Abstract: Along with higher performance of products, materials are also required to achieve both a high strength and favorable magnetic properties according to applications of products. Therefore, the present invention provides an Fe—Co-based alloy bar which enables both a high strength and favorable magnetic properties to be achieved. An Fe—Co-based alloy bar contains 30% to 80% of crystal grains having a grain orientation spread (GOS) value of 0.5° or more in terms of an area ratio, and having an average crystal grain size number of more than 8.5 and 12.0 or less. The Fe—Co-based alloy bar of the present invention has a high 0.2% yield strength after magnetic annealing so that it can support various high-strength applications.

Abstract: The present invention provides an Fe—Co-based alloy bar which enables excellent magnetic properties to be reliably obtained. In the Fe—Co-based alloy bar, an area ratio of crystal grains having a grain orientation spread (GOS) value of 0.5° or more exceeds 80%, and the difference between an area ratio of crystal grains having a GOS value of 0.5° or more observed in a cross section in a direction perpendicular to an axis of the bar and an area ratio of crystal grains having a GOS value of 0.5° or more observed in a cross section in an axial direction of the bar is within 10%. Preferably, the average crystal grain size number is 6.0 or more and 8.5 or less.

Abstract: An Fe—Co-based alloy bar and a method for manufacturing same, whereby excellent magnetic properties can be reliably obtained. The method for manufacturing an Fe—Co-based alloy bar comprises a heating straightening step for applying tensile stress to a hot-rolled material of an Fe—Co-based alloy while heating the hot-rolled material to a temperature of 500-900° C. Preferably, ohmic heating is used as a heating means in the heating straightening step. In addition, the Fe—Co-based alloy bar has 20% or more by area ratio of crystal grains having a grain orientation spread (GOS) value of at least 0.5°.

Abstract: This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10?6 (K?1) or less are bonded.

Abstract: This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10?6 (K?1) or less are bonded.

Abstract: A semi-hard magnetic material that is formed with equal to or more than 5.0% but less than 13.0% of Ni by mass, equal to or more than 0.5% but equal to or less than 4.0% of Mn by mass, more than 0% but equal to or less than 3.0% of Al by mass, more than 0% but equal to or less than 1.0% of Ti by mass and a remainder of Fe and an impurity, that has a coercivity of 1000 to 2400 A/m and that has a residual magnetic flux density of 1.3 T or more. A method of manufacturing the above semi-hard magnetic material wherein the material is a thin plate having a thickness of 0.030 to 0.30 mm and, after a cold rolling, performing an aging treatment on the thin plate at a temperature of 520° C. to 680° C.

Abstract: A semi-hard magnetic material that is formed with equal to or more than 5.0% but less than 13.0% of Ni by mass, equal to or more than 0.5% but equal to or less than 4.0% of Mn by mass, more than 0% but equal to or less than 3.0% of Al by mass, more than 0% but equal to or less than 1.0% of Ti by mass and a remainder of Fe and an impurity, that has a coercivity of 1000 to 2400 A/m and that has a residual magnetic flux density of 1.3 T or more. A method of manufacturing the above semi-hard magnetic material wherein the material is a thin plate having a thickness of 0.030 to 0.30 mm and, after a cold rolling, performing an aging treatment on the thin plate at a temperature of 520° C. to 680° C.

Abstract: Disclosed is a Pb-free solder alloy consisting of, in mass %, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5?Cu/Ni?100, and the balance of Sn and unavoidable impurities. The solder alloy preferably contains, in mass %, 0.3-1.2% of Ag and 0.01-0.04% of Ni. Also disclosed is a solder ball obtained by spheroidizing the solder alloy. In addition, the solder alloy is suitable for a solder joint onto an Ni electrode. The solder alloy has excellent drop impact resistance, while being suppressed in decrease of joining strength under high temperature conditions for a long time.

Abstract: A solder alloy is provided, which consists of, by mass %: 0.6 to 0.75% of Cu; 0.3 to 1.5% of Ag; more than 0.01% but not more than 0.1% of Ge; and the balance being Sn and incidental impurities. Preferably an amount of Ag is 0.5 to 1 mass % Preferably, an amount of Ge is more than 0.01 mass % but not more than 0.06 mass %. The solder alloy is preferably spherically formed into a solder ball. A solder joint in which the solder alloy is joined to a Ni electrode is also provided.