Abstract: In order to provide an improved hybrid IC having a high density, compact in size, capable of being manufactured with a reduced cost, a hybrid IC of the present invention, comprises: a circuit board 2 having formed on the surface thereof a plurality of electrode patterns, and mounting on the same surface a plurality of electronic elements 3; a plurality of connection terminals 4 each formed into a generally rectangular frame structure including mutually facing first and second lateral plates, and mutually facing first and second longitudinal plates. In particular, one of the first and second lateral plates of each connection terminal 4 is fixedly connected to a connection electrode 2a on the circuit board 2. With the use of such structure, it is allowed to dispense with a process of solely connecting the connection terminals, thereby reducing the time and hence the cost for manufacturing a hybrid IC.

Abstract: A resistor trimming method includes the steps of: forming a first slit from an edge of a resistor interconnecting first and second electrodes provided on an insulating substrate in the proximity of and parallel to the first electrode; forming a second slit as a continuation of the first slit toward to the second electrode perpendicularly to the first slit; forming a third slit from a point of the edge of the resistor and parallel to the first electrode, the point being shifted from the first slit toward the second electrode, the third slit having a greater length than the first slit in a direction along the first electrode; and forming a fourth slit as a continuation of the third slit toward to the second electrodes perpendicularly to the first slit.

Abstract: An electrode of a conductive material containing silver and a thick-film resistor of an electric resistive material containing cermet, which is electrically connected to the electrode, are formed on an electric insulating substrate by printing respectively. Then, the thick-film resistor is directly irradiated with a laser beam to be trimmed, and thereafter a protective film of an electric insulating material containing resin is formed on the insulating substrate by printing, to cover the electrode and the thick-film resistor.

Abstract: An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.