Abstract: In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.

Abstract: An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted.

Abstract: A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors.

Abstract: An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted.

Abstract: A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors.

Abstract: In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.

Abstract: A voltage controlled oscillator includes a resonant circuit which is connected with an active circuit. In the resonant circuit, a variable capacitance diode is connected with a resonator via a transmission line, and a capacitive circuit is connected in parallel with the variable capacitance diode. By setting the length of the transmission line to an appropriate value ranging from, for example, about one quarter to about one half of the wavelength of the resonant frequency, the frequency change width can increase, while maintaining the frequency linearity because of connection of the capacitive circuit.

Abstract: A high-frequency oscillation circuit includes a resonance circuit and an active circuit. The active circuit includes a field-effect transistor and a capacitor. An impedance-conversion circuit including a high-impedance line, a capacitive stub, and a connecting line such as wire, is connected between the active circuit and the resonance circuit. Accordingly, the impedance-conversion circuit can convert the characteristic impedance of the resonance circuit so that the absolute value of the reflection coefficient of the active circuit increases. As a result, the oscillation conditions can be easily fulfilled.

Abstract: A frequency-switching oscillator which satisfies the conditions for oscillation, even when the switch width of the oscillation frequencies is great, without requiring a number of components to be increased. The impedance of a resonance system is set to satisfy the conditions for oscillation at two or more oscillation frequencies. A switching member is provided in the amplification system, and the oscillation frequencies are switched by changing the impedance of the amplification system. Since the resonance system does not require a switching member, loss is not caused by switching member in the resonance system, so the output level does not drop and the carrier-to-noise ratio does not deteriorate. Furthermore, without a switching member in the resonance system, the number of components can be reduced, making miniaturization and cost reduction possible.

Abstract: A voltage controlled oscillator includes a resonant circuit which is connected with an active circuit. In the resonant circuit, a variable capacitance diode is connected with a resonator via a transmission line, and a capacitive circuit is connected in parallel with the variable capacitance diode. By setting the length of the transmission line to an appropriate value ranging from, for example, about one quarter to about one half of the wavelength of the resonant frequency, the frequency change width can increase, while maintaining the frequency linearity because of connection of the capacitive circuit.

Abstract: A high-frequency oscillation circuit includes a resonance circuit and an active circuit. The active circuit includes a field-effect transistor and a capacitor. An impedance-conversion circuit including a high-impedance line, a capacitive stub, and a connecting line such as wire, is connected between the active circuit and the resonance circuit. Accordingly, the impedance-conversion circuit can convert the characteristic impedance of the resonance circuit so that the absolute value of the reflection coefficient of the active circuit increases. As a result, the oscillation conditions can be easily fulfilled.

Abstract: A frequency-switching oscillator which satisfies the conditions for oscillation, even when the switch width of the oscillation frequencies is great, without requiring a number of components to be increased. The impedance of a resonance system is set to satisfy the conditions for oscillation at two or more oscillation frequencies. A switching member is provided in the amplification system, and the oscillation frequencies are switched by changing the impedance of the amplification system. Since the resonance system does not require a switching member, loss is not caused by switching member in the resonance system, so the output level does not drop and the carrier-to-noise ratio does not deteriorate. Furthermore, without a switching member in the resonance system, the number of components can be reduced, making miniaturization and cost reduction possible.

Abstract: A frequency-switching oscillator which satisfies the conditions for oscillation, even when the switch width of the oscillation frequencies is great, without requiring a number of components to be increased. The impedance of a resonance system is set to satisfy the conditions for oscillation at two or more oscillation frequencies. A switching member is provided in the amplification system, and the oscillation frequencies are switched by changing the impedance of the amplification system. Since the resonance system does not require a switching member, loss is not caused by switching member in the resonance system, so the output level does not drop and the carrier-to-noise ratio does not deteriorate. Furthermore, without a switching member in the resonance system, the number of components can be reduced, making miniaturization and cost reduction possible.

Abstract: An oscillator includes an oscillating circuit and a resonating circuit connected to the oscillating circuit, and an amplifying circuit for amplifying signals output from the oscillating circuit. The oscillator also includes an added circuit having an isolator, frequency filter, or other suitable elements, disposed between the output portion of the oscillating circuit and the input portion of the amplifying circuit, so as to prevent transmission of unwanted waves, such as the higher harmonic component of the basic wave, and other such undesirable waves. The oscillator, and a communication apparatus including such oscillator, eliminates deterioration of phase noise properties caused by generation of unwanted wave components such as higher harmonics.