Abstract: An abnormality determination method for a wind power generation device includes: a measurement step (step S1) of measuring sound emitted by the wind power generation device and recording acoustic data; an analysis step (step S2) of performing a spectrogram analysis on the acoustic data recorded in the measurement step, on a frequency axis and in a temporal axis space as a temporal change in a frequency characteristic by using the short-time Fourier transform or the wavelet transform; a detection step (step S3) of detecting, from the analysis result in the analysis step, a signal component emitted from an abnormal portion of the wind power generation device in a time corresponding to rotation of the wind power generation device; and a determination step (step S5) of determining that the wind power generation device is abnormal when the signal component detected in the detection step is greater than or equal to a certain threshold value.

Abstract: A method for fabricating a semiconductor device includes: the step (a) of forming a vibrating film on a predetermined region of each of a plurality of chips included in a semiconductor wafer; the step (b) of forming, on the semiconductor wafer, an intermediate film containing a sacrifice layer located on the vibrating film of each of the chips; and the step (c) of forming a fixed film on the intermediate film. This method further includes, after the step (c), the step (d) of subjecting the semiconductor wafer to blade dicing to separate the chips, and the step (e) of removing, by etching, the sacrifice layer to provide a cavity between the vibrating film and the fixed film.

Abstract: A method for fabricating a semiconductor device includes: the step (a) of forming a vibrating film on a predetermined region of each of a plurality of chips included in a semiconductor wafer; the step (b) of forming, on the semiconductor wafer, an intermediate film containing a sacrifice layer located on the vibrating film of each of the chips; and the step (c) of forming a fixed film on the intermediate film. This method further includes, after the step (c), the step (d) of subjecting the semiconductor wafer to blade dicing to separate the chips, and the step (e) of removing, by etching, the sacrifice layer to provide a cavity between the vibrating film and the fixed film.

Abstract: A motion reduction apparatus has an orthorhombic shaped floating main body (11), a plumb plate supported vertically on one side section of the floating main body by stay members (13), and flow sections (15) for flooding with incoming water are provided between the floating main body and the plumb plate in such a way that an upper end section of the plumb plate is at about the same height as the bottom surface of the floating main body.

Abstract: A method for fabricating a semiconductor device includes: the step (a) of forming a vibrating film on a predetermined region of each of a plurality of chips included in a semiconductor wafer; the step (b) of forming, on the semiconductor wafer, an intermediate film containing a sacrifice layer located on the vibrating film of each of the chips; and the step (c) of forming a fixed film on the intermediate film. This method further includes, after the step (c), the step (d) of subjecting the semiconductor wafer to blade dicing to separate the chips, and the step (e) of removing, by etching, the sacrifice layer to provide a cavity between the vibrating film and the fixed film.

Abstract: A plurality of semiconductor elements and division regions are provided on a semiconductor subsubstrate. A modification region is provided in the semiconductor substrate. A division guide pattern is provided at least in a portion of each division region. A cleavage produced from a starting point corresponding to the modification region is guided by the division guide pattern.

Abstract: A method for fabricating a semiconductor device includes: the step (a) of forming a vibrating film on a predetermined region of each of a plurality of chips included in a semiconductor wafer; the step (b) of forming, on the semiconductor wafer, an intermediate film containing a sacrifice layer located on the vibrating film of each of the chips; and the step (c) of forming a fixed film on the intermediate film. This method further includes, after the step (c), the step (d) of subjecting the semiconductor wafer 101 to blade dicing to separate the chips, and the step (e) of removing, by etching, the sacrifice layer to provide a cavity between the vibrating film and the fixed film.

Abstract: A plurality of semiconductor elements and division regions are provided on a semiconductor substrate. A modification region is provided in the semiconductor substrate. A division guide pattern is provided at least in a portion of each division region. A cleavage produced from a starting point corresponding to the modification region is guided by the division guide pattern.

Abstract: A motion reduced floating structure includes a main hull structure and a wave damping structure connected with the main hull structure. The wave damping structure may include a back board, a lower horizontal board and vertical members. The back board is connected with the main hull structure, and the lower horizontal board is connected with a lower portion of the back board to extend in a horizontal direction and is under a seawater surface in case of mooring. The vertical members are connected with the lower horizontal board and the back board. A vertical direction hole is provided for the lower horizontal board.

Abstract: The motion reduction apparatus improves the safety of operation of a floating body floating on water by reliably reducing motion of the floating body, and has an orthorhombic shaped floating main body (11), a plumb plate supported vertically on one side section of the floating main body by means of stay members (13), and flow sections (15) for flooding with incoming water are provided between the floating main body and the plumb plate in such a way that an upper end section of the plumb plate is at about the same height as the bottom surface of the floating main body.

