Patents by Inventor Masanao Fujii
Masanao Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7111390Abstract: An apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.Type: GrantFiled: March 19, 2004Date of Patent: September 26, 2006Assignee: Fujitsu LimitedInventors: Koichi Shimamura, Kazuhisa Mishima, Toshiaki Otsuka, Toru Okada, Masanao Fujii
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Publication number: 20060169750Abstract: There are provided a solder ball deforming step of mechanically deforming a ball to break an oxide film of a surface thereof and to expose a nonoxide surface and a solder melting step of heating and melting the deformed solder ball through energy irradiation in a state where the deformed solder ball is mounted on joint units of a loaded work. The solder ball deforming step mechanically deforms the solder ball to form at least two orthogonal contact surfaces in contact with the joint surfaces of the joint units.Type: ApplicationFiled: May 31, 2005Publication date: August 3, 2006Applicant: FUJITSU LIMITEDInventors: Hisao Tanaka, Masanao Fujii, Toru Okada, Susumu Iida, Hirokazu Yamanishi, Yutaka Noda
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Patent number: 6903876Abstract: A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.Type: GrantFiled: December 4, 2002Date of Patent: June 7, 2005Assignee: Fujitsu LimitedInventors: Toru Okada, Masanao Fujii, Seiichi Shimoura, Shingo Yamaguchi, Haruyasu Watanabe
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Publication number: 20050104477Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.Type: ApplicationFiled: December 7, 2004Publication date: May 19, 2005Inventors: Masanao Fujii, Toru Okada, Masayuki Kitajima, Hidehiko Kobayashi, Seiichi Shimoura
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Publication number: 20050034960Abstract: The present invention provides an apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.Type: ApplicationFiled: March 19, 2004Publication date: February 17, 2005Applicant: FUJITSU LIMITEDInventors: Koichi Shimamura, Kazuhisa Mishima, Toshiaki Otsuka, Toru Okada, Masanao Fujii
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Publication number: 20050038537Abstract: The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.Type: ApplicationFiled: March 23, 2004Publication date: February 17, 2005Applicant: Fujitsu LimitedInventors: Toru Okada, Masanao Fujii, Takatoyo Yamakami, Kazuhisa Mishima, Toshiaki Otsuka
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Patent number: 6848154Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.Type: GrantFiled: June 12, 2003Date of Patent: February 1, 2005Assignee: Fujitsu LimitedInventors: Masanao Fujii, Toru Okada, Masayuki Kitajima, Hidehiko Kobayashi, Seiichi Shimoura
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Patent number: 6744183Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.Type: GrantFiled: January 21, 2003Date of Patent: June 1, 2004Assignee: Fujitsu LimitedInventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayashi, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
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Patent number: 6653761Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above.Type: GrantFiled: March 30, 2001Date of Patent: November 25, 2003Assignee: Fujitsu LimitedInventors: Masanao Fujii, Toru Okada, Masayuki Kitajima, Hidehiko Kobayashi, Seiichi Shimoura
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Publication number: 20030184191Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head, to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above.Type: ApplicationFiled: June 12, 2003Publication date: October 2, 2003Applicant: Fujitsu LimitedInventors: Masanao Fujii, Toru Okada, Masayuki Kitajima, Hidehiko Kobayashi, Seiichi Shimoura
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Publication number: 20030173411Abstract: A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.Type: ApplicationFiled: July 19, 2002Publication date: September 18, 2003Applicant: FUJITSU LIMITEDInventors: Masanao Fujii, Toru Okada, Hidehiko Kobayashi, Seiichi Shimoura
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Publication number: 20030137223Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.Type: ApplicationFiled: January 21, 2003Publication date: July 24, 2003Applicant: Fujitsu LimitedInventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayashi, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
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Publication number: 20030103169Abstract: A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.Type: ApplicationFiled: December 4, 2002Publication date: June 5, 2003Applicant: FUJITSU LIMITEDInventors: Toru Okada, Masanao Fujii, Seiichi Shimoura, Shingo Yamaguchi, Haruyasu Watanabe
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Patent number: 6541898Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.Type: GrantFiled: March 30, 2001Date of Patent: April 1, 2003Assignee: Fujitsu LimitedInventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayashi, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
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Patent number: 6467141Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing.Type: GrantFiled: March 29, 2001Date of Patent: October 22, 2002Assignee: Fujitsu LimitedInventors: Toru Okada, Kenji Iketaki, Hidehiko Kobayashi, Yutaka Noda, Masayuki Kitajima, Seiichi Shimoura, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka, Masanao Fujii
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Publication number: 20020074902Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.Type: ApplicationFiled: March 30, 2001Publication date: June 20, 2002Applicant: FUJITSU LIMITEDInventors: Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki, Hidehiko Kobayaski, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka
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Publication number: 20020059717Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing.Type: ApplicationFiled: March 29, 2001Publication date: May 23, 2002Applicant: FUJITSU LIMITEDInventors: Toru Okada, Kenji Iketaki, Hidehiko Kobayashi, Yutaka Noda, Masayuki Kitajima, Seiichi Shimoura, Masakazu Takesue, Keiichi Yamamoto, Hisao Tanaka, Masanao Fujii
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Publication number: 20020050767Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above.Type: ApplicationFiled: March 30, 2001Publication date: May 2, 2002Applicant: FUJITSU LIMITEDInventors: Masanao Fujii, Toru Okada, Masayuki Kitajima, Hidehiko Kobayashi, Seiichi Shimoura