Patents by Inventor Masaru Matsushima
Masaru Matsushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240177963Abstract: To provide a technique of the above charged particle beam apparatus, a technique that can prevent the lowering of apparatus performance due to the influence of vibration and noise by an air blower (fan). The charged particle beam apparatus includes a body device that is provided in a body cover, a plurality of air blowers that are provided on the body cover, and a controller that controls the plurality of air blowers. The body device has a stage on which a sample is placed, and a microscope that images the sample. The controller obtains an image obtained by imaging the sample by the microscope, obtains vibration information from the image, compares the vibration information and a specification value, and on the basis of the result of the comparison, controls the numbers of rotations of the plurality of air blowers.Type: ApplicationFiled: November 13, 2023Publication date: May 30, 2024Inventors: Yuki UCHIOKE, Masaru Matsushima, Masaki Mizuochi, Go Miya, Katsumi Kambe
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Patent number: 10233361Abstract: A pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer, at least a surface (?) of the resin layer being opposite to the side of the substrate or being opposite to the side which the release material is provided, having pressure sensitive adhesiveness, the surface (?) having one or more concave portions, the concave portions having irregular shapes. The pressure sensitive adhesive sheet has an excellent air escape property capable of easily removing air accumulation that may be formed on attaching to an adherend, and is excellent in pressure sensitive adhesion characteristics.Type: GrantFiled: April 2, 2015Date of Patent: March 19, 2019Assignee: LINTEC CORPORATIONInventors: Kiichiro Kato, Kazue Uemura, Yumiko Amino, Shigeru Saito, Masaru Matsushima
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Patent number: 10221338Abstract: Provided is a pressure sensitive adhesive sheet containing a resin layer on a substrate or a release material, at least a surface (?) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein, when a smooth surface of a light transmissive adherend having a smooth surface is attached to the surface (?), one or more concave portion (G) not kept in contact with the smooth surface exist on the surface (?), and the shapes of the one or more concave portions (G) have irregular shapes. The pressure sensitive adhesive sheet has excellent air escape property capable of readily removing air accumulation that may be formed on attaching to an adherend, and has good pressure sensitive adhesion characteristics.Type: GrantFiled: April 2, 2015Date of Patent: March 5, 2019Assignee: LINTEC CORPORATIONInventors: Kazue Uemura, Kiichiro Kato, Yumiko Amino, Shigeru Saito, Masaru Matsushima
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Publication number: 20180170022Abstract: A sealing sheet having a resin layer comprising a resin part (A) formed by a resin composition containing one or more resins selected from the group consisting of an acrylic-based resin and a urethane-based resin, and a resin part (B) having a water vapor transmission rate measured in conformity with JIS K 7129 of 15 g/m2/day or less, in which the resin part (A) and the resin part (B) are present on at least one surface of the resin layer. The sealing sheet excels in a suppressing effect on moisture intrusion of the sealing sheet itself, and, when manufacturing a sealing structure, excels in an effect to prevent moisture intrusion into the sealing structure from between a substrate (adherend) and the sealing sheet.Type: ApplicationFiled: March 23, 2015Publication date: June 21, 2018Applicant: LINTEC CORPORATIONInventors: Satoshi KAWADA, Masaru Matsushima
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Publication number: 20170183544Abstract: A pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer, at least a surface (?) of the resin layer being opposite to the side of the substrate or being opposite to the side which the release material is provided, having pressure sensitive adhesiveness, the surface (?) having one or more concave portions, the concave portions having irregular shapes. The pressure sensitive adhesive sheet has an excellent air escape property capable of easily removing air accumulation that may be formed on attaching to an adherend, and is excellent in pressure sensitive adhesion characteristics.Type: ApplicationFiled: April 2, 2015Publication date: June 29, 2017Applicant: LINTEC CORPORATIONInventors: Kiichiro KATO, Kazue UEMURA, Yumiko AMINO, Shigeru SAITO, Masaru MATSUSHIMA
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Publication number: 20170174946Abstract: Provided is a pressure sensitive adhesive sheet containing a resin layer on a substrate or a release material, at least a surface (?) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein, when a smooth surface of a light transmissive adherend having a smooth surface is attached to the surface (?), one or more concave portion (G) not kept in contact with the smooth surface exist on the surface (?), and the shapes of the one or more concave portions (G) have irregular shapes. The pressure sensitive adhesive sheet has excellent air escape property capable of readily removing air accumulation that may be formed on attaching to an adherend, and has good pressure sensitive adhesion characteristics.Type: ApplicationFiled: April 2, 2015Publication date: June 22, 2017Applicant: LINTEC CORPORATIONInventors: Kazue UEMURA, Kiichiro KATO, Yumiko Amino, Shigeru SAITO, Masaru MATSUSHIMA
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Publication number: 20170174943Abstract: Provided is a pressure sensitive adhesive sheet containing a resin layer on a substrate or a release material, at least a surface (?) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein one or more concave portions formed not by transferring an emboss pattern exist on the surface (?).Type: ApplicationFiled: April 2, 2015Publication date: June 22, 2017Applicant: LINTEC CORPORATIONInventors: Kiichiro KATO, Kazue UEMURA, Yumiko AMINO, Shigeru SAITO, Koji TSUCHIBUCHI, Masaru MATSUSHIMA
