Abstract: A power conditioner is provided that includes a heat dissipating member, multiple circuit boards, and a mounting auxiliary plate. A power conditioner circuit including an electric heat generating element is formed on each of the circuit boards. The circuit boards are mounted on a front surface of the heat dissipating member. Heat dissipating fins are arranged on a back surface of the heat dissipating member. Preferably, the heat dissipating member is formed from a material having high heat dissipation property. The mounting auxiliary plate is fixed to the back surface side of the heat dissipating member and provided with a through hole for mounting to a wall. The mounting auxiliary plate has higher rigidity than the heat dissipating member.

Abstract: A power conditioner is provided that includes a heat dissipating member, multiple circuit boards, and a mounting auxiliary plate. A power conditioner circuit including an electric heat generating element is formed on each of the circuit boards. The circuit boards are mounted on a front surface of the heat dissipating member. Heat dissipating fins are arranged on a back surface of the heat dissipating member. Preferably, the heat dissipating member is formed from a material having high heat dissipation property. The mounting auxiliary plate is fixed to the back surface side of the heat dissipating member and provided with a through hole for mounting to a wall. The mounting auxiliary plate has higher rigidity than the heat dissipating member.

Abstract: A card-type apparatus includes a circuit substrate and a card-type case for accommodating the circuit substrate including a flat portion disposed opposite to the circuit substrate with a gap between the circuit substrate and the flat portion. A memory card accommodating space, provided between the flat portion of the card-type case and the circuit substrate, is capable of detachably accommodating the memory card inserted from a memory card slot along the circuit substrate surface. A terminal is provided on a region of the circuit substrate in the memory card accommodating space. A plate section for adjusting the gap is provided on the flat portion on the side of the memory card accommodating space. On the plate section, a protrusion is provided so as to increase the contact pressure between the memory card and the terminal by pressing the memory card stored in the memory card accommodating space against the terminal.

Abstract: A card apparatus includes a card case housing a circuit substrate, a case main body and an extended portion made of resin material and being disposed integrally with the case main body. The extended portion accommodates one end side portion of the circuit substrate. The case main body includes a metal cover disposed opposite to at least one of the front surface and the back surface of the circuit substrate. A metal cover extension extending from the metal cover and constituted of a first conductive plate is embedded in a case wall constituting the extended portion, and a second conductive plate constituting an antenna element is embedded in the case wall constituting the extended portion, the second conductive plate being provided at a predetermined distance apart from the metal cover extension.

Abstract: In an antenna feed structure for electrically connecting a rotatable antenna to a circuit formed on a circuit board by means of a feeding metallic part, an antenna rotary shaft formed so as to protrude from one end of the antenna and formed of a conductor has a preferably spherical end. The feeding metallic part has a mounting portion, an antenna contact-and-connection portion, and an elastic supporting portion. The mounting portion is mounted to the circuit board. The antenna contact-and-connection portion is brought into contact with and is connected to the end of the antenna rotary shaft. The elastic supporting portion supports the antenna contact-and-connection portion at the mounting portion and produces biasing force towards the antenna rotary shaft from the antenna contact-and-connection portion. The antenna contact-and-connection portion has a recess wall preferably having a spherical shape which is in correspondence with the spherical shape of the end of the antenna rotary shaft.

Abstract: A card apparatus includes a card case housing a circuit substrate, a case main body and an extended portion made of resin material and being disposed integrally with the case main body. The extended portion accommodates one end side portion of the circuit substrate. The case main body includes a metal cover disposed opposite to at least one of the front surface and the back surface of the circuit substrate. A metal cover extension extending from the metal cover and constituted of a first conductive plate is embedded in a case wall constituting the extended portion, and a second conductive plate constituting an antenna element is embedded in the case wall constituting the extended portion, the second conductive plate being provided at a predetermined distance apart from the metal cover extension.

