Patents by Inventor Masao Tomikawa
Masao Tomikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7977028Abstract: The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.Type: GrantFiled: April 18, 2006Date of Patent: July 12, 2011Assignee: Toray Industries, Inc.Inventors: Tomoyuki Yuba, Yoji Fujita, Masao Tomikawa
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Publication number: 20100285404Abstract: Disclosed is a method for producing polyamide, wherein a diimidazolide compound represented by the general formula (1) shown below is reacted with a diamine compound represented by the general formula (2) shown below. The present invention provides a method for producing a chlorine-free high molecular weight alkali-soluble polyamide by simple process.Type: ApplicationFiled: September 4, 2008Publication date: November 11, 2010Inventors: Tomoyuki Yuba, Masao Tomikawa
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Publication number: 20090123867Abstract: The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.Type: ApplicationFiled: April 18, 2006Publication date: May 14, 2009Applicant: TORAY INDUSTRIES, INC.Inventors: Tomoyuki Yuba, Yoji Fujita, Masao Tomikawa
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Patent number: 7455948Abstract: This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if the film formed from the resin is thick. Furthermore, this invention relates to a photosensitive resin composition comprising (a) a polymer having one or more phenolic hydroxyl groups, (b) a compound having a phenolic hydroxyl group and containing only one group selected from a methylol group and alkoxymethyl group, and (c) a photo acid generator.Type: GrantFiled: November 16, 2005Date of Patent: November 25, 2008Assignee: Toray Industries, Inc.Inventors: Ryuichiro Taniguchi, Tomoyuki Yuba, Masao Tomikawa
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Patent number: 7214455Abstract: The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling point at atmospheric pressure of 100° C. or higher and 140° C. or lower, the content of the component (c) being 50% by weight or more and 100% by weight or less based on the total amount of the organic solvent, and to a process for producing a heat-resistant resin film using the same. According to the present invention, there is provided a photosensitive resin composition which is less likely to cause defects such as transcribed trace and line drawing.Type: GrantFiled: May 28, 2003Date of Patent: May 8, 2007Assignee: Toray Industries, Inc.Inventors: Kazuto Miyoshi, Ryoji Okuda, Masao Tomikawa
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Publication number: 20060110680Abstract: This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if the film formed from the resin is thick. Furthermore, this invention relates to a photosensitive resin composition comprising (a) a polymer having one or more phenolic hydroxyl groups, (b) a compound having a phenolic hydroxyl group and containing only one group selected from a methylol group and alkoxymethyl group, and (c) a photo acid generator.Type: ApplicationFiled: November 16, 2005Publication date: May 25, 2006Applicant: Toray Industries, Inc.Inventors: Ryuichiro Taniguchi, Tomoyuki Yuba, Masao Tomikawa
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Publication number: 20050202337Abstract: The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling point at atmospheric pressure of 100° C. or higher and 140° C. or lower, the content of the component (c) being 50% by weight or more and 100% by weight or less based on the total amount of the organic solvent, and to a process for producing a heat-resistant resin film using the same. According to the present invention, there is provided a photosensitive resin composition which is less likely to cause defects such as transcribed trace and line drawing.Type: ApplicationFiled: May 28, 2003Publication date: September 15, 2005Applicant: TORAY INDUSTRIES, INC.Inventors: Kazuto Miyoshi, Ryoji Okuda, Masao Tomikawa
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Patent number: 6933087Abstract: A positive photosensitive resin precursor composition which can be can be developed in an alkaline developer is provided. The positive photosensitive resin precursor composition comprises (a), one of (b1) and (b2), and (c): (a) a polyamic acid ester and/or a polyamic acid polymer, both of which are soluble in an alkaline aqueous solution; (b1) a phenolic-hydroxyl-group-containing thermally crosslinkable compound comprising an organic-group-R1-substituted methylol group represented by formula (1) (wherein R1 is not a hydrogen atom), CH2—OR1)??(1); (b2) a thermally crosslinkable compound containing a ureal organic group substituted by an organic group R1 and represented by formula (2) (c) an esterified quinone diazide compound.Type: GrantFiled: February 21, 2002Date of Patent: August 23, 2005Assignee: Toray Industries, Inc.Inventors: Mitsuhito Suwa, Kazuto Miyoshi, Masao Tomikawa
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Patent number: 6929890Abstract: Disclosed is a positive-type photosensitive resin composition comprising: (a) an alkali-soluble resin; (b) a quinone diazide compound; (c) a heatsensitive compound which colors upon being heated and which shows an absorption maximum at a wavelength of not less than 350 nm and not more than 700 nm; and (d) a compound which does not have an absorption maximum at a wavelength of not less than 350 nm to less than 500 nm, and has an absorption maximum at a wavelength of not less than 500 nm and not more than 750 nm. The composition is preferably used for forming light-blocking separators or black matrices of organic electroluminescent devices and liquid crystal display elements.Type: GrantFiled: April 7, 2004Date of Patent: August 16, 2005Assignee: Toray Industries, Inc.Inventors: Kazuto Miyoshi, Ryoji Okuda, Masao Tomikawa
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Patent number: 6887643Abstract: A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): R1 represents an alkyl group having a carbon number in the range of 1 to 3. R2, R3, R4, and R5 each represent hydrogen or an alkyl group having a carbon number in the range of 1 to 3, and l represents an integer in the range of 0 to 3.Type: GrantFiled: July 22, 2003Date of Patent: May 3, 2005Assignee: Toray Industries, Inc.Inventors: Yoji Fujita, Mitsuhito Suwa, Masao Tomikawa
