Patents by Inventor Masaru Kamoshida

Masaru Kamoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230189464
    Abstract: Provided are a case having a structure with a high degree of freedom in the adjustment of natural vibration and capable of suppressing vibration without excessively increasing the weight, and an electronic device equipped with the same. A case 3 includes a case body 10 having an accommodating space 10b capable of accommodating a circuit substrate 2 and being opened to one side, and a cover 20 attached to the case body 10 so as to close the opening of the case body 10. The cover 20 includes an annular first region portion 21 in contact with the case body 10, a second region portion 22 located on an inner peripheral side of the first region portion 21, a third region portion 23 located between the first region portion 21 and the second region portion 22 and connected to the first region portion 21 and the second region portion 22, and a rib 25 extending on the third region portion 23 and connected to the second region portion 22.
    Type: Application
    Filed: February 5, 2021
    Publication date: June 15, 2023
    Inventors: Naoya MITSUHASHI, Akira INOUE, Masaru KAMOSHIDA
  • Publication number: 20230015460
    Abstract: An electric circuit device includes: a first electric component; a first case that accommodates the first electric component and has a cooling channel for cooling the first electric component and a discharge port of the cooling channel; a second case that accommodates a second electric component and has a communication channel that communicates with a discharge port of the cooling channel; a first seal portion that is provided in a peripheral edge part of a discharge port of the cooling channel and seals the first case and the first electric component; a second seal portion that is provided outside the first seal portion with respect to a discharge port of the cooling channel and seals the first case and the first electric component; a through hole that is provided in the first case between the first seal portion and the second seal portion of and penetrates the first case from the first electric component side to the second case side; and a wall that is provided on one of the first case and the second case t
    Type: Application
    Filed: December 10, 2020
    Publication date: January 19, 2023
    Applicants: HITACHI ASTEMO, LTD., HONDA MOTOR CO., LTD.
    Inventors: Akihiro GOTO, Keiichi TADOKORO, Morio KUWANO, Masaru KAMOSHIDA, Fusanori NISHIKIMI, Tomoyuki SUZUKI
  • Patent number: 11370372
    Abstract: An electronic control device comprises at least three connectors, a case, and a board. The case has at least three openings through which the connectors are inserted, the connectors are provided on a plane. The board is housed inside the case and to the connectors are electrically connected thereto. The at least three openings includes a first opening, a second opening, and a third opening. The third opening is disposed between the first opening and the second opening. The case includes the first, second, and third openings, and a heat dissipation fin or a rib provided between the first opening and the second opening.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: June 28, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Toshikazu Shigyo, Masaru Kamoshida
  • Patent number: 11266044
    Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: March 1, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Isamu Yoshida, Masaru Kamoshida, Toshikazu Shigyo, Shiro Yamashita
  • Patent number: 11166396
    Abstract: Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board 12, a base 13, and a cover 14. In addition, a first heat radiating coating layer 31 is formed on at least one surface of the circuit board 12, and a second heat radiating coating layer 32 is formed on an inner surface of one or both of the base 13 and the cover 14 facing the first heat radiating coating layer 31.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: November 2, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki Ito, Toshiaki Ishii, Masaru Kamoshida, Hideto Yoshinari, Masato Saito, Akitoyo Konno
  • Patent number: 10967818
    Abstract: Provided is an in-vehicle control device which is able to protect a seal material even when being interposed by a fixing member which is fixed to a vehicle while suppressing the protruding of the seal material toward an inner space. The in-vehicle control device includes a first housing (20), a second housing (30) which is fixed to face the first housing (20), and a seal material (40) which seals the inner space which is disposed between a flange of the first housing (20) and a flange of the second housing (30) and is formed by the first housing (20) and the second housing (30). The first housing (20) includes a shape (22) (bank-shaped portion) which is disposed on a side near an inner space (11) from the seal material (40), faces the flange of the second housing (30), and suppresses the moving of the seal material (40) toward the inner space (11).
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 6, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Toshikazu Shigyo, Masaru Kamoshida
  • Publication number: 20200352056
    Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.
    Type: Application
    Filed: October 12, 2018
    Publication date: November 5, 2020
    Inventors: Isamu YOSHIDA, Masaru KAMOSHIDA, Toshikazu SHIGYO, Shiro YAMASHITA
  • Patent number: 10821921
    Abstract: The objective of the present invention is to provide an electronic control device with which it is possible to improve the flow of hot water, during molding, between openings through which connectors penetrate, in a case of an electronic control device, the size of which has increased as a result of an increase in the level of functionality of the electronic control device, while suppressing deformation of said case. There are at least three connectors. At least three openings through which the connectors are inserted are provided in one plane in a case. A printed circuit board is housed inside the case, and the connectors are electrically connected thereto. The third opening is disposed between the first opening and the second opening. The third opening is disposed in a position furthest from a center C of a plane, in the longitudinal direction of the case.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: November 3, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Toshikazu Shigyo, Masaru Kamoshida
  • Publication number: 20200223382
    Abstract: An electronic control device comprises at least three connectors, a case, and a board. The case has at least three openings through which the connectors are inserted, the connectors are provided on a plane. The board is housed inside the case and to the connectors are electrically connected thereto. The at least three openings includes a first opening, a second opening, and a third opening. The third opening is disposed between the first opening and the second opening. The case includes the first, second, and third openings, and a heat dissipation fin or a rib provided between the first opening and the second opening.
