Abstract: A printed circuit board includes a power input terminal, a positive trunk line, a negative trunk line, a first switching circuit, a second switching circuit, a first positive wire, a second positive wire, a first capacitor, a second capacitor, and a bypass circuit. The first positive wire connecting the positive trunk line with the first switching circuit without passing through the second switching circuit. The second positive wire connecting the positive trunk line with the second switching circuit without passing through the first switching circuit. The first capacitor provided between the first positive wire and the negative trunk line. The second capacitor provided between the second positive wire and the negative trunk line. The bypass circuit connecting the first positive wire with the second positive wire.

Abstract: A printed circuit board includes a power input terminal, a positive trunk line, a negative trunk line, a first switching circuit, a second switching circuit, a first positive wire, a second positive wire, a first capacitor, a second capacitor, and a bypass circuit. The first positive wire connecting the positive trunk line with the first switching circuit without passing through the second switching circuit. The second positive wire connecting the positive trunk line with the second switching circuit without passing through the first switching circuit. The first capacitor provided between the first positive wire and the negative trunk line. The second capacitor provided between the second positive wire and the negative trunk line. The bypass circuit connecting the first positive wire with the second positive wire.

Abstract: A printed wiring board includes a first main wire having first inner layer wiring patterns which are wired on inner layers connected by first via conductors in series. In addition, a second main wire has second inner layer wiring patterns which are wired on the inner layers connected by second via conductors. The first inner layer wiring patterns and the second inner layer wiring patterns are wired so as to change the layer to the inner layer on the opposite side to each other. First and second branch wires are branched from the first and second via conductors, respectively.

Abstract: A first reception circuit and a second reception circuit are mounted on a printed circuit board, and receive signals via wiring thereof from a transmission circuit. The printed wiring board includes a trunk wiring, a first branched line branching from a first branch connection point, and a second branched line branching from a second branch connection point in order. A wiring area between the start end and the first branch connection point is divided into a first wiring portion and a second wiring portion, in order from the start end, and a wiring area between the first branch connection point and the second branch connection point is a third wiring portion. The characteristic impedance of the first wiring portion is set to equal or lower than the characteristic impedance of the third wiring portion, and the characteristic impedance of the second wiring portion is set higher than the characteristic impedance of the first wiring portion.

Abstract: A memory system is provided with a motherboard, and a memory controller and a plurality memory devices mounted on the motherboard. The motherboard comprises a unicursal-shape main wiring, and branch wirings branched from the main wiring to the respective memory devices. Further, the motherboard comprises an open stub wiring branched from a connecting point between a start end and a branch point of the main wiring. Thus, a ringing of a waveform of a signal received by a receiving circuit can be suppressed irrespective of a wiring length of the branch wiring.

Abstract: A main wire 111 has inner layer wiring patterns 161 to 165 which are wired on an inner layers 114 and 115 connected by via conductors 166 to 169 in series. In addition, a main wire 112 has inner layer wiring patterns 181 to 185 which are wired on the inner layers 114 and 115 connected by via conductors 186 to 189. The inner layer wiring patterns 161 to 165 and the inner layer wiring patterns 181 to 185 are wired so as to change the layer to the inner layer on the opposite side to each other. Branch wires 1211 to 1214 and 1221 to 1224 are branched from the via conductors 166 to 169 and 186 to 189, respectively. Thereby, the present invention provides an inexpensive printed wiring board which can reduce ringing without upsizing the printed wiring board.

Abstract: A first reception circuit and a second reception circuit are mounted on a printed circuit board, and receive signals via wiring thereof from a transmission circuit. The printed wiring board includes a trunk wiring, a first branched line branching from a first branch connection point, and a second branched line branching from a second branch connection point in order. A wiring area between the start end and the first branch connection point is divided into a first wiring portion and a second wiring portion, in order from the start end, and a wiring area between the first branch connection point and the second branch connection point is a third wiring portion. The characteristic impedance of the first wiring portion is set to equal or lower than the characteristic impedance of the third wiring portion, and the characteristic impedance of the second wiring portion is set higher than the characteristic impedance of the first wiring portion.

Abstract: A biomaterial in which the surface of a metal base is coated with a coating agent containing a composite of hydroxyapatite and collagen in which the c-axis of hydroxyapatite in the composite is oriented along collagen fibers is used.

Abstract: A memory system is provided with a motherboard, and a memory controller and a plurality memory devices mounted on the motherboard. The motherboard comprises a unicursal-shape main wiring, and branch wirings branched from the main wiring to the respective memory devices. Further, the motherboard comprises an open stub wiring branched from a connecting point between a start end and a branch point of the main wiring. Thus, a ringing of a waveform of a signal received by a receiving circuit can be suppressed irrespective of a wiring length of the branch wiring.

Abstract: In a semiconductor device including a semiconductor substrate, a trench formed on the semiconductor substrate, an insulating film formed on a side wall of the trench, and an electrode formed on the insulating film. The electrode includes a first film made of first metal nitride, an intervention film made of silicon or of second metal silicide, and a second film made of third metal in this order.

