Abstract: A rescue support apparatus includes: a registration unit configured to register biometric information and personal information of a prospective climber to be associated with each other; a reception unit configured to receive an image and positional information of a terminal of an arbitrary finder from the terminal in a case where the arbitrary finder finds a person to be rescued during mountain climbing, the image being obtained by photographing biometric information of the person to be rescued by the terminal of the finder; an authentication control unit configured to control authentication using the registered biometric information for the biometric information contained in the image; and a rescue request unit configured to transmit rescue request information to a rescue system in a case where the authentication is succeeded, the rescue request information containing the personal information associated with the biometric information and the positional information received from the terminal.

Abstract: Provided is a cleaning member, comprising an elastic member that includes polyurethane, wherein: when tan ? of a test piece sampled from the elastic member is measured in the temperature range of ?20° C. to +60° C., the peak temperature of a peak indicating the maximum value of tan ? is at 15.0° C. or below; the maximum value of tan ? is 0.20 to 0.55; tan ? at a temperature of 55° C. is 0.13 or larger; and where the detected quantity of all ions obtained when the test piece is heated at a rate of temperature increase of 10° C./second to 1000° C. using a direct-sampling mass spectrometer is M1 and the integrated intensity of a peak in a derived ion thermogram that corresponds to a range of m/z values originating in multifunctional isocyanate with at least three isocyanate groups is M2, M2/M1 is at least 0.001.

Abstract: A bonded object production method according to an embodiment uses a continuous furnace to process a stacked body including a metal member, a ceramic member, and a brazing material layer located therebetween, while conveying the stacked body; and the method includes a process of heating the stacked body in an inert atmosphere from 200° C. to a bonding temperature at an average temperature raising rate of the stacked body of not less than 15° C./min, a process of bonding the stacked body in an inert atmosphere at the bonding temperature that is within a range of not less than 600° C. and not more than 950° C., and a process of cooling the stacked body from the bonding temperature to 200° C. at an average temperature lowering rate of the stacked body of not less than 15° C./min. A ceramic substrate is favorably a silicon nitride substrate.

Abstract: The present disclosure provides a compound having a STING agonistic activity, which may be expected to be useful as an agent for the prophylaxis or treatment of STING-related diseases. The present disclosure relates to a compound represented by the formula (I): wherein each symbol is as defined in the description, or a salt thereof.

Abstract: A radio-frequency module includes a hybrid filter for 5th Generation New Radio (5G-NR) n77, a filter for 5G-NR n79, power amplifiers, a third inductor coupled to the power amplifier, and a fourth inductor coupled to a power amplifier. When a module substrate is viewed in plan view, the power amplifiers are disposed in a first quadrant, the third inductor and the fourth inductor are disposed in a second quadrant, the hybrid filter and the filter are disposed in a third quadrant, the power amplifier is disposed closer to a reference point than the power amplifier, the third inductor is disposed closer to the reference point than the fourth inductor, and the hybrid filter is disposed closer to the reference point than the filter.

Abstract: A radio-frequency module includes a module substrate, a hybrid filter for 5th Generation New Radio (5G-NR) n77 including a first acoustic wave resonator element, a first inductor, and a first capacitor, a filter for 5G-NR n79 including a second acoustic wave resonator element and a second inductor, power amplifiers, a third inductor coupled between the power amplifier and the hybrid filter, and a fourth inductor coupled between the power amplifier and the filter. The first inductor, the second inductor, the third inductor, and the fourth inductor are disposed at a major surface or inside the module substrate. The distance between the first inductor and the third inductor is larger than the distance between the second inductor and the fourth inductor.

Abstract: Degradation of characteristics is to be reduced. A hybrid filter of a radio frequency module includes an acoustic wave filter and a first circuit. A plurality of circuit elements of the first circuit include a plurality of inductors and a plurality of capacitors. A second input/output portion of the acoustic wave filter includes a first connection terminal, a second connection terminal, and a conductor portion. A second circuit of the first circuit is connected between the first connection terminal and a ground terminal and includes at least one circuit element. A third circuit of the first circuit is connected between the second connection terminal and a second signal terminal and includes at least one inductor among the plurality of inductors and at least one capacitor among the plurality of capacitors.

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, and a first radio-frequency component, wherein a pass band width of the hybrid filter is greater than a resonant band width of the first acoustic wave resonator, one of the first acoustic wave resonator, the first inductor, and the first capacitor is disposed on the main surface, and the first radio-frequency component is disposed on the main surface.

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, a switch for connecting and disconnecting an antenna connection terminal and the hybrid filter, and a coupler disposed on a path linking the antenna connection terminal and the switch. The first acoustic wave resonator is disposed on the main surface, the switch is included in a semiconductor IC disposed on the main surface, the coupler is disposed inside the module substrate, and in plan view of the module substrate, the semiconductor IC at least partially overlaps the first acoustic wave resonator, and the semiconductor IC and the coupler at least partially overlaps.

