Patents by Inventor Masami Tsurumi

Masami Tsurumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting a device to a mounting substrate
    Patent number: 6612024
    Abstract: A semiconductor device with bump electrodes having acutely shaped tips and method of mounting same. The bump electrodes are brought into contact with respective portions of a conductive pattern of a mounting substrate without any foreign matter between the tips of the bump electrodes and the respective portions of the conductive pattern. Thereafter, sealing material is allowed to surround the bump electrodes.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: September 2, 2003
    Assignee: Sony Corporation
    Inventors: Dai Sasaki, Tohru Terasaki, Masuo Kato, Masami Tsurumi
  • Mounting structure of a semiconductor device, and a process for mounting a semiconductor device on a mounting substrate
    Publication number: 20020074163
    Abstract: An acute tip is formed on each top of bump electrodes of a semiconductor device to be mounted on a printed circuit board by facedown bonding. Each acute tip is then applied a leveling process as to form a small flat surface on its top. After that, each of the bump electrode is depressed gradually with heat for transforming the bump electrode against a conductor pattern of the printed circuit board for mounting . Resultantly, the semiconductor device is mounted on the printed circuit board firmly and without including foreign body between the bump electrode of the semiconductor device and the conductor pattern of the printed circuit board.
    Type: Application
    Filed: August 3, 2001
    Publication date: June 20, 2002
    Inventors: Dai Sasaki, Tohru Terasaki, Masuo Kato, Masami Tsurumi