Abstract: Provided is a rare-earth anisotropic magnet powder capable of achieving high magnetic properties while reducing the usage of Nd and Pr. The present invention provides a rare-earth anisotropic magnet powder comprising magnetic particles that contain rare-earth elements, boron, and a transition metal element. The rare-earth elements include a first rare-earth element that comprises Ce and/or La and a second rare-earth element that comprises Nd and/or Pr. The rare-earth elements have a first ratio (R1/Rt) of 5% to 57%. The first ratio (R1/Rt) is a ratio of an amount (R1) of the first rare-earth element to a total amount (Rt) of the rare-earth elements in terms of the number of atoms. The first rare-earth element has a La ratio (La/R1) of 0% to 35%. The La ratio (La/R1) is a ratio of an amount of La to the amount (R1) of the first rare-earth element in terms of the number of atoms. The magnetic particles have a Ga content of 0.35 at % or less with respect to 100 at % as a whole.

Abstract: [Problem to be Solved] To provide an antenna which can be used in a wide band. [Solution] An antenna 10A includes a dielectric substrate 11, an unbalanced power supply member 12 having a non-power supply unit 23 and a power supply unit 24, a resonance conductor 13 having a connection area 26, a first resonance area 27 and a second resonance area 28, a grounding conductor 14 having a first ground area 32 and a second ground area 33, and a radiation conductor 15 having a first radiation area 37 and a second radiation area 38. At the antenna 10A, first to third radiation stepped portions 42a to 42c are formed at a first rear end portion 41 of the second radiation area 38, and first to third radiation stepped portions 44a to 44c are formed at a second rear end portion 43 of the second radiation area 38.

Abstract: [Problem to be Solved] To provide an antenna which can be used in a wide band. [Solution] An antenna 10A includes a dielectric substrate 11, an unbalanced power supply member 12 having a non-power supply unit 23 and a power supply unit 24, a resonance conductor 13 having a connection area 26, a first resonance area 27 and a second resonance area 28, a grounding conductor 14 having a first ground area 32 and a second ground area 33, and a radiation conductor 15 having a first radiation area 37 and a second radiation area 38. At the antenna 10A, first to third radiation stepped portions 42a to 42c are formed at a first rear end portion 41 of the second radiation area 38, and first to third radiation stepped portions 44a to 44c are formed at a second rear end portion 43 of the second radiation area 38.

Abstract: A semiconductor device (semiconductor module) includes a circuit board (module board) and a semiconductor element mounted on the circuit board. A shielding layer that blocks electromagnetic waves is disposed on the upper surface of the semiconductor element, and an antenna element is disposed over the shielding layer. The semiconductor element and the antenna element are electrically connected to each other by a connecting portion. This structure enables the semiconductor device to be reduced in size and to have both an electromagnetic-wave blocking function and an antenna function.

Abstract: The present invention provides a semiconductor device including: a semiconductor chip; a lead frame provided with a recessed portion on at least one of an upper surface or a lower surface thereof, and electrically coupled to the semiconductor chip; and a resin section that molds the semiconductor chip and the lead frame, and is provided with an opening above the recessed portion. By inserting a conductive pin (not shown) into the recessed portion through the opening, a plurality of semiconductor devices can be mechanically and electrically coupled to each other.

Abstract: An antenna includes a dielectric substrate and an antenna element. The antenna element includes a power feeding element and a reference potential element. The power feeding element includes a first conductive layer formed over the dielectric substrate, the first conductive layer extending in a first direction and having a first length along the first direction. The reference potential element includes a second conductive layer formed over the dielectric substrate, the second conductive layer extending in a second direction opposed to the first direction from a second position, the second point being apart by a first distance from a first position on an end of the first conductive layer, and a third conductive layer formed over the dielectric substrate, the third conductive element extending from the second point in the first direction apart by a second distance from the first conductive layer and having a third length along the first direction.

Abstract: A circuit substrate is presented. The circuit substrate comprises internal terminal electrode 2; a substrate 1; a wiring layer 21 formed on a portion of the surface of the substrate and having one end thereof connected to the internal terminal electrode; an insulating film contacting as a surface with the wiring layer; and an external terminal electrode 9 connected to the other end of the wiring layer and used for connecting to the exterior. The angle of the cross-section of the wiring layer taken perpendicularly to the surface of the substrate in the edge portion that the wiring layer contains is 55° (55 degree) or less, and the wiring layer that contains multiple mutually independent columnar crystals extending perpendicularly in a direction different from the direction of the surface of the substrate.

