent number: D750736Type: GrantFiled: December 30, 2014Date of Patent: March 1, 2016Assignee: Nok CorporationInventor: Masami Enomoto
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Patent number: D752177Type: GrantFiled: December 30, 2014Date of Patent: March 22, 2016Assignee: Nok CorporationInventors: Masami Enomoto, Yusuke Takeuchi