Abstract: The motion reducing apparatus has an orthorhombic shaped floating main body, a horizontal plumb plate supported horizontally on one side section of the floating main body by stay members, and flow sections for flooding with incoming water are provided between the floating main body and the horizontal plate in such a way that the horizontal plate is at about the same height as the bottom surface of the floating main body.

Abstract: The motion reduction apparatus improves the safety of operation of a floating body floating on water by reliably reducing motion of the floating body, and has an orthorhombic shaped floating main body (11), a plumb plate supported vertically on one side section of the floating main body by means of stay members (13), and flow sections (15) for flooding with incoming water are provided between the floating main body and the plumb plate in such a way that an upper end section of the plumb plate is at about the same height as the bottom surface of the floating main body.

Abstract: A motion reduced floating structure includes a main hull structure and a wave damping structure connected with the main hull structure. The wave damping structure may include a back board, a lower horizontal board and vertical members. The back board is connected with the main hull structure, and the lower horizontal board is connected with a lower portion of the back board to extend in a horizontal direction and is under a seawater surface in case of mooring. The vertical members are connected with the lower horizontal board and the back board. A vertical direction hole is provided for the lower horizontal board.

Abstract: An image forming apparatus with a charging member that allows easy removal of smears from an image forming drum. The apparatus removes smears from the image forming drum by placing a different portion of the charging member in contact with the drum. The apparatus uses a cam or a solenoid to press on the charging member to cause a different portion of the charging member to come into contact with the image forming drum.

Abstract: Applied voltage to the contact charging sheet 71 has been controlled in the following various ways: a) the voltage at the photosensitive layer 10 at a point of time whereat it has passed the contact charging sheet 71 is caused to interlock with grid voltage so as not to exceed predetermined voltage to be electrified by the Scorotron charger 2; b) the applied voltage is caused to interlock with the output from the transfer unit 5 so that there is no portion which reaches the Scorotron charger 2 while the potential polarity has been reversed at the transfer unit 5; c) reduction in the film thickness of the photosensitive layer 10 is corrected in consideration of the cumulative number of sheets for image formation; d) the size of printing sheet is added; e) at the time of termination, a portion of the photosensitive layer 10, into which current has flowed at the transfer unit 5, is caused to stop always after passing the contact charging sheet 71; f) the contact charging sheet 71 is cleaned by means of AC compon

Abstract: In a microfilm reader printer, a photosensitive member which can be charged to be positive and negative. The photosensitive member is charged to be positive in a reverse development mode and charged to be negative in a normal development mode. In the reverse development mode at least right before the reverse development mode is switched to the normal development mode, not only a charge area but also a non-charge area are irradiated by a main eraser. On the other hand, in the normal development mode at least right before the normal development mode is switched to the reverse development mode, only a charge area is irradiated by the main eraser.

Abstract: A developing device comprising: a drive roller which is driven so as to be rotated; a developing sleeve which is formed by a thin film and has a peripheral length slightly larger than that of the drive roller so as to be fitted around the drive roller; a press member which presses the developing sleeve against the drive roller at one side of the drive roller so as to form a sag portion of the developing sleeve such that the sag portion is brought into contact with an electrostatic latent image support member; and an electric field forming member for forming alternating electric field such that an attractive force capable of bringing the developing sleeve and the electrostatic latent image support member into contact with each other is applied between the developing sleeve and the electrostatic latent image support member.

Abstract: An optical ferrule including a non-metallic sleeve 11 formed with a through bore having a small bore portion 14 and a large bore portion 1. A bare fiber 13 and a coating 15 of an optical fiber 12 are adhesively fixed in the small bore portion and the large bore portion, respectively. The large bore portion 16 has at least one groove 17 formed in the inner surface thereof, the optical fiber has a rough surface portion 20 formed in the coating in at least a portion opposing to the groove, a glass tube 18 is inserted in the large bore portion between the small bore portion and the end face of the coating of the optical fiber and has an outer diameter larger than the inner diameter of the small bore portion and an inner diameter adapted for insertion of the bare fiber, and an adhesive 21 is filled between the components including the inner surface of the sleeve. The optical ferrule has superior reliability, durability and stability.

Abstract: An optical unit as used for an optical sensor, including a substrate, one or more optical elements fixedly supported by the substrate, and an protecting arrangement associated with the substrate and at least one of the optical elements, for protecting each associated optical element from thermal stresses exerted thereto due to a difference in thermal expansion coefficient between the substrate and the associated optical element. The protecting arrangement may consist of at least one intermediate body interposed between the substrate and the associated optical element. Each intermediate body has a thermal expansion coefficient close to that of the associated optical element.

Abstract: An optical device including an optical bench and a plurality of optical elements. The optical bench has first and second supporting sections, separated from each other, each having at least two supporting surfaces. The optical elements secured to the first and second supporting sections have cylindrical bodies, so that these optical elements contact the sections only by lines. Therefore, the relative positions of each optical elements in the optical device are maintained for a long time without being affected by temperature variation in the atmosphere surrounding the optical device.