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Patent number: 9666408Abstract: In order to prevent a sample from thermally expanding and contracting when the sample is placed on a sample stage inside a vacuum chamber, the related art has proposed a coping method of awaiting observation by setting a standby time from when the wafer is conveyed into the vacuum chamber until the wafer and the sample table are brought into thermal equilibrium. In addition, the coping method is configured so as to await the observation until the wafer is cooled down to room temperature when the wafer is heated in the previous step. Consequently, throughput of an apparatus decreases. A temperature control mechanism which can control temperature of the sample is installed inside a mini-environment device. The sample temperature control mechanism controls the temperature of the sample inside the mini-environment device so as to become a setting temperature which is set in view of a lowered temperature of the sample inside a load lock chamber.Type: GrantFiled: January 20, 2014Date of Patent: May 30, 2017Assignee: Hitachi High-Technologies CorporationInventors: Shuichi Nakagawa, Masaru Matsushima, Masakazu Takahashi, Seiichiro Kanno
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Publication number: 20150340198Abstract: In order to prevent a sample from thermally expanding and contracting when the sample is placed on a sample stage inside a vacuum chamber, the related art has proposed a coping method of awaiting observation by setting a standby time from when the wafer is conveyed into the vacuum chamber until the wafer and the sample table are brought into thermal equilibrium. In addition, the coping method is configured so as to await the observation until the wafer is cooled down to room temperature when the wafer is heated in the previous step. Consequently, throughput of an apparatus decreases. A temperature control mechanism which can control temperature of the sample is installed inside a mini-environment device. The sample temperature control mechanism controls the temperature of the sample inside the mini-environment device so as to become a setting temperature which is set in view of a lowered temperature of the sample inside a load lock chamber.Type: ApplicationFiled: January 20, 2014Publication date: November 26, 2015Inventors: Shuichi NAKAGAWA, Masaru MATSUSHIMA, Masakazu TAKAHASHI, Seiichiro KANNO
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Patent number: 8921781Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: GrantFiled: August 20, 2013Date of Patent: December 30, 2014Assignee: Hitachi High-Technologies CorporationInventors: Go Miya, Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto
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Patent number: 8835883Abstract: A charged particle radiation device includes a sample chamber in which a sample stage adapted to mount a sample is installed, a charged particle radiation irradiation section adapted to irradiate the sample with a charged particle radiation to observe and fabricate the sample, sidewalls installed on a periphery of the sample chamber and the charged particle radiation irradiation section, a ceiling board installed on a plane located in an upper part of the sidewalls, and a sound absorbing structure section disposed below the ceiling board, and including a plurality of hole sections and a hollow section communicated with the hole sections. The sound absorbing structure section has an absorption band including a frequency band of a standing wave generated in a space surrounded by the sidewalls and the ceiling board. Further, a soundproof cover may include the sidewalls, ceiling board and sound absorbing structure.Type: GrantFiled: June 3, 2011Date of Patent: September 16, 2014Assignee: Hitachi High-Technologies CorporationInventors: Daisuke Muto, Masanori Watanabe, Hiroshi Tsuji, Masaru Matsushima
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Patent number: 8822952Abstract: Charged particle beam apparatus arrangements in which either a first noise absorber which provides noise absorbing performance specialized for a first frequency range including the natural frequency of the charged particle beam apparatus as reference, or a second noise absorber which provides noise absorbing performance specialized for a second frequency range including the frequency of acoustic standing waves generated within the cover as reference, or both of the first and second noise absorbers is/are disposed within a cover of the charged particle beam apparatus.Type: GrantFiled: October 14, 2011Date of Patent: September 2, 2014Assignee: Hitachi High-Technologies CorporationInventors: Daisuke Muto, Masanori Watanabe, Masaru Matsushima, Shuichi Nakagawa, Masahiro Akatsu, Yusuke Tanba, Satoshi Okada
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Patent number: 8823309Abstract: Disclosed is a smaller and lighter stage device which can be applied to a device such as a length measurement SEM for inspecting and/or evaluating a semiconductor, and in which the effect of a magnetic field on an electron beam can be reduced. Linear motors 110, 111, 112, 113 are disposed on four sides of a base 104 to be distanced from an electron beam projection position (the center of the stage device), respectively. The base 104 has dimensions substantially equivalent to minimum dimensions determined by the size of a top table 101 and a movable stroke. Linear motor stators 110, 112 are configured to have a “C-shaped” structure whose opening faces outside of the stage device, respectively. Further, a movable table is coupled to the top table via linear guides 107, 109 composed of a nonmagnetic material or roller mechanisms composed of a nonmagnetic material.Type: GrantFiled: September 17, 2010Date of Patent: September 2, 2014Assignee: Hitachi High-Technologies CorporationInventors: Hironori Ogawa, Masahiro Koyama, Nobuo Shibata, Masaru Matsushima, Shuichi Nakagawa, Katsunori Onuki, Yoshimasa Fukushima