Abstract: A card-type apparatus includes a circuit substrate and a card-type case for accommodating the circuit substrate including a flat portion disposed opposite to the circuit substrate with a gap between the circuit substrate and the flat portion. A memory card accommodating space, provided between the flat portion of the card-type case and the circuit substrate, is capable of detachably accommodating the memory card inserted from a memory card slot along the circuit substrate surface. A terminal is provided on a region of the circuit substrate in the memory card accommodating space. A plate section for adjusting the gap is provided on the flat portion on the side of the memory card accommodating space. On the plate section, a protrusion is provided so as to increase the contact pressure between the memory card and the terminal by pressing the memory card stored in the memory card accommodating space against the terminal.

Abstract: In an antenna feed structure for electrically connecting a rotatable antenna to a circuit formed on a circuit board by means of a feeding metallic part, an antenna rotary shaft formed so as to protrude from one end of the antenna and formed of a conductor has a preferably spherical end. The feeding metallic part has a mounting portion, an antenna contact-and-connection portion, and an elastic supporting portion. The mounting portion is mounted to the circuit board. The antenna contact-and-connection portion is brought into contact with and is connected to the end of the antenna rotary shaft. The elastic supporting portion supports the antenna contact-and-connection portion at the mounting portion and produces biasing force towards the antenna rotary shaft from the antenna contact-and-connection portion. The antenna contact-and-connection portion has a recess wall preferably having a spherical shape which is in correspondence with the spherical shape of the end of the antenna rotary shaft.

Abstract: An ultrasonic wave sensor is mounted on a card reader. A detection range of the ultrasonic wave sensor covers a front surface of an inlet. The ultrasonic wave sensor detects presence or absence of a foreign body at the time of standby until a card is inserted into a card slot. When a processing of the card is terminated and the card is discharged, the ultrasonic wave sensor detects presence or absence of the card or presence or absence of a foreign body. In the case where the ultrasonic wave sensor cannot detect the card although the card has been discharged, an abnormality signal can be output.

Abstract: In a circuit board, when lands provided on a rear surface of a substrate are each separated into a mainland and a sub-land, warping or other defects of the substrate can be ignored when soldering, and the substrate can be mounted with a high bonding strength. On the rear surface of a module substrate, partitions are each provided to separate a metal film into the mainland and the sub-land. Accordingly, when the substrate is mounted on a motherboard, solder applied beforehand from each end-surface electrode to the mainland can be largely protruded downward from the mainland, and warping or other defects of the substrate can be ignored by this protruding portion of the solder. In addition, in the state in which the substrate is mounted, since the solder is pushed out from between the mainland and the motherboard and overflows the partition, both the mainland and the sub-land can be soldered to the motherboard side, and hence stable bonding can be obtained at a large bonding area.

Abstract: There is provided a support structure for a magnetic head in which a magnetic head having a function of being capable of following a warp or the like of a magnetic card can be easily attached and detached without using a fastening member such as a screw. A support structure for a magnetic head for swingably supporting a magnetic head includes a fixed member fixed to a fixed portion, a movable member rotatably supported by the fixed member and urged toward a fixed position, and support shafts protrusively provided at the front and back of the magnetic head, in which groove portions for removably supporting the support shafts are formed at corresponding portions of the fixed member and the movable member in one of them in a vertical direction and in the other in a horizontal direction.

Abstract: A device with a memory card insertion/removing mechanism has a memory card holder and a pushing-out member holder disposed in the device, and a slot communicating with the memory card holder. The pushing-out member holder communicates with the memory card holder. A pushing-out member is accommodated in the pushing-out member holder. The device has an opening exposing a portion of the pushing-out member to the exterior. The pushing-out member moves in a card insertion direction by the pushing force of a memory card when the memory card is inserted in the memory card holder from the slot, and pushes out the memory card in the memory card holder to the exterior when the pushing-out member is externally operated through the opening and is moved in a card push-out direction.

