Patents by Inventor Masamoto Kawaguchi

Masamoto Kawaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing the same
    Patent number: 9236276
    Abstract: In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: January 12, 2016
    Assignee: DENSO CORPORATION
    Inventors: Koji Hashimoto, Masamoto Kawaguchi, Masahiro Honda, Takashige Saito
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140315356
    Abstract: In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip.
    Type: Application
    Filed: November 16, 2012
    Publication date: October 23, 2014
    Inventors: Koji Hashimoto, Masamoto Kawaguchi, Masahiro Honda, Takashige Saito
  • Antitheft system for vehicle
    Patent number: 7646287
    Abstract: An antitheft apparatus for a vehicle has an inertia sensor, which is also used for an anti-lock braking system. An electronic control unit receives output signals from the inertia sensor and determines a possible vehicle theft when a detected vehicle condition (for example, vehicle acceleration) is larger than a threshold value.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: January 12, 2010
    Assignee: DENSO CORPORATION
    Inventors: Michitaka Hayashi, Masamoto Kawaguchi, Kenji Hirano
  • Antitheft system for vehicle
    Publication number: 20070103279
    Abstract: An antitheft apparatus for a vehicle has an inertia sensor, which is also used for an anti-lock braking system. An electronic control unit receives output signals from the inertia sensor and determines a possible vehicle theft when a detected vehicle condition (for example, vehicle acceleration) is larger than a threshold value.
    Type: Application
    Filed: October 24, 2006
    Publication date: May 10, 2007
    Applicant: DENSO CORPORATION
    Inventors: Michitaka Hayashi, Masamoto Kawaguchi, Kenji Hirano