Abstract: A semiconductor device, suitable for use in an invertor device for large currents in which IGBT chips are used and of which a high reliability is required, has an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in the space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein, for purposes of attaching the insulating plate to the heatsink, the resin case is used to press the insulating plate onto the heatsink. Some benefits of this construction are that is makes it possible to eliminate the problem of fatigue failure of a solder layer previously used for attaching the insulating plate to the heatsink by dispensing with that solder layer, while at the same time improving the transfer of heat from the insulating plate to the heatsink, and thereby improving the removal of heat from the device.

Abstract: A cooling system for an electric automobile is characterized in that a heat source is forcibly cooled with a coolant of non-freeze solution, forcibly recirculated through a pipe.

Abstract: A cooling system is provided for an electric vehicle inverter system having an inverter for converting electric power from a battery into alternating current and for supplying the current to a driving motor for driving the vehicle. The cooling system employs a heat sink having an internal coolant flow passage for conducting a liquid coolant which is forced to recirculate. The heat sink is vertically placed on a mounting base, and heat generating parts are placed and fixed on at least one side of said heat sink. In this way, a cooling system for an electric vehicle inverter system which is small in size and large in cooling capacity with a simple construction is easily provided.