Abstract: A semiconductor device (semiconductor module) includes a circuit board (module board) and a semiconductor element mounted on the circuit board. A shielding layer that blocks electromagnetic waves is disposed on the upper surface of the semiconductor element, and an antenna element is disposed over the shielding layer. The semiconductor element and the antenna element are electrically connected to each other by a connecting portion. This structure enables the semiconductor device to be reduced in size and to have both an electromagnetic-wave blocking function and an antenna function.

Abstract: An antenna that can be used in a wide band and can arbitrarily adjust the working frequency band to a higher or lower frequency band includes a resonant conductor tube located on the outside of a feeding section of an unbalanced feed member and covering the feeding section, a ground conductor tube located on the outside of a passive section of the unbalanced feed member and covering the passive section, and a connection conductor guide located between the conductor tubes and the unbalanced feed member. In the antenna, the conductor tubes and the unbalanced feed member are electrically fixed to the connection conductor guide via a fixing unit, and the feeding section of the unbalanced feed member has an exposed portion with a predetermined size, the exposed portion exposed from the resonant conductor tube outward in the length direction thereof.

Abstract: A circuit substrate is presented. The circuit substrate comprises internal terminal electrode 2; a substrate 1; a wiring layer 21 formed on a portion of the surface of the substrate and having one end thereof connected to the internal terminal electrode; an insulating film contacting as a surface with the wiring layer; and an external terminal electrode 9 connected to the other end of the wiring layer and used for connecting to the exterior. The angle of the cross-section of the wiring layer taken perpendicularly to the surface of the substrate in the edge portion that the wiring layer contains is 55° (55 degree) or less, and the wiring layer that contains multiple mutually independent columnar crystals extending perpendicularly in a direction different from the direction of the surface of the substrate.

Abstract: An antenna device, including a radiating element having a feed portion and a floating conduction member, which is provided between the radiating element and a conduction board having a high-frequency signal source which generates high-frequency signals for supplying to the feed portion, and which is electrically floated.

Abstract: A feed element and a parasitic element are formed on the ends of a board. The feed element is formed on the surface of the board, and the parasitic element is formed on the back of the board. A circuit region of the board is mounted with a radio communication circuit. The feed element is connected with a signal line, and the parasitic element is connected with a GND line. A slit is provided between the feed element and the circuit region, and a slit is provided between the parasitic element and the circuit element.

Abstract: An antenna includes a dielectric substrate and an antenna element. The antenna element includes a power feeding element and a reference potential element. The power feeding element includes a first conductive layer formed over the dielectric substrate, the first conductive layer extending in a first direction and having a first length along the first direction. The reference potential element includes a second conductive layer formed over the dielectric substrate, the second conductive layer extending in a second direction opposed to the first direction from a second position, the second point being apart by a first distance from a first position on an end of the first conductive layer, and a third conductive layer formed over the dielectric substrate, the third conductive element extending from the second point in the first direction apart by a second distance from the first conductive layer and having a third length along the first direction.

Abstract: An antenna includes a substrate made of a dielectric material, a first different dielectric constant region having a dielectric constant different from a dielectric constant of said substrate provided in said substrate, and a first antenna element provided on a front surface of said substrate.

Abstract: An antenna device, including a radiating element having a feed portion and a floating conduction member, which is provided between the radiating element and a conduction board having a high-frequency signal source which generates high-frequency signals for supplying to the feed portion, and which is electrically floated.

Abstract: A feed element and a parasitic element are formed on the ends of a board. The feed element is formed on the surface of the board, and the parasitic element is formed on the back of the board. A circuit region of the board is mounted with a radio communication circuit. The feed element is connected with a signal line, and the parasitic element is connected with a GND line. A slit is provided between the feed element and the circuit region, and a slit is provided between the parasitic element and the circuit element.

Abstract: A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

Abstract: A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

Abstract: A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

Abstract: A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.