Abstract: Provided is an anisotropic conductive film that allows conductive particles to be sufficiently captured even by connecting terminals disposed at a fine pitch and can suppress a short circuit, and in particular, that can suppress variation of conduction resistance of a connection portion even when partial contact is caused by a thermal pressing tool during anisotropic conductive connection. In an anisotropic conductive film 1A, an insulating adhesive layer 3 contains conductive particles 2. The conductive particles 2 have an aspect ratio of 1.2 or more and are dispersed without being in contact with each other as viewed in a plan view, and an angle formed between a film surface S of the anisotropic conductive film 1A and a major axis direction of each of the conductive particles 2 is less than 40°. The anisotropic conductive film 1A preferably contains columnar conductive glass particles as the conductive particles 2.

Abstract: An anisotropic electrically conductive film that is suitable for use in fine-pitch FOG connections and COG connections and that also can reduce increases in production costs associated with increasing the electrically conductive particle density. The anisotropic electrically conductive film includes an electrically insulating adhesive layer and electrically conductive particles disposed within the electrically insulating adhesive layer. The anisotropic electrically conductive film has electrically conductive particle disposition regions that are disposed in a manner corresponding to the arrangement of terminals of electronic components to be connected. The electrically conductive particle disposition regions are formed periodically in the longitudinal direction of the anisotropic electrically conductive film.

Abstract: A power module includes: an insulating layer; a first metallic plate disposed on the insulating layer; a first semiconductor chip disposed on the first metallic plate; a first adhesive insulating layer and a second adhesive insulating layer disposed on the first metallic plate; a first metallic land for main electrode wiring disposed on the first adhesive insulating layer; and a first metallic land for signal wiring disposed on the second adhesive insulating layer. There can be provided a power module having reduced cost, reduced warpage of the whole of a substrate, stabilized quality, and improved reliability; and a fabrication method for such a power module.

Abstract: A power conversion apparatus is for converting polyphase ac power directly to ac power. A conversion circuit includes a plurality of first switching devices 311, 313, 315 and a plurality of second switching devices 312, 314, 316 connected, respectively, with the phases R, S, T of the polyphase ac power, and configured to enable electrical switching operation in both directions. There are provided a plurality of condensers 821˜826 connected with the conversion circuit. At least one of the condensers is provided, for each of the first switching devices and the second switching devices, between two of the phases of the polyphase ac power. It is possible to reduce a wiring distance between the condenser and the switching devices.

Abstract: A power module includes: an insulating layer; a leadframe disposed on the insulating layer; a semiconductor chip disposed on the leadframe; and a mold resin formed so as to cover the semiconductor chip and at least a part of the metal layer, wherein a groove into which a part of the insulating layer is inserted is formed on a surface of the leadframe facing the insulating layer. Accordingly, there can be provided the power module with improved reliability so that the insulating layer and the leadframe may be hardly deviated from each other even if external force is applied thereon; and a fabrication method for such a power module.

Abstract: A power module includes: an insulating layer; a leadframe (metal layer) disposed on the insulating layer; a semiconductor chip disposed on the leadframe; and a mold resin formed so as to cover the semiconductor chip, at least a part of the metal layer, and at least a part of the insulating layer, wherein the insulating layer includes a relatively-soft insulating layer disposed at a side of the leadframe and a relatively-hard insulating layer disposed at an opposite side of the leadframes. Accordingly, there can be provided the power module with improved cooling capability and improved reliability, and the fabrication method for such a power module.

Abstract: Provided is a power converter 3 that directly converts polyphase AC power to AC power. A converter circuit has a plurality of first switching elements 311, 313 and 315 that are connected to each phase R, S or T of the polyphase AC power to enable switching for turning on current-carrying bidirectionally, and a plurality of second switching elements 312, 314 and 316 that are connected to each phase to enable switching for turning on current-carrying bidirectionally. The converter circuit comprises input lines R, S and T connected to each input terminal, and output lines P and N connected to each output terminal. Parts of wiring 347 and 348 of protection circuits 32 are located between output lines P and N. The wiring distance between each protection circuit 32 and the corresponding switching element can be shortened.

Abstract: Provided is a power converter 3 that directly converts polyphase AC power to AC power. A converter circuit has a plurality of switching elements 311, 313, 315, 312, 314 and 316 which are connected to each phase R, S or T of the polyphase AC power to enable switching for turning on current-carrying bidirectionally. At least three condensers 821 to 826 are provided between phases of the converter circuit. The three condensers are respectively placed at apexes of a triangle on a plane that is in parallel with a part-mounting surface on which the switching elements are actually mounted. The wiring distance between the condensers and the switching elements can be shortened.

Abstract: The power module includes: a first metallic circuit pattern, a semiconductor device disposed on the first metallic circuit pattern; a leadframe electrically connected to the semiconductor device; and a stress buffering layer disposed on an upper surface of the semiconductor device, and capable of buffering a CTE difference between the semiconductor device and the leadframe. The leadframe is connected to the semiconductor device via the stress buffering layer, a CTE of the stress buffering layer is equal to or less than a CTE of the leadframe, and a cross-sectional shape of the stress buffering layer is L-shape. There is provided: the power module capable of realizing miniaturization and large current capacity, and reducing cost thereof by using leadframe structure, and capable of reducing a variation in welding and improving a yield without damaging a semiconductor device; and a fabrication method for such a power module.