Abstract: The present invention relates to compositions and methods for treating patients with cancer having a RET gene abnormality comprising administering HM06/TAS0953, for example patients with non-small cell lung cancer (NSCLC), and that may also have brain and/or leptomeningeal metastases, or another solid tumor; where the patient is administered an effective amount of HM06/TAS0953, where the HM06/TAS0953 can be formulated in a composition and administered orally in a single or multiple doses; and where the patients may have previously received and/or have developed resistance to another RET-selective or multi-kinase inhibitor.

Abstract: To suppress degradation of characteristics, a high frequency module includes a mounting substrate, a first signal terminal, a second signal terminal, and ground terminals, and a hybrid filter. The hybrid filter is coupled between the first signal terminal and the second signal terminal. The hybrid filter includes an acoustic wave filter having at least one acoustic wave resonator, a first inductor, and a capacitor. The pass band width of the hybrid filter is larger than that of the acoustic wave resonator. A resin layer is disposed on a first principal surface of the mounting substrate. The resin layer covers at least part of the acoustic wave filter. A metal electrode layer covers at least part of the resin layer, and is coupled to the ground terminals. The second inductor is coupled between the hybrid filter and the second signal terminal.

Abstract: A high-frequency module includes a mounting substrate, a filter, and a common inductor. The mounting substrate includes a first main surface and a second main surface facing each other. The filter includes series arm resonators and parallel arm resonators, and is disposed on the first main surface. The mounting substrate includes a ground terminal on the second main surface. A first end of the common inductor is connected to all of the parallel arm resonators. A second end of the common inductor is connected to the ground terminal.

Abstract: A filter device includes a filter substrate and a ladder filter at the filter substrate. The ladder filter includes at least one inductor and acoustic wave resonators including a series arm resonator and a parallel arm resonator. The at least one inductor is coupled to the acoustic wave resonators. A pass bandwidth of the ladder filter is larger than a resonance bandwidth of at least one of the acoustic wave resonators. The series arm resonator includes a first piezoelectric substrate. The parallel arm resonator includes a second piezoelectric substrate that is different from the first piezoelectric substrate.

Abstract: A radio-frequency circuit includes a first switch, a first filter, a second filter, a third filter, and a fourth filter. The first switch is capable of selectively connecting a first selection terminal or a second selection terminal to a first common terminal. The first filter and the second filter are connected to the first selection terminal. The third filter and the fourth filter are connected to the second selection terminal. The first filter and the third filter are band pass filters. The second filter is a band elimination filter. A pass band of the first filter and a rejection band of the second filter overlap each other. The pass band of the first filter and a pass band of the third filter overlap each other.

Abstract: A hybrid filter includes a module substrate having a major surface and a major surface that are opposite to each other, acoustic wave resonator elements disposed at the module substrate, inductors disposed at the module substrate, and a capacitor disposed at the module substrate. The pass band of the hybrid filter is wider than the resonance band width of the acoustic wave resonator elements. One of the acoustic wave resonator elements, the inductors, and the capacitor is a first circuit element, and the first circuit element is disposed at the major surface. Another of the acoustic wave resonator elements, the inductors, and the capacitor is a second circuit element, and the second circuit element is disposed at the major surface.

Abstract: When determining, from a plurality of sensors (10), a sensor (10) for observing a plurality of moving objects (20), based on positions of the plurality of moving objects (20), an allocation determination apparatus (2000) executes annealing on an allocation determination model of which value is larger as the number of the moving objects (20) that are not observed by any of the plurality of sensors (10) is larger, and of which value is smaller as the number of the moving objects (20) that are not observed by any of the plurality of sensors (10) is smaller, and thereby determines allocation of the moving object (20) to each of the sensors (10) in a case in which the value of the allocation determination model decreases.

Abstract: A hybrid filter device (1) includes an acoustic wave device (AD) that includes an acoustic wave resonator and a passive device (PD) that includes an inductor element or an inductor element and a capacitance element. At least one of the acoustic wave device (AD) and the passive device (PD) is mounted on a substrate (20) of the hybrid filter device (1) and the acoustic wave device (AD) and the passive device (PD) are electrically connected to each other. The acoustic wave device (AD) overlaps the passive device (PD) when the hybrid filter device (1) is viewed in a direction perpendicular to one main surface (20a) of the substrate (20).

Abstract: A developing device includes: a first transport member and a second transport member that are disposed in a first transport path and a second transport path provided at an upper side and a lower side in a gravitational direction and that transport a developer. The developing device also includes an ejecting path that is provided in the first transport path disposed at the upper side in the gravitational direction and that ejects an excess developer. The developing device includes a reverse helical section that is disposed in front of a support that supports the second transport member. The reverse helical section helically extends in a reverse direction relative to a helical section provided for circulating the developer, the developer being transported to the ejecting path by the reverse helical section.

Abstract: The learning device learns a tracking model used for a radar device. A first acquisition unit acquires, from a radar device, a target detection information indicating a position of a target detected based on a received wave, and a track of the target calculated based on the target detection information. A second acquisition unit acquires a target position information indicating a position of the target. A learning data generation unit generates learning data using the target detection information, the track, and the target position information. A learning processing unit learns a tracking model for performing tracking processing of the target based on the target detection information, using the learning data.

Abstract: In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.