Abstract: Provision of a porous ceramic material which rapidly induces bone tissue formation and has practical strength. A porous ceramic material 11 having substantially unidirectionally oriented pores 12, a porosity of 40-90%, and an average open area of one pore of 0.05×10?3-50×10?3 mm2 both in a first sectional surface perpendicular to the pore 12 orientation direction and a second sectional surface parallel to the first sectional surface and 5 mm distant from the first sectional surface in the pore 12 orientation direction. Using the material 11, when a cylindrical test piece (diameter 3 mm×height 5 mm, the pore 12 array direction as a height direction) made of the material is dipped in polyethylene glycol up to 1 mm from one end thereof, polyethylene glycol permeates through the whole test piece preferably within 30 seconds.

Abstract: The spindle drive unit of a combined machine tool drives the spindle. The tip end of the spindle is provided with a boring tool and a tool head having a rough grinding stone and a finishing grinding stone. The spindle drive unit has a first support unit and a second support unit capable of receiving the spindle therethrough and supporting it rotatably, a linear motor and a column slide mechanism for moving the first and second support unit in the axis direction of the spindle, and a spindle motor for rotating the spindle.

Abstract: This invention provides organic/inorganic composite biomaterials constituted by composites of hydroxyapatite and collagen and having an average fiber length of 60 ?m or longer, and a process for producing the same in which the calcium ion and phosphate ion concentrations in the reaction vessel are optimized through regulation of the concentration of a starting material and the flow rate. The organic/inorganic composite biomaterials have mechanical strength and a biodegradation rate suitable for artificial bones through the introduction of crosslinking therein.

Abstract: A semiconductor device comprise a memory cell region and a peripheral circuit region on a semiconductor substrate, and a metal laminating wiring extending over the memory cell region and the peripheral circuit region. The metal laminating wiring is a bit line in the memory cell region, and is a portion of a wiring for the peripheral circuit region connected to the bit line and a portion of a gate electrode connected to the wiring for the peripheral circuit region, in the peripheral circuit region. A height of a bottom surface of the metal laminating wiring disposed in the memory cell region, from an upper surface of the semiconductor substrate is substantially the same as the height of the bottom surface of the metal laminating wiring disposed in the peripheral circuit region, from the upper surface of the semiconductor substrate.

Abstract: A porous composite comprising a porous layer containing a calcium phosphate ceramic, and a dense layer formed on part of the porous layer and having a smaller average pore size than that of the porous layer. The porous composite can be produced by (1) introducing a slurry containing a calcium phosphate ceramic/collagen composite and collagen into a molding die having a high thermal conductivity, (2) rapidly freezing and drying the slurry in the molding die, to form a porous body comprising a porous layer and a dense layer formed on the porous layer, (3) cross-linking collagen in the porous body, and (4) removing the dense layer except for a portion thereof on a surface coming into contact with a soft tissue when implanted in a human body, so that the porous layer is exposed.

Abstract: In the process of producing a porous body containing a fibrous apatite/collagen composite by gelating a dispersion comprising the fibrous apatite/collagen composite, collagen and water, freeze-drying the resultant gel to form a porous body, and cross-linking collagen in the porous body, a method for controlling the average pore diameter of the porous body by the solidification time of the gel in the freezing step.

Abstract: A mobile radio apparatus using a circuit board in a cabinet as an antenna and being capable of providing a good antenna characteristic when the mobile radio apparatus is closed for entering a portable mode is provided. In a mobile radio apparatus, an upper circuit board is housed in an upper cabinet, a lower circuit board is housed in a lower cabinet, the upper and lower circuit boards and are electrically connected, an antenna section is housed in an upper part of the lower cabinet, a feeding section for supplying power to the antenna section is housed in the lower cabinet, and in a portable mode with the upper cabinet and the lower cabinet stacked on each other, the feeding section is connected to the antenna section and in a conversation mode in which the joint whole length is grown as the upper cabinet and the lower cabinet are changed in the mutual position, the feeding section is connected to the upper circuit board through the antenna section and a connection member.

Abstract: A method for producing a porous body comprising apatite/collagen composite fibers comprising the steps of gelling a dispersion comprising long apatite/collagen composite fibers having an average length of 10-75 mm, short apatite/collagen composite fibers having an average length of 0.05-1 mm, and a liquid; freezing and drying the resultant gel to form a porous body; and cross-linking collagen in the porous body.

Abstract: In a printed circuit board, a semiconductor including plural power supply terminals and a semiconductor chip is mounted onto a mounting surface of a printed wiring board, and a bypass capacitor for reducting a power ground noise is provided. Another bypass capacitor, which is connected to the bypass capacitor only within an IC chip is provided to inhibit the power ground noise from causing not only a variation in timing of the IC chip and a malfunction thereof but also a malfunction of another IC chip and the generation of an EMI noise in a case where the power ground noise propagates to a power supply side.

Abstract: Provision of a porous ceramic material which rapidly induces bone tissue formation and has practical strength. A porous ceramic material 11 having substantially unidirectionally oriented pores 12, a porosity of 40-90%, and an average open area of one pore of 0.05×10?3-50×10?3 mm2 both in a first sectional surface perpendicular to the pore 12 orientation direction and a second sectional surface parallel to the first sectional surface and 5 mm distant from the first sectional surface in the pore 12 Orientation direction. Using the material 11, when a cylindrical test piece (diameter 3 mm×height 5 mm, the pore 12 array direction as a height direction) made of the material is dipped in polyethylene glycol up to 1 mm from one end thereof, polyethylene glycol permeates through the whole test piece preferably within 30 seconds.