Abstract: A vibrating device includes a tubular vibrating body and a lens cover coupled to a first surface of the tubular vibrating body. The tubular vibrating body includes a tubular member and piezoelectric vibrators. The lens cover includes a mode changing coupler and a light transmitting body unit disposed in front of a lens of a camera. The mode changing coupler includes a thin portion having a thickness smaller than a thickness of the tubular member.

Abstract: A vibrating device includes a tubular vibrating body and a lens cover coupled to a first surface of the tubular vibrating body. The tubular vibrating body includes a tubular member and piezoelectric vibrators. The lens cover includes a mode changing coupler and a light transmitting body unit disposed in front of a lens of a camera. The mode changing coupler includes a thin portion having a thickness smaller than a thickness of the tubular member.

Abstract: A vibrating device includes a tubular vibrating body and a lens cover coupled to a first surface of the tubular vibrating body. The tubular vibrating body includes a tubular member and piezoelectric vibrators. The lens cover includes a mode changing coupler and a light transmitting body unit disposed in front of a lens of a camera. The mode changing coupler includes a thin portion having a thickness smaller than a thickness of the tubular member.

Abstract: A vibration device includes a vibration body including a light-transmitting portion including first and second main surfaces opposing each other and a vibration portion that is continuous with the light-transmitting portion and vibrates with a main vibration together with the light-transmitting portion, and a piezoelectric vibrator fixed to the vibration portion. Localized vibration portions which generate a localized vibration different from the main vibration are provided at a position not overlapping with a center or approximate center of the light-transmitting portion.

Abstract: A vibration device includes a cylindrical vibration body portion including a cylindrical member and a piezoelectric vibrator fixed to the cylindrical member, and a light-transparent body portion that includes an outer peripheral portion connected to an end surface of the cylindrical member and a light-transparent portion positioned in front of a lens. The light-transparent body portion vibrates in a bending mode by vibration of the cylindrical vibration body portion. The bending mode includes a first bending mode in which a center-maximum-displacement portion of the light-transparent body portion and the outer peripheral portion of the light-transparent body portion connected to the end surface are displaced in the same direction and a second bending mode in which the center-maximum-displacement portion of the light-transparent body portion and the outer peripheral portion of the light-transparent body portion are displaced in opposite directions.

Abstract: A vibration device includes a support body that includes first and second principal surfaces and a through hole penetrating through the support body to open at the first and second principal surfaces, a first vibration element on the side of the first principal surface of the support body, and a second vibration element on the side of the second principal surface of the support body. The first vibration element includes a first vibration body that is translucent. The second vibration element includes a second vibration body and a second piezoelectric vibrator provided on the second vibration body.

Abstract: A vibration device includes a vibration body including a light-transmitting portion including first and second main surfaces opposing each other and a vibration portion that is continuous with the light-transmitting portion and vibrates with a main vibration together with the light-transmitting portion, and a piezoelectric vibrator fixed to the vibration portion. Localized vibration portions which generate a localized vibration different from the main vibration are provided at a position not overlapping with a center or approximate center of the light-transmitting portion.

Abstract: A vibration device that is used in a camera body including a lens includes a cylindrical vibrating body including a piezoelectric vibrator, a cylindrical mode converting connected member connected to one end of the cylindrical vibrating body, and a light transmitting body attached to the mode converting connected member. The light transmitting body includes a light transmitting portion disposed on a front side of the lens. The mode converting connected member includes a thin portion having a thickness smaller than a thickness of the cylindrical vibrating body.

Abstract: An ESD-protective-function-equipped composite electronic component is provided that includes multiple Zener diodes formed from first and second semiconductor layers. Moreover, the second semiconductor layers are disposed on an insulating substrate and in the same plane. The electronic component includes electrodes extending from each of the Zener diodes and one or more thin-film circuit element connected in series between a pair of the electrodes.