    Type: Application
    Filed: March 26, 2020
    Publication date: July 16, 2020
    Inventors: Toshikazu SHIGYO, Masaru KAMOSHIDA
  • Patent number: 10601158
    Abstract: There is a problem that an oxide film or high resistance abrasion powder is formed at the contact interface due to micro sliding abrasion in a high temperature environment or temperature cycle to increase the contact resistance at the contact portion of a non-noble metal connection terminal. Provided is an in-vehicle electronic module, a connector, and a connection structure thereof, which have the same connection reliability as noble metals even when exposed to a harsh environment and can reduce cost of members.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: March 24, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryouichi Kajiwara, Toshiaki Ishii, Masaru Kamoshida
  • Patent number: 10568226
    Abstract: It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: February 18, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Yukio Sakigawa, Shigeharu Tsunoda, Masaru Kamoshida, Shirou Oouchi
  • Patent number: 10507617
    Abstract: A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: December 17, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Wataru Sawada, Masaru Kamoshida, Toshikazu Shigyo
  • Patent number: 10238012
    Abstract: An electronic control device is provided with a resin base, a substrate, and a resin cover. The resin base has at least one opening part. The resin cover formed in a cylindrical shape with a bottom is fixed on an inner surface of the resin base forming the opening part. The resin cover has a slit. The substrate has a card edge connector to be inserted into the slit. An electronic component is mounted on the substrate.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: March 19, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD
    Inventors: Yoshinori Wakana, Masaru Kamoshida, Takeshi Igarashi, Kiyotaka Kanno
  • Publication number: 20190027848
    Abstract: There is a problem that an oxide film or high resistance abrasion powder is formed at the contact interface due to micro sliding abrasion in a high temperature environment or temperature cycle to increase the contact resistance at the contact portion of a non-noble metal connection terminal. Provided is an in-vehicle electronic module, a connector, and a connection structure thereof, which have the same connection reliability as noble metals even when exposed to a harsh environment and can reduce cost of members.
    Type: Application
    Filed: December 22, 2016
    Publication date: January 24, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Ryouichi KAJIWARA, Toshiaki ISHII, Masaru KAMOSHIDA
  • Publication number: 20180352670
    Abstract: It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.
    Type: Application
    Filed: October 7, 2016
    Publication date: December 6, 2018
    Inventors: Satoshi ARAI, Yukio SAKIGAWA, Shigeharu TSUNODA, Masaru KAMOSHIDA, Shirou OOUCHI
  • Publication number: 20180222408
    Abstract: Provided is an in-vehicle control device which is able to protect a seal material even when being interposed by a fixing member which is fixed to a vehicle while suppressing the protruding of the seal material toward an inner space. The in-vehicle control device includes a first housing (20), a second housing (30) which is fixed to face the first housing (20), and a seal material (40) which seals the inner space which is disposed between a flange of the first housing (20) and a flange of the second housing (30) and is formed by the first housing (20) and the second housing (30). The first housing (20) includes a shape (22) (bank-shaped portion) which is disposed on a side near an inner space (11) from the seal material (40), faces the flange of the second housing (30), and suppresses the moving of the seal material (40) toward the inner space (11).
    Type: Application
    Filed: July 27, 2016
    Publication date: August 9, 2018
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Toshikazu SHIGYO, Masaru KAMOSHIDA
  • Patent number: 9949394
    Abstract: The purpose of the present invention is to provide a motor vehicle internal combustion engine control apparatus which is constructed as a waterproof structure capable of having a long life while minimizing an increase in surface area of a case and a cover, thereby enabling miniaturization, decrease in cost, and increase in reliability to be satisfied. The motor vehicle internal combustion engine control apparatus is equipped with a substrate, a connector, and a case and cover which enclose the substrate, a waterproofing adhesive being disposed at a junction part between the cover and the case. Recessed portions are disposed at the junction part between the case and the cover.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: April 17, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masaru Kamoshida, Yoshinori Wakana
  • Publication number: 20170334375
    Abstract: The objective of the present invention is to provide an electronic control device with which it is possible to improve the flow of hot water, during molding, between openings through which connectors penetrate, in a case of an electronic control device, the size of which has increased as a result of an increase in the level of functionality of the electronic control device, while suppressing deformation of said case. There are at least three connectors. At least three openings through which the connectors are inserted are provided in one plane in a case. A printed circuit board is housed inside the case, and the connectors are electrically connected thereto. The third opening is disposed between the first opening and the second opening. The third opening is disposed in a position furthest from a center C of a plane, in the longitudinal direction of the case.
    Type: Application
    Filed: January 8, 2016
    Publication date: November 23, 2017
    Inventors: Toshikazu SHIGYO, Masaru KAMOSHIDA
  • Publication number: 20170326812
    Abstract: A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.
    Type: Application
    Filed: September 29, 2015
    Publication date: November 16, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Satoshi ARAI, Shigeharu TSUNODA, Wataru SAWADA, Masaru KAMOSHIDA, Toshikazu SHIGYO
  • Patent number: 9743539
    Abstract: There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: August 22, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryouichi Kajiwara, Masaru Kamoshida, Toshiaki Ishii