Patents by Inventor Masami TSUTAE

Masami TSUTAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8557035
    Abstract: Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: October 15, 2013
    Assignee: Mec Company
    Inventors: Yoichi Sengoku, Masami Tsutae, Kiyoto Tai, Keisuke Joko, Tsuyoshi Amatani
  • Publication number: 20120260821
    Abstract: Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: MEC COMPANY LTD.
    Inventors: Yoichi SENGOKU, Masami TSUTAE, Kiyoto TAI, Keisuke JOKO, Tsuyoshi AMATANI
  • Publication number: 20100108531
    Abstract: The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 6, 2010
    Applicant: MEC COMPANY LTD.
    Inventors: Mutsuyuki KAWAGUCHI, Tsuyoshi AMATANI, Yuko FUJII, Masami TSUTAE