Patents by Inventor Masao Nagamoto

Masao Nagamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component
    Patent number: 6167149
    Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted on a printed circuit board by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.
    Type: Grant
    Filed: June 8, 1999
    Date of Patent: December 26, 2000
    Assignee: Matsushita Electric Industrial Co.
    Inventors: Toshihiko Tsujikawa, Seiji Mizuoka, Masao Nagamoto
  • Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component
    Patent number: 5991435
    Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted on a printed circuit board by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.
    Type: Grant
    Filed: May 31, 1996
    Date of Patent: November 23, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihiko Tsujikawa, Seiji Mizuoka, Masao Nagamoto
  • Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component
    Patent number: 5555316
    Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.
    Type: Grant
    Filed: June 30, 1993
    Date of Patent: September 10, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihiko Tsujikawa, Seiji Mizuoka, Masao Nagamoto