Abstract: Provided is a power converter 3 that directly converts polyphase AC power to AC power. A converter circuit has a plurality of first switching elements 311, 313 and 315 and a plurality of second switching elements 312, 314 and 316, both of which are connected to each phase R, S or T of the polyphase AC power to enable switching for turning on current-carrying bidirectionally. Condensers 821 to 826 are provided between phases. Input terminals of the first switching elements and those of the second switching elements are arranged to form respective lines. Some of the plurality of condensers 821 and 822 are arranged to be angled relative to the arrangement direction of the terminals. The wiring distance between the condensers and the switching elements can be shortened.

Abstract: There is disclosed a power conversion apparatus 3 for converting polyphase ac power directly to ac power. A conversion circuit includes a plurality of first switching devices 311, 313, 315 and a plurality of second switching devices 312, 314, 316 connected, respectively, with the phases R, S, T of the polyphase ac power, and configured to enable electrical switching operation in both directions. Output lines 331, 332 formed by a pair of busbars are connected with the conversion circuit. The first switching devices and the second switching devices are so arranged that output terminals are arranged in a row. The output lines 331, 332 are connected with the output terminals and drawn out rectilinearly in one direction.

Abstract: Two protrusions are disposed on the fixed contact along a lateral direction on a contacting surface. The two protrusions are disposed in a longitudinal direction with a predetermined interval on the contacting surface, and a planar portion is formed between the two protrusions. A single projection that intersects perpendicular to the two protrusions disposed on a first fixed contact and another single projection that intersects perpendicular to the two protrusions disposed on a second fixed contact are disposed on a movable contact. Thereby, when the movable contact contacts to a pair of fixed contacts, since the protrusions disposed on the fixed contact and the projections disposed on the movable contact contacts only at intersections of each other, a contacting surface pressure is increased and a crushing force for ice frozen on a surface of the fixed contact becomes large.

Abstract: A power module includes: an insulating layer; a first metallic plate disposed on the insulating layer; a first semiconductor chip disposed on the first metallic plate; a first adhesive insulating layer and a second adhesive insulating layer disposed on the first metallic plate; a first metallic land for main electrode wiring disposed on the first adhesive insulating layer; and a first metallic land for signal wiring disposed on the second adhesive insulating layer. There can be provided a power module having reduced cost, reduced warpage of the whole of a substrate, stabilized quality, and improved reliability; and a fabrication method for such a power module.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: An access point includes: detection means detecting radar signal; detection notification means notifying other access point of radar signal detection; assessment means assessing whether to own authority to determine channel used among access points; determination means determining channel used among access points when detection means detects radar signal or when other access point notifies of radar signal detection, when owning authority; channel notification means notifying other access point of the channel determined by determination means; and change means changing the channel used between other access point to either the channel determined by determination means or to a channel notified from other access point. When a plurality of access points detect radar signal, entire system is operable through new channel.

Abstract: A power module includes: an insulating layer; a leadframe (metal layer) disposed on the insulating layer; a semiconductor chip disposed on the leadframe; and a mold resin formed so as to cover the semiconductor chip, at least a part of the metal layer, and at least a part of the insulating layer, wherein the insulating layer includes a relatively-soft insulating layer disposed at a side of the leadframe and a relatively-hard insulating layer disposed at an opposite side of the leadframes. Accordingly, there can be provided the power module with improved cooling capability and improved reliability, and the fabrication method for such a power module.

Abstract: A power module includes: an insulating layer; a leadframe disposed on the insulating layer; a semiconductor chip disposed on the leadframe; and a mold resin formed so as to cover the semiconductor chip and at least a part of the metal layer, wherein a groove into which a part of the insulating layer is inserted is formed on a surface of the leadframe facing the insulating layer. Accordingly, there can be provided the power module with improved reliability so that the insulating layer and the leadframe may be hardly deviated from each other even if external force is applied thereon; and a fabrication method for such a power module.

Abstract: Two protrusions are disposed on the fixed contact along a lateral direction on a contacting surface. The two protrusions are disposed in a longitudinal direction with a predetermined interval on the contacting surface, and a planar portion is formed between the two protrusions. A single projection that intersects perpendicular to the two protrusions disposed on a first fixed contact and another single projection that intersects perpendicular to the two protrusions disposed on a second fixed contact are disposed on a movable contact. Thereby, when the movable contact contacts to a pair of fixed contacts, since the protrusions disposed on the fixed contact and the projections disposed on the movable contact contacts only at intersections of each other, a contacting surface pressure is increased and a crushing force for ice frozen on a surface of the fixed contact becomes large.

Abstract: An electric power conversion device comprises a conversion circuit having bi-directionally switchable plural pairs of switching elements connected to respective phases and converting an inputted AC power into an AC electric power. A first switching time is calculated using detected voltages detected by voltage sensors and an output command value. A second switching time is calculated using a carrier and the first switching time. A control signal generating section generates control signals to switch on and off of the switching elements using the first switching time and second switching time. In a case where a state is transited from the first switching time to the second switching time, a controller turns off one of on a state switching elements of either one of an upper arm circuit or a lower arm circuit and maintains on state of the other of the on state switching elements of the other arm circuit.

Abstract: An electric power conversion device comprises a conversion circuit having bi-directionally switchable plural pairs of switching elements connected to respective phases and converting an inputted AC power into an AC electric power. A first switching time is calculated using detected voltages detected by voltage sensors and an output command value. A second switching time is calculated using a carrier and the calculated first switching time. The second switching time is such that, in one period of the alternating current electric power outputted from the conversion circuit, the second switching time included in a first half period of the one period is equal to the second switching time included in a second half period of the one period.