Abstract: A vibration device includes a cylindrical vibration body portion including a cylindrical member and a piezoelectric vibrator fixed to the cylindrical member, and a light-transparent body portion that includes an outer peripheral portion connected to an end surface of the cylindrical member and a light-transparent portion positioned in front of a lens. The light-transparent body portion vibrates in a bending mode by vibration of the cylindrical vibration body portion. The bending mode includes a first bending mode in which a center-maximum-displacement portion of the light-transparent body portion and the outer peripheral portion of the light-transparent body portion connected to the end surface are displaced in the same direction and a second bending mode in which the center-maximum-displacement portion of the light-transparent body portion and the outer peripheral portion of the light-transparent body portion are displaced in opposite directions.

Abstract: A vibrating device includes a tubular vibrating body and a lens cover coupled to a first surface of the tubular vibrating body. The tubular vibrating body includes a tubular member and piezoelectric vibrators. The lens cover includes a mode changing coupler and a light transmitting body unit disposed in front of a lens of a camera. The mode changing coupler includes a thin portion having a thickness smaller than a thickness of the tubular member.

Abstract: A vibration device includes a support body that includes first and second principal surfaces and a through hole penetrating through the support body to open at the first and second principal surfaces, a first vibration element on the side of the first principal surface of the support body, and a second vibration element on the side of the second principal surface of the support body. The first vibration element includes a first vibration body that is translucent. The second vibration element includes a second vibration body and a second piezoelectric vibrator provided on the second vibration body.

Abstract: A vibration device that is used in a camera body including a lens includes a cylindrical vibrating body including a piezoelectric vibrator, a cylindrical mode converting connected member connected to one end of the cylindrical vibrating body, and a light transmitting body attached to the mode converting connected member. The light transmitting body includes a light transmitting portion disposed on a front side of the lens. The mode converting connected member includes a thin portion having a thickness smaller than a thickness of the cylindrical vibrating body.

Abstract: An ESD-protective-function-equipped composite electronic component is provided that includes multiple Zener diodes formed from first and second semiconductor layers. Moreover, the second semiconductor layers are disposed on an insulating substrate and in the same plane. The electronic component includes electrodes extending from each of the Zener diodes and one or more thin-film circuit element connected in series between a pair of the electrodes.

Abstract: A solar cell that includes a negative electrode made of Al—Nd or the like formed on a substrate, an electron transport layer made of n-type Si or the like, a quantum dot arrangement layer made of graphene or the like, a quantum dot layer, a positive hole transport layer made of p-type Si or the like, and a positive electrode made of ITO or the like are sequentially formed on a surface of the negative electrode. Output electrodes are formed on the positive electrode so that at least a part of the surface of the positive electrode is exposed. The quantum dot layer is constructed such that quantum dots of Si cluster particles are three-dimensionally periodically arranged. The Si cluster particles have an average particle size of 3 nm or less, and the interparticle distance between the Si cluster particles is 1 nm or less.

Abstract: A solar cell that includes a negative electrode made of Al—Nd or the like formed on a substrate, an electron transport layer made of n-type Si or the like, a quantum dot arrangement layer made of graphene or the like, a quantum dot layer, a positive hole transport layer made of p-type Si or the like, and a positive electrode made of ITO or the like are sequentially formed on a surface of the negative electrode. Output electrodes are formed on the positive electrode so that at least a part of the surface of the positive electrode is exposed. The quantum dot layer is constructed such that quantum dots of Si cluster particles are three-dimensionally periodically arranged. The Si cluster particles have an average particle size of 3 nm or less, and the interparticle distance between the Si cluster particles is 1 nm or less.

Abstract: A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.

Abstract: A method for producing a thin film laminated capacitor that makes it possible to reduce the number of operations for etching its electrode layers and its dielectric layers. On a substrate, a capacitor part is formed wherein n electrode layers and (n?1) dielectric layers are alternately laminated onto each other, wherein n is 4 or more. The capacitor part is etched from the same side k times. In any ith etching operation, through holes are formed in an amount corresponding to respective ai layers of the electrode layers and the dielectric layers. At least one of ai's is set to 2 or more, and k is made smaller than n?1, thereby making it possible to make the 2nd to nth layers of the electrode layers from the etching starting side exposed at the bottom surfaces of the through holes.

Abstract: A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.

Abstract: A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part.