Abstract: A replaceable component for a dispense head includes a first pipe disposed to pass through an inside of a dispense head, a pressing portion capable of pressing a valve body of a beverage supply valve in a beverage container, and a sealing member. The sealing member includes a first sealing portion capable of coming in contact with a beverage outlet of the beverage container, and a membrane connected to the first sealing portion and inhibiting a beverage from adhering to the dispense head.

Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.

Abstract: A replaceable component for a beverage container to be attached to a beverage extraction pipe of the beverage container is provided. The replaceable component for a beverage container includes a tubular member slidable along a longitudinal direction of the beverage extraction pipe and capable of coming in annular contact with an outer circumferential surface of the beverage extraction pipe, and a bag, which is attached to the tubular member, for containing a beverage.

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: A replaceable component for a dispense head includes a first pipe disposed to pass through an inside of a dispense head, a pressing portion capable of pressing a valve body of a beverage supply valve in a beverage container, and a sealing member. The sealing member includes a first sealing portion capable of coming in contact with a beverage outlet of the beverage container, and a membrane connected to the first sealing portion and inhibiting a beverage from adhering to the dispense head.

Abstract: A curable resin film of the present invention forms a first protective film (la) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.

Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.

Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 ?m, an average diameter of 60 to 500 ?m, and an average pitch of 100 to 800 ?m, heating the attached curable resin film at 100° C. to 200° C. for 0.