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Patent number: 8680466Abstract: It is an object of the present invention to provide an electron microscope for properly applying a retarding voltage to a sample which is brought into electrical conduction.Type: GrantFiled: October 15, 2009Date of Patent: March 25, 2014Assignee: Hitachi High-Technologies CoporationInventors: Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto, Kazuyuki Ikenaga
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Patent number: 8653455Abstract: The charged particle beam device has a problem that a symmetry of equipotential distribution is disturbed near the outer edge of a specimen, an object being evaluated, causing a charged particle beam to deflect there. An electrode plate installed inside the specimen holding mechanism of electrostatic attraction type is formed of an inner and outer electrode plates arranged concentrically. The outer electrode plate is formed to have an outer diameter larger than that of the specimen. The dimensions of the electrode plates are determined so that an overlapping area of the outer electrode plate and the specimen is substantially equal to an area of the inner electrode plate. The inner electrode plate is impressed with a voltage of a positive polarity with respect to a reference voltage and of an arbitrary magnitude, and the outer electrode is impressed with a voltage of a negative polarity and of an arbitrary magnitude.Type: GrantFiled: June 3, 2010Date of Patent: February 18, 2014Assignee: Hitachi High-Technologies CorporationInventors: Hiroyuki Kitsunai, Seiichiro Kanno, Masaru Matsushima, Shuichi Nakagawa, Go Miya
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Patent number: 8653459Abstract: There is provided a technique that is capable of attracting a sample without making the voltage applied to an electrostatic chuck unnecessarily large. Attraction experiments with respect to the electrostatic chuck are performed using a testing sample whose degree of warp and pattern of warp are known, and a critical application voltage at which the attraction state changes from “bad” to “good” is found. When measuring an inspection target sample, the flatness of the inspection target sample is measured, and the degree of warp and pattern of warp of the inspection target sample are detected. Based on the degree of warp and pattern of warp of the inspection target sample and on the known critical application voltage, the application voltage for the electrostatic chuck is set.Type: GrantFiled: December 24, 2010Date of Patent: February 18, 2014Assignee: Hitachi High-Technologies CorporationInventors: Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima
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Publication number: 20130327939Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: ApplicationFiled: August 20, 2013Publication date: December 12, 2013Applicant: HITACHI HIGH-TECHNOLOGIESInventors: Go MIYA, Seiichiro KANNO, Hiroyuki KITSUNAI, Masaru MATSUSHIMA, Toru SHUTO
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Publication number: 20130228686Abstract: Currently, there is no noise-proof cover, particularly noise-proof cover used in a clean room, which absorbs noise by a structure specialized for an estimated frequency of noise produced by environmental noise. Therefore, efficient noise absorption is still difficult. Accordingly, the invention provides a charged particle beam apparatus in which either a first noise absorber which provides noise absorbing performance specialized for a first frequency range including the natural frequency of the charged particle beam apparatus as reference, or a second noise absorber which provides noise absorbing performance specialized for a second frequency range including the frequency of acoustic standing waves generated within the cover as reference, or both of the first and second noise absorbers is/are disposed within a cover of the charged particle beam apparatus.Type: ApplicationFiled: October 14, 2011Publication date: September 5, 2013Inventors: Daisuke Muto, Masanori Watanabe, Masaru Matsushima, Shuichi Nakagawa, Masahiro Akatsu, Yusuke Tanba, Satoshi Okada
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Patent number: 8519332Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.Type: GrantFiled: June 29, 2012Date of Patent: August 27, 2013Assignee: Hitachi High-Technologies CorporationInventors: Go Miya, Seiichiro Kanno, Hiroyuki Kitsunai, Masaru Matsushima, Toru Shuto
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Publication number: 20130082194Abstract: A charged particle radiation device includes a sample chamber in which a sample stage adapted to mount a sample is installed, a charged particle radiation irradiation section adapted to irradiate the sample with a charged particle radiation to observe and fabricate the sample, sidewalls installed on a periphery of the sample chamber and the charged particle radiation irradiation section, a ceiling board installed on a plane located in an upper part of the sidewalls, and a sound absorbing structure section disposed below the ceiling board, and including a plurality of hole sections and a hollow section communicated with the hole sections. The sound absorbing structure section has an absorption band including a frequency band of a standing wave generated in a space surrounded by the sidewalls and the ceiling board. Further, a soundproof cover may include the sidewalls, ceiling board and sound absorbing structure.Type: ApplicationFiled: June 3, 2011Publication date: April 4, 2013Inventors: Daisuke Muto, Masanori Watanabe, Hiroshi Tsuji, Masaru Matsushima