Patents by Inventor Masanao Watanabe
Masanao Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200281814Abstract: A main object of the present disclosure is to provide a drug storage container enabling simple and reliable preparation of a mixed solution containing a drug and an auxiliary agent, a closing member that is for use in the drug storage container and configured to detachably retain a solid preparation containing a drug or an auxiliary agent, a method for manufacture of the drug storage container, a microbial contaminant test method using the drug storage container, and a solid preparation for preparing a buffer solution.Type: ApplicationFiled: October 1, 2018Publication date: September 10, 2020Applicant: SEIKAGAKU CORPORATIONInventors: Masanao WATANABE, Makoto ISHII, Toshio ODA, Hikaru MIZUMURA
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Patent number: 9222909Abstract: A biosensor according to the present invention includes a first base material having an insulating surface; an adhesive layer located on the insulating surface of the first base material; and an electrode system and wiring sections fixed to the first base material via the adhesive layer. The electrode system includes top electrode layers and bottom electrode layers, and the bottom electrode layers are formed of a material having a higher conductivity than that of the top electrode layers; the electrode system includes a working electrode and a counter electrode, and also includes an enzyme reaction section located on the working electrode, the enzyme reaction section containing an enzyme and an electron acceptor; and the bottom electrode layers and the wiring sections are integral with each other.Type: GrantFiled: March 12, 2013Date of Patent: December 29, 2015Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Masanao Watanabe, Kenichi Ito, Makoto Ishii, Hiroshi Yoshida, Toshiaki Baba
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Patent number: 8916189Abstract: This invention is intended to provide cell aggregates that can reproduce functions of the myocardium, such as the function of beating, and thus are available for myocardial regenerative therapy, and to provide a cell culture support for producing the same. According to this invention, a cell culture support for forming string-shaped cardiomyocyte aggregates, which has a substrate portion having one surface on which at least one linear cell-adherent region is formed is provided.Type: GrantFiled: May 16, 2008Date of Patent: December 23, 2014Assignees: Dai Nippon Printing Co., Ltd., Tokyo Women's Medical UniversityInventors: Masanao Watanabe, Teruo Okano, Masayuki Yamato, Tatsuya Shimizu, Yoshikatsu Akiyama
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Patent number: 8809053Abstract: Methods and reagents are described for myocardial regenerative therapy using cardiomyocytes that are cultured ex vivo to have a controlled orientation of beating. This is achieved by growing the cardiomyocytes on a culture support that is coated with a polymerizable liquid crystal which is oriented so as to be in a liquid crystal phase state prior to curing with ionizing radiation or ultraviolet rays.Type: GrantFiled: August 6, 2008Date of Patent: August 19, 2014Assignees: Dai Nippon Printing Co., Ltd., Tokyo Women's Medical UniversityInventors: Masanao Watanabe, Teruo Okano, Masayuki Yamato, Tatsuya Shimizu, Yoshikatsu Akiyama
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Patent number: 8557583Abstract: An object of the present invention is to provide a cell culture support making the detachment of a cell sheet easy as well as enabling the formation of a uniform cell sheet.Type: GrantFiled: March 11, 2008Date of Patent: October 15, 2013Assignees: Dai Nippon Printing Co., Ltd., Tokyo Woman's Medical University, Cellseed Inc.Inventors: Masanao Watanabe, Kenichi Hagiwara, Teruo Okano, Masayuki Yamato, Tatsuya Shimizu, Yoshikatsu Akiyama, Hiroya Watanabe, Keisuke Ashiba
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Publication number: 20100113338Abstract: Disclosed is a novel composition for the treatment of a corneal/conjunctival disease. A prophylactic or therapeutic agent for a corneal/conjunctival disease comprising selenoprotein P as an active ingredient, more specifically a prophylactic or therapeutic agent for a corneal/conjunctival disease such as dry eye, keratoconjunctivitis sicca, superficial punctate keratopathy, corneal erosion or corneal ulcer comprising selenoprotein P as an active ingredient, particularly a prophylactic or therapeutic agent for a corneal/conjuncrtival disease such as dry eye, keratoconjunctivitis sicca, superficial punctate keratopathy, corneal erosion or corneal ulcer accompanied by a corneal/conjunctival epithelial discorder.Type: ApplicationFiled: June 21, 2006Publication date: May 6, 2010Applicants: KOWA COMPANY, LTD., Juridical Foundation The Chemo-Sero-Therapeutic Research InstituteInventors: Masanao Watanabe, Kazuo Tsubota, Masaki Hirashima, Chikateru Nozaki
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Publication number: 20090098651Abstract: It is an objective of this invention to provide a cardiomyocyte culture support used for obtaining cardiomyocytes having a controlled orientation of beating that are thus available for myocardial regenerative therapy, and to provide a method for producing the same. The present invention provides a cardiomyocyte culture support having a cured polymerizable liquid crystal layer having a molecular oriented surface.Type: ApplicationFiled: August 6, 2008Publication date: April 16, 2009Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Masanao WATANABE
