Abstract: To improve resistance to environmental changes and enhance system extensibility, the present invention provides an optical bus for transmitting an optical signal, which has diffusers distributed in a optical transmission layer to diffuse an input signal beam and propagate the diffused signal beam, and a signal processor for carrying out signal processing including transmission and reception of a signal beam using the optical bus.

Abstract: A circuit board consisting of an insulating substrate, a die bonding pad for fixedly bonding a semiconductor element onto the insulating substrate, and a wiring layer, in such a manner that the die bonding pad and wire layer are formed on the insulating substrate. A first heat conducting/radiating layer formed on the portion of the surface of the insulating substrate where the wiring layer and the die bonding pad are not formed, in such a manner that the first heat conducting/radiating layer is thermally connected to the die bonding pad. A second heat conducting/radiating layer is formed on the rear surface of the insulating substrate, and a heat bridge through which the die bonding pad or the first heat conducting/radiating layer is connected to the second heat conducting/radiating layer. The circuit board is light and small, and high in heat radiating characteristic, and low in manufacturing cost.

Abstract: A circuit board consisting of an insulating substrate, a die bonding pad for fixedly bonding a semiconductor element onto the insulating substrate, and a wiring layer, in such a manner that the die bonding pad and wire layer are formed on the insulating substrate. A first heat conducting/radiating layer formed on the portion of the surface of the insulating substrate where the wiring layer and the die bonding pad are not formed, in such a manner that the first heat conducting/radiating layer is thermally connected to the die bonding pad, a second heat conducting/radiating layer is formed on the rear surface of the insulating substrate, and a heat bridge through which the die bonding pad or the first heat conducting/radiating layer is connected to the second heat conducting/radiating layer. The circuit board is light and small, and high in heat radiating characteristic, and low in manufacturing cost.

Abstract: This disclosure relates to an electroluminescent (EL) device serving as a light emitting device in an image reading apparatus. An electroluminescent device is of a thick film type and well suited for combination with a photosensing device in the form of an integral light emitting and sensing device. The electroluminescent device is provided with a pair of linear light emitting elements spaced apart from each other on a transparent electrode. Each of the light emitting element includes a luminescent layer interposed between a light shielding electrode and a transparent electrode. The luminescent layer is of resin containing fluorescent particles dispersed therein and is obtained by deposition by a thick film technique. The electroluminescent device is further provided with a light shielding element and an optically transmissive area, both of which are formed between the linear light emitting elements.

Abstract: A light-source-incorporated image sensor in which a light receiving element formed on an insulating substrate is confronted through a light transmission layer with an EL light emitting element formed on a transparent substrate. In the image sensor, the thickness of the transparent substrate is smaller than that of the light transmission layer, whereby the focal depth can be set to a value which is sufficient in practical use.

Abstract: An image reading device in which light receiving elements formed on a first substrate are disposed in opposition to light emitting elements formed on a second substrate with a transparent layer being interposed therebetween. The transparent layer is made of a material whose reflectivity is smaller than that of the second substrate. In another embodiment, gas layers are provided between the transparent layer and the light emitting elements and the gas therein has an index of refraction less than the second substrate. Light transmitting windows provided in an opaque electrode of the light emitting elements have peripheral portions where no light is emitted.