Abstract: A temperature sensor is provided that includes a pair of lead frames; a sensor portion connected to the pair of lead frames; and an insulating holding portion fixed to the pair of lead frames for holding the same. The sensor portion includes an insulating film, a thin film thermistor portion patterned on a surface of the insulating film, a pair of comb shaped electrodes having a plurality of comb portions on the thin film thermistor portion and being patterned, and a pair of pattern electrodes patterned on the surface of the insulating film with one end thereof being connected to the pair of comb shaped electrodes and the other end thereof being connected to the pair of lead frames. The lead frame has a main lead portion and a base-end-side bonding portion. Only one of the pair of lead frames has a front-end-side bonding portion.

Abstract: An insulating glass layer covers the surface of a thermistor element except at the two end surfaces. The insulating glass layer is partially or fully composed of crystallized glass. A terminal electrode is integrally formed on both end surfaces. The terminal electrodes include a baked-on electrode layer formed from a conductive paste. Layers of nickel and tin or lead/tin are plated onto the baked-on electrode. The insulating glass layer enhances shape-maintainability of the insulating glass layer and the baked-on electrodes, provides a smoother glass surface, resulting in a more aesthetically pleasing thermistor, prevents resistance variance due to plating of the baked-on electrodes and provides a strong anti-breaking strength thermistor. The coefficient of thermal expansion of the glass layer is less than the coefficient of thermal expansion of the thermistor element. This difference in coefficients of thermal expansion tends to help the thermistor element resist stress breakage.

Abstract: A microwave oven has only a microwave sensor or both microwave sensor and temperature sensor. The microwave sensor has a wave absorber to generate heat through absorption of microwave energy and a thermistor to detect temperature of this wave absorber. The temperature sensor has a thermistor to detect the ambient temperature around the wave absorber. A controller determines a value of microwave power on the basis of the output of the microwave sensor or each output of the microwave sensor and temperature sensor. The microwave oven can accurately detect microwave power without being influenced by variation of ambient temperature around the microwave sensor.

Abstract: A chip-type ceramic element contains a terminal electrode at each end and an inorganic insulating layer on the surface of the ceramic element between the electrodes. The terminal electrodes include a baked electrode formed from a conductive paste reacted with the material of the inorganic insulating layer. Layers of nickel and tin are plated on the baked electrode for improved heat resistance and soldering adhesion, respectively. The insulating layer prevents unwanted portions of the terminal electrodes from coming into contact with the ceramic element, thereby preventing dispersion in the resistance values of the element.

Abstract: This invention relates to an apparatus for shielding electromagnetic radiation which includes a casing made primarily of electromagnetic shielding material and an electromagnetic wave suppressor member having high permeability and/or permittivity. A method for using this apparatus also is described. The suppressor member has a high dielectric loss and/or high magnetic loss at a location close to the place in the casing where electromagnetic waves are less shielded, thereby reducing leakage of undesirable electromagnetic waves from the casing.

Abstract: There is provided a monolithic structure of an LC circuit incorporated component comprising at least one capacitor formed from internal electrodes in layered form in a ceramic monolithic structure, at least one inductor formed from internal conductive structure in coil form in said monolithic structure, internal connecting leads for connecting said capacitor(s) and inductor(s) to form said circuit, formed in said structure, and terminals for the circuit, formed at the surface(s) of the component.