Patents by Inventor Masanobu Hidaka
Masanobu Hidaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8655128Abstract: For an enhanced coupling efficiency between a light source and an optical fiber bundle: the optical fiber bundle is made up by a dense bundle of optical fibers, with an integrated portion composed of fusion-integrated distal ends of the bundled optical fibers, and the integrated portion has, in a longitudinal sectional plane along a center axis of the optical fiber bundle, a lateral side thereof formed, in a shape of arc radially outwardly convex with respect to a straight line interconnecting an end point at a front end face side of the integrated portion and an end point at a rear end side thereof, to locate at a radially inner side with respect to an extension toward the integrated portion of a line constituting an outline of a portion else than the integrated portion of the optical fiber bundle.Type: GrantFiled: March 21, 2008Date of Patent: February 18, 2014Assignee: Fujikura Ltd.Inventors: Takeshi Segi, Keiji Kaneda, Tomonori Yokota, Masanobu Hidaka
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Publication number: 20130317690Abstract: A vehicle battery diagnosis apparatus is provided that diagnoses a history of a usage state of a secondary battery of a vehicle and that presents a suppression measure against battery degradation. The vehicle battery diagnosis apparatus includes a storage unit and a diagnosis unit. The storage unit stores an alternative suppression measure for a factor responsible for degradation of the secondary battery. The diagnosis unit prohibits presentation of the alternative suppression measure as a suppression measure upon determining the alternative suppression measure fails to satisfy a prescribed presentation criterion.Type: ApplicationFiled: October 17, 2011Publication date: November 28, 2013Applicant: NISSAN MOTOR CO., LTD.Inventors: Takeshi Fujita, Hideaki Hirose, Masanobu Hidaka, Hironao Goto, Toshimine Sakurai, Takashi Shimayama
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Publication number: 20100176311Abstract: For an enhanced coupling efficiency between a light source and an optical fiber bundle: the optical fiber bundle is made up by a dense bundle of optical fibers, with an integrated portion composed of fusion-integrated distal ends of the bundled optical fibers, and the integrated portion has, in a longitudinal sectional plane along a center axis of the optical fiber bundle, a lateral side thereof formed, in a shape of arc radially outwardly convex with respect to a straight line interconnecting an end point at a front end face side of the integrated portion and an end point at a rear end side thereof, to locate at a radially inner side with respect to an extension toward the integrated portion of a line constituting an outline of a portion else than the integrated portion of the optical fiber bundle.Type: ApplicationFiled: March 21, 2008Publication date: July 15, 2010Applicants: FUJIKURA LTD, TOYO TOKAI ALUMINUM HANBAI K.K.Inventors: Takeshi Segi, Keiji Kaneda, Tomonori Yokota, Masanobu Hidaka
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Patent number: 6766811Abstract: An aqueous solution containing sulfuric acid and hydrogen peroxide is used for a soft etchant in a soft etching step in a smear removing process performed prior to a catalyst applying process for chemical copper plating after formation of via holes through an insulating layer of a multi-layer substrate by irradiation of laser. The concentration of sulfuric acid is 2.4 times or less than the concentration of hydrogen peroxide. Preferably, the concentration of sulfuric acid is in a range of 9 to 90 g/l, and the concentration of sulfuric acid is lower than the concentration of hydrogen peroxide. More preferably, the concentration of sulfuric acid is in a range of 9 to 18 g/l, and the concentration of hydrogen peroxide is in a range of 33 to 38.5 g/l. As a result, smear can be certainly removed without excessively etching a conductive layer in the smear removing process.Type: GrantFiled: August 7, 2002Date of Patent: July 27, 2004Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Toshihisa Shimo, Kyoko Kumagai, Toshiki Inoue, Yoshifumi Kato, Takashi Yoshida, Masanobu Hidaka
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Publication number: 20030102223Abstract: A copper plating method for a via hole formed on a multi-layer substrate is provided. The via hole interconnects conductive layers of the multi-layer substrate. The method includes performing chemical copper plating on an inner wall of the via hole and performing electrolytic copper plating on the inner wall of the via hole, on which the chemical copper plating has been performed. The electrolytic copper plating includes a first stage and second stage. The first stage is performed with a current density equal to or less than 1.5 A/dm2 to deposit copper film having a thickness of 1 &mgr;m or more. The second stage is performed at a current density higher than that in the first stage.Type: ApplicationFiled: August 7, 2002Publication date: June 5, 2003Inventors: Toshihisa Shimo, Toshiki Inoue, Kyoko Kumagai, Yoshifumi Kato, Takashi Yoshida, Masanobu Hidaka
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Publication number: 20030036269Abstract: An aqueous solution containing sulfuric acid and hydrogen peroxide is used for a soft etchant in a soft etching step in a smear removing process performed prior to a catalyst applying process for chemical copper plating after formation of via holes through an insulating layer of a multi-layer substrate by irradiation of laser. The concentration of sulfuric acid is 1.4 times or less higher than the concentration of hydrogen peroxide. Preferably, the concentration of sulfuric acid is in a range of 5 to 50 g/l, and the concentration of sulfuric acid is lower than the concentration of hydrogen peroxide. More preferably, the concentration of sulfuric acid is in a range of 5 to 10 g/l, and the concentration of hydrogen peroxide is in a range of 30 to 35 g/l. As a result, smear can be certainly removed without excessively etching a conductive layer in the smear removing process.Type: ApplicationFiled: August 7, 2002Publication date: February 20, 2003Inventors: Toshihisa Shimo, Kyoko Kumagai, Toshiki Inoue, Yoshifumi Kato, Takashi Yoshida, Masanobu Hidaka
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Patent number: 5686725Abstract: A method for reading of information, which comprises printing information on a metal substrate or a substrate capable of transmitting infrared rays of 2-10 .mu.m wavelength, with a marking ink containing tin oxide, indium-tin mixed oxide or a mixture of tin oxide or indium-tin mixed oxide and at least one compound selected from the group consisting of alumina, barium sulfate, silicon dioxide and calcium carbonate, as necessary coating a clear coating or a coloring ink on at least the information-printed area of the substrate, and identifying the information by the use of a CCD camera sensitive to infrared rays of 2-10 .mu.m wavelength or an infrared detector. No noise is generated even when the reflectance of a light from the substrate surface is large, and the information can be identified (read) easily.Type: GrantFiled: June 6, 1995Date of Patent: November 11, 1997Assignees: Kansai Paint Co., Ltd., Fujikura Ltd., Matsuo Sangyo Co., Ltd.Inventors: Tsutomu Maruyama, Atsushi Akiyama, Hiroyasu Matsuki, Kazuo Sanada, Sadao Chigira, Masanobu Hidaka
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Patent number: 5547501Abstract: Information is printed on the surface of a substrate with a marking ink containing a mixture of an indium-tin mixed oxide and at least one compound selected from the group consisting of alumina, barium sulfate, silicon dioxide and calcium carbonate, to prepare an invisible marking-printed material; and infrared rays of 2-10 .mu.m wavelength are applied onto the invisible marking-printed material to measure the infrared absorptivities of the invisible marking area and other area of said material and identify the information signified by the invisible marking.Type: GrantFiled: May 5, 1995Date of Patent: August 20, 1996Assignees: Kansai Paint Co., Ltd., Fujikura Ltd., Matsuo Sangyo Co., Ltd.Inventors: Tsutomu Maruyama, Atsushi Akiyama, Kazuo Sanada, Sadao Chigira, Masanobu Hidaka