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Publication number: 20040197703Abstract: Disclosed is a positive-type photosensitive resin composition comprising: (a) an alkali-soluble resin; (b) a quinone diazide compound; (c) a heatsensitive compound which colors upon being heated and which shows an absorption maximum at a wavelength of not less than 350 nm and not more than 700 nm; and (d) a compound which does not have an absorption maximum at a wavelength of not less than 350 nm to less than 500 nm, and has an absorption maximum at a wavelength of not less than 500 nm and not more than 750 nm. The composition is preferably used for forming light-blocking separators or black matrices of organic electroluminescent devices and liquid crystal display elements.Type: ApplicationFiled: April 7, 2004Publication date: October 7, 2004Applicant: Toray Industries, Inc.Inventors: Kazuto Miyoshi, Ryoji Okuda, Masao Tomikawa
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Publication number: 20040170914Abstract: The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali.Type: ApplicationFiled: March 3, 2004Publication date: September 2, 2004Inventors: Masao Tomikawa, Naoyo Okamoto, Satoshi Yoshida, Ryoji Okuda
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Patent number: 6723484Abstract: The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali. (R1 is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R2 is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R3 is hydrogen or an organic group with from 1 to 10 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p+q>0).Type: GrantFiled: May 8, 2000Date of Patent: April 20, 2004Assignee: Toray Industries, Inc.Inventors: Masao Tomikawa, Naoyo Okamoto, Satoshi Yoshida, Ryoji Okuda
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Publication number: 20040053156Abstract: A photosensitive resin precursor composition exhibiting an excellent film thickness uniformity contains: a heat resistant resin precursor polymer; a radiation sensitive compound; and a solvent expressed by formula (1): 1Type: ApplicationFiled: July 22, 2003Publication date: March 18, 2004Applicant: Toray Industries, Inc.Inventors: Yoji Fujita, Mitsuhito Suwa, Masao Tomikawa
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Patent number: 6696112Abstract: A display device having a polyimide insulating layer is disclosed. The display device has a first electrode formed on a substrate, the polyimide insulating layer formed on the first electrode in such a way that the first electrode is partially exposed, and a second electrode facing the first electrode, wherein the polyimide insulating layer is a positive-type photosensitive polyimide.Type: GrantFiled: February 28, 2002Date of Patent: February 24, 2004Assignee: Toray Industries, Inc.Inventors: Ryoji Okuda, Shigeo Fujimori, Tetsuo Oka, Masao Tomikawa
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Publication number: 20030194631Abstract: A positive photosensitive resin precursor composition which can be can be developed in an alkaline developer is provided.Type: ApplicationFiled: March 3, 2003Publication date: October 16, 2003Inventors: Mitsuhito Suwa, Kazuto Miyoshi, Masao Tomikawa
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Patent number: 6593043Abstract: A composition of a positive photosensitive resin precursor includes (a) a polyamic acid ester and/or a polyamic acid each having at least one selected from a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group at the end of a principal chain of the polymer, (b) a compound having a phenolic hydroxyl group, and (c) a quinonediazide sulfnate. The composition can be subjected to dissolution in an alkaline developer.Type: GrantFiled: November 1, 2001Date of Patent: July 15, 2003Assignee: Toray Industries, Inc.Inventors: Mitsuhito Suwa, Kazuto Miyoshi, Masao Tomikawa
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Patent number: 6524764Abstract: The present invention relates to a positive type photosensitive resin precursor composition which is characterized in that it contains polymer having, as its chief component, structural units represented by the following general formula (1) and, furthermore, in that it satisfies the following conditions (a) and/or (b). The invention provides an alkali-developable photosensitive composition. (a) There is included an ester of a naphthoquinone diazide sulphonic acid and a phenol compound of dipole moment 0.1 to 1.Type: GrantFiled: January 29, 2001Date of Patent: February 25, 2003Assignee: Toray Industries, Inc.Inventors: Masao Tomikawa, Mitsuhito Suwa, Yoji Fujita
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Publication number: 20020162998Abstract: The display device of the present invention relates to a display device characterized in that it includes a first electrode formed on a substrate, an insulating layer formed on the first electrode in such a way that the first electrode is partially exposed, and a second electrode providing facing the first electrode, and the insulating layer is a positive-type photosensitive polyimide in which the indispensable components are polymer having structural units represented by the following general formula (1) as its chief component and a photoacid generator.Type: ApplicationFiled: February 28, 2002Publication date: November 7, 2002Inventors: Ryoji Okuda, Shigeo Fujimori, Tetsuo Oka, Masao Tomikawa
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Publication number: 20020090564Abstract: A composition of a positive photosensitive resin precursor includes (a) a polyamic acid ester and/or a polyamic acid each having at least one selected from a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group at the end of a principal chain of the polymer, (b) a compound having a phenolic hydroxyl group, and (c) a quinonediazide sulfnate. The composition can be subjected to dissolution in an alkaline developer.Type: ApplicationFiled: November 1, 2001Publication date: July 11, 2002Inventors: Mitsuhito Suwa, Kazuto Miyoshi, Masao Tomikawa