Abstract: An image forming apparatus includes a first process unit and a second process unit. The first process unit includes: a first photosensitive member configured to carry a first developer image to be transferred onto a transfer medium; and a blade member configured to scrape substances attached to a surface of the first photosensitive member off the surface of the first photosensitive member. The second process unit includes: a second photosensitive member configured to carry a second developer image to be transferred onto the transfer medium having the first developer image transferred thereon; and a holding member configured to remove substances attached to a surface of the second photosensitive member from the surface of the second photosensitive member, temporarily hold the substances and return the substances to the surface of the second photosensitive member.

Abstract: A method for producing a piezoelectric actuator includes forming a diffusion preventing layer on one surface of a substrate formed of a metallic material for preventing a diffusion of a metal from the substrate, heating a diffusion preventing layer at a first temperature in order to relieve a residual stress in the diffusion preventing layer, forming an electrode on a surface of the diffusion preventing layer, the surface not facing the substrate, forming a piezoelectric layer of a piezoelectric material on a surface of the electrode, the surface not facing the diffusion preventing layer, and annealing the piezoelectric layer at a second temperature. Accordingly, it is possible to prevent the electrode from being exfoliated from the diffusion preventing layer. Moreover, it is possible to prevent a crack being developed in the piezoelectric layer.

Abstract: An image forming apparatus includes a first process unit and a second process unit. The first process unit includes: a first photosensitive member configured to carry a first developer image to be transferred onto a transfer medium; and a blade member configured to scrape substances attached to a surface of the first photosensitive member off the surface of the first photosensitive member. The second process unit includes: a second photosensitive member configured to carry a second developer image to be transferred onto the transfer medium having the first developer image transferred thereon; and a holding member configured to remove substances attached to a surface of the second photosensitive member from the surface of the second photosensitive member, temporarily hold the substances and return the substances to the surface of the second photosensitive member.

Abstract: An image forming apparatus includes a first process unit and a second process unit. The first process unit includes: a first photosensitive member configured to carry a first developer image to be transferred onto a transfer medium; and a blade member configured to scrape substances attached to a surface of the first photosensitive member off the surface of the first photosensitive member. The second process unit includes: a second photosensitive member configured to carry a second developer image to be transferred onto the transfer medium having the first developer image transferred thereon; and a holding member configured to remove substances attached to a surface of the second photosensitive member from the surface of the second photosensitive member, temporarily hold the substances and return the substances to the surface of the second photosensitive member.

Abstract: An image forming apparatus includes a first process unit and a second process unit. The first process unit includes: a first photosensitive member configured to carry a first developer image to be transferred onto a transfer medium; and a blade member configured to scrape substances attached to a surface of the first photosensitive member off the surface of the first photosensitive member. The second process unit includes: a second photosensitive member configured to carry a second developer image to be transferred onto the transfer medium having the first developer image transferred thereon; and a holding member configured to remove substances attached to a surface of the second photosensitive member from the surface of the second photosensitive member, temporarily hold the substances and return the substances to the surface of the second photosensitive member.

Abstract: A liquid droplet of a first liquid and a liquid droplet of a second liquid are mixed upon landing on a substrate, and then the reaction is initiated between the first and second liquid droplets. Accordingly, it is possible to avoid the problem which would have been caused when the two liquids are mixed in advance before the usage that the reaction between the two liquids is advanced before the liquids are actually coated. Further, since the ink-jet system is employed, it is possible to precisely control the liquid-droplet amount and the landing position, thereby landing the first and second liquids on a same position with high precision. Accordingly, a highly integrated pattern can be formed. Furthermore, since the mixing ratio of the first and second liquids can be precisely controlled, the film quality can be stabilized.

Abstract: A mask, through which a plurality of slender through-holes are formed, has a reinforcing section which is formed to span the through-holes, wherein recesses are provided at portions of the reinforcing section to cover the through-holes. Accordingly, a metal, which is subjected to the sputtering, easily makes the detour around the reinforcing section. Therefore, a metal film is easily formed even on portions shadowed by the reinforcing section. It is possible to accurately form a fine wiring pattern.