Abstract: A device with a memory card insertion/removing mechanism has a memory card holder and a pushing-out member holder disposed in the device, and a slot communicating with the memory card holder. The pushing-out member holder communicates with the memory card holder. A pushing-out member is accommodated in the pushing-out member holder. The device has an opening exposing a portion of the pushing-out member to the exterior. The pushing-out member moves in a card insertion direction by the pushing force of a memory card when the memory card is inserted in the memory card holder from the slot, and pushes out the memory card in the memory card holder to the exterior when the pushing-out member is externally operated through the opening and is moved in a card push-out direction.

Abstract: An ultrasonic wave sensor is mounted on a card reader. A detection range of the ultrasonic wave sensor covers a front surface of an inlet. The ultrasonic wave sensor detects presence or absence of a foreign body at the time of standby until a card is inserted into a card slot. When a processing of the card is terminated and the card is discharged, the ultrasonic wave sensor detects presence or absence of the card or presence or absence of a foreign body. In the case where the ultrasonic wave sensor cannot detect the card although the card has been discharged, an abnormality signal can be output.

Abstract: In a circuit board, when lands provided on a rear surface of a substrate are each separated into a mainland and a sub-land, warping or other defects of the substrate can be ignored when soldering, and the substrate can be mounted with a high bonding strength. On the rear surface of a module substrate, partitions are each provided to separate a metal film into the mainland and the sub-land. Accordingly, when the substrate is mounted on a motherboard, solder applied beforehand from each end-surface electrode to the mainland can be largely protruded downward from the mainland, and warping or other defects of the substrate can be ignored by this protruding portion of the solder. In addition, in the state in which the substrate is mounted, since the solder is pushed out from between the mainland and the motherboard and overflows the partition, both the mainland and the sub-land can be soldered to the motherboard side, and hence stable bonding can be obtained at a large bonding area.

Abstract: A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.

Abstract: End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate. Furthermore, a solder having a semi-circular shape is attached to the end-face electrode. The solder comprises an electrode facing portion facing the end-face electrode in the end-face groove, and a protuberant portion elongated from the electrode facing portion to protrude on the back-surface side of the substrate. Thereby, even if the substrate or the like is warped, a gap between the end-face electrode and the electrode pad of a mother board can be filled with the protuberant portion of the solder to connect the end-face electrode and the electrode pad to each other.

Abstract: A method for joining a first wiring board covered with a conductive pattern on a surface of a thin resin basic plate to a second wiring board covered with a conductive pattern on a thin resin basic plate to ensure the electric connection therebetween, including the steps of putting said first and second wiring boards together in a confront relationship so as to adjust join predetermined portions on the conductive patterns, catching the join predetermined portions in the status by a pair of ultrasonic welding tools, and applying an ultrasonic vibration to said ultrasonic welding tools to weld the conductive metals located on the join predetermined portions.

Abstract: There is provided a support structure for a magnetic head in which a magnetic head having a function of being capable of following a warp or the like of a magnetic card can be easily attached and detached without using a fastening member such as a screw. A support structure for a magnetic head for swingably supporting a magnetic head includes a fixed member fixed to a fixed portion, a movable member rotatably supported by the fixed member and urged toward a fixed position, and support shafts protrusively provided at the front and back of the magnetic head, in which groove portions for removably supporting the support shafts are formed at corresponding portions of the fixed member and the movable member in one of them in a vertical direction and in the other in a horizontal direction.

Abstract: A shielding case can be easily removed for reworking. Insertion openings and cutouts individually continuing to the insertion openings are provided. To remove the shielding case fixed by soldering from a substrate, first, for example, edges of nippers are inserted into a pair of the insertion openings; then, the leg section is cut away by the nippers. The above cutting-away processing is sequentially performed for all the leg sections. Subsequently, a cover section is removed, solders fixing the individual leg sections are sequentially heated and melted one by one, and the leg sections are serially pulled out from the substrate. Thus, the shield case can be removed from the substrate.