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Publication number: 20080293139Abstract: This invention is intended to provide cell aggregates that can reproduce functions of the myocardium, such as the function of beating, and thus are available for myocardial regenerative therapy, and to provide a cell culture support for producing the same. According to this invention, a cell culture support for forming string-shaped cardiomyocyte aggregates, which has a substrate portion having one surface on which at least one linear cell-adherent region is formed is provided.Type: ApplicationFiled: May 16, 2008Publication date: November 27, 2008Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Masanao WATANABE
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Publication number: 20080227203Abstract: An object of the present invention is to provide a cell culture support making the detachment of a cell sheet easy as well as enabling the formation of a uniform cell sheet.Type: ApplicationFiled: March 11, 2008Publication date: September 18, 2008Applicant: Dai Nippon Printing Co., Ltd.Inventors: Masanao WATANABE, Kenichi Hagiwara
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Publication number: 20080009063Abstract: An object of the present invention is to provide a cell culture substrate capable of quickly forming a cell sheet and easily removing the cell sheet after formed. The present invention relates to a cell culture substrate for forming a cell sheet by culturing cells, comprising a plurality of projections each having a top face and depressions formed between the projections, in which the depressions each have an opening whose dimensions are too small for a cell to be cultured to enter and the cell sheet is removable. The present invention further relates to a method of preparing a cell sheet using the substrate and a cell sheet prepared by the method.Type: ApplicationFiled: July 3, 2007Publication date: January 10, 2008Applicants: DAI NIPPON PRINTING CO., LTD.Inventors: Teruo Okano, Masayuki Yamato, Yoshikatsu Akiyama, Masanao Watanabe, Hiroyuki Naganuma, Masami Nara
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Patent number: 7213334Abstract: A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to form a polyimide insulating layer.Type: GrantFiled: December 16, 2003Date of Patent: May 8, 2007Assignees: Sony Corporation, Sony Chemical & Information Device CorporationInventors: Hideyuki Kurita, Masanao Watanabe
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Patent number: 7018844Abstract: A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.Type: GrantFiled: June 1, 2004Date of Patent: March 28, 2006Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroshi Yagi, Masanao Watanabe, Takeshi Sekiguchi, Chikao Ikenaga, Makoto Nakamura
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Patent number: 6991148Abstract: The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The resin film is adapted to form an opening when the bump is forced into the resin film and an ultrasonic wave is applied to the bump. The bump is left in the opening to electrically connect the top of the bump to the first wiring layer.Type: GrantFiled: April 28, 2003Date of Patent: January 31, 2006Assignees: Sony Corporation, Sony Chemicals Corp.Inventors: Hideyuki Kurita, Masanao Watanabe, Masayuki Nakamura, Mitsuhiro Fukuda, Hiroyuki Usui
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Patent number: 6926187Abstract: The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.Type: GrantFiled: April 28, 2003Date of Patent: August 9, 2005Assignee: Sony Chemicals Corp.Inventors: Hideyuki Kurita, Masanao Watanabe, Masayuki Nakamura, Mitsuhiro Fukuda, Hiroyuki Usui
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Publication number: 20050028358Abstract: The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.Type: ApplicationFiled: April 28, 2003Publication date: February 10, 2005Inventors: Hideyuki Kurita, Masanao Watanabe, Masayuki Nakamura, Mitsuhiro Fukuda, Hiroyuki Usui
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Patent number: 6840430Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.Type: GrantFiled: June 10, 2003Date of Patent: January 11, 2005Assignee: Sony Chemicals, Corp.Inventors: Hideyuki Kurita, Masanao Watanabe, Toshihiro Shinohara, Mitsuhiro Fukuda, Yukio Anzai
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Publication number: 20040219714Abstract: A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.Type: ApplicationFiled: June 1, 2004Publication date: November 4, 2004Applicant: Dai Nippon Printing Co., Ltd.Inventors: Hiroshi Yagi, Masanao Watanabe, Takeshi Sekiguchi, Chikao Ikenaga, Makoto Nakamura
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Patent number: 6774470Abstract: A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.Type: GrantFiled: December 24, 2002Date of Patent: August 10, 2004Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroshi Yagi, Masanao Watanabe, Takeshi Sekiguchi, Chikao Ikenaga, Makoto Nakamura
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Publication number: 20040131765Abstract: A double-sided flexible printed board is manufactured by the following steps of:Type: ApplicationFiled: December 16, 2003Publication date: July 8, 2004Applicant: Sony Chemicals Corp.Inventors: Hideyuki Kurita, Masanao Watanabe
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Patent number: 6737588Abstract: Against a first resin film formed on a first metal film are pressed bumps on a second metal film so that the bumps are embedded into the first resin film. Either one of the first metal film or the second metal film or both is (are) patterned while the bumps are in contact with the first metal film, and the first resin film is heat-treated while the top of the first resin film is partially exposed to discharge the solvent or moisture from the exposed zone, and cure the first resin film. After curing, the bumps and the first metal film may be ultrasonically bonded to each other. A second resin film and a third metal film may be further layered to form a multilayer structure.Type: GrantFiled: August 18, 2000Date of Patent: May 18, 2004Assignee: Sony Chemicals CorporationInventors: Hideyuki Kurita, Masanao Watanabe