Abstract: A nozzle plate includes a first thermoplastic resin film; a reinforcing plate which is formed of a material having a rigidity higher than that of the first thermoplastic resin film and which has one surface joined to the first thermoplastic resin film; and a second thermoplastic resin film which is joined to the other surface of the reinforcing plate; wherein a nozzle is formed for the first thermoplastic resin film; and through-holes, which are communicated with the nozzle, are formed through the reinforcing plate and the second thermoplastic resin film. Therefore, the nozzle plate can be produced without using any adhesive. Further, the thermoplastic resin films are joined to the both surfaces of the reinforcing plate. Therefore, any warpage is hardly caused in the reinforcing plate and the first and second thermoplastic resin films, which would be otherwise caused by the difference in coefficient of thermal expansion.

Abstract: A connecting terminal provided on a substrate and a connector provided on an electronic device are connected via a bump formed of a first member, which is formed of an anisotropic conductive paste including particles of a conductive material, and a second member which is different in conductivity from the first member. According to such a structure, since the anisotropic conductive paste which is softer as compared to a solder bump is used, stress applied to an interface between the bump and the connecting terminal is relaxed. Accordingly, reliability of connection can be assured even when using a substrate with large surface irregularities and/or bending, in which stress occurs relatively easily in a connection part of the bump and the connecting terminal.

Abstract: A method for producing a piezoelectric actuator includes forming a diffusion preventing layer on one surface of a substrate formed of a metallic material for preventing a diffusion of a metal from the substrate, heating a diffusion preventing layer at a first temperature in order to relieve a residual stress in the diffusion preventing layer, forming an electrode on a surface of the diffusion preventing layer, the surface not facing the substrate, forming a piezoelectric layer of a piezoelectric material on a surface of the electrode, the surface not facing the diffusion preventing layer, and annealing the piezoelectric layer at a second temperature. Accordingly, it is possible to prevent the electrode from being exfoliated from the diffusion preventing layer. Moreover, it is possible to prevent a crack being developed in the piezoelectric layer.

Abstract: A nozzle plate includes a first thermoplastic resin film; a reinforcing plate which is formed of a material having a rigidity higher than that of the first thermoplastic resin film and which has one surface joined to the first thermoplastic resin film; and a second thermoplastic resin film which is joined to the other surface of the reinforcing plate; wherein a nozzle is formed for the first thermoplastic resin film; and through-holes, which are communicated with the nozzle, are formed through the reinforcing plate and the second thermoplastic resin film. Therefore, the nozzle plate can be produced without using any adhesive. Further, the thermoplastic resin films are joined to the both surfaces of the reinforcing plate. Therefore, any warpage is hardly caused in the reinforcing plate and the first and second thermoplastic resin films, which would be otherwise caused by the difference in coefficient of thermal expansion.

Abstract: A connecting terminal provided on a substrate and a connector provided on an electronic device are connected via a bump formed of a first member, which is formed of an anisotropic conductive paste including particles of a conductive material, and a second member which is different in conductivity from the first member. According to such a structure, since the anisotropic conductive paste which is softer as compared to a solder bump is used, stress applied to an interface between the bump and the connecting terminal is relaxed. Accordingly, reliability of connection can be assured even when using a substrate with large surface irregularities and/or bending, in which stress occurs relatively easily in a connection part of the bump and the connecting terminal.

Abstract: A liquid droplet of a first liquid and a liquid droplet of a second liquid are mixed upon landing on a substrate, and then the reaction is initiated between the first and second liquid droplets. Accordingly, it is possible to avoid the problem which would have been caused when the two liquids are mixed in advance before the usage that the reaction between the two liquids is advanced before the liquids are actually coated. Further, since the ink-jet system is employed, it is possible to precisely control the liquid-droplet amount and the landing position, thereby landing the first and second liquids on a same position with high precision. Accordingly, a highly integrated pattern can be formed. Furthermore, since the mixing ratio of the first and second liquids can be precisely controlled, the film quality can be stabilized.

Abstract: A mask, through which a plurality of slender through-holes are formed, has a reinforcing section which is formed to span the through-holes, wherein recesses are provided at portions of the reinforcing section to cover the through-holes. Accordingly, a metal, which is subjected to the sputtering, easily makes the detour around the reinforcing section. Therefore, a metal film is easily formed even on portions shadowed by the reinforcing section. It is possible to accurately form a fine wiring pattern.