Abstract: A radio card includes a board, an LSI having a bump on one surface thereof and mounted on the board with the bump interposed therebetween, an SUS board having a rib which is bonded to the other surface of the LSI with the rib interposed therebetween and is located almost on a line being orthogonal to a surface direction of the LSI and passing through the bump, and an adhesive interposed between the SUS board and the other surface of the LSI and bonding the SUS board to the LSI.

Abstract: The invention is to set a resonance frequency to various resonance frequencies by cutting a signal line which connects a tuning capacitor for trimming and an antenna currently with a milling step making a hole for mounting an IC module.

Abstract: The invention is to set a resonance frequency to various resonance frequencies by cutting a signal line which connects a tuning capacitor for trimming and an antenna currently with a milling step making a hole for mounting an IC module.

Abstract: A portable electronic medium includes a circuit substrate of which first surface is exposed to the outside, forming one of the outer surfaces and a second surface provided on the back of the first surface with an electronic part mounted, a terminal portion formed on the first surface of the circuit substrate for exchanging data with outer devices by connecting to them, and a resin layer formed substantially in the same size as the circuit substrate and laminated on the entire surface of the second surface with electronic part mounted thereon.

Abstract: An antenna has coil windings divided into tiers which are mounted on a wireless module substrate with an integrated circuit (LSI). The coil tiers of the antenna windings are divided into two portions in the vicinity of the LSI. The LSI is positioned between the two divided portions of the antenna. Metal wires are used to connect the terminals of the LSI with both terminals of the antenna for non-contact data communication.

Abstract: A card having a smooth surface suitable for printing photographic images thereon, and a built-in electronic part, where the electronic part and an antenna are embedded in a first cured resin, and the top and bottom surfaces of the first cured resin are covered by a second cured resin. The first and second cured resins are applied to conform to the length and width of the card, and the surfaces of the second cured resin are further covered with a covering material.

Abstract: A method of manufacturing a card with a built-in electronic part including a first step of mounting an electronic part, such as an LSI module, on a first bottom-covering material, applying a first molten resin onto the first bottom-covering material and the electronic part, and placing a first top-covering material on the fist molten resin. A second step includes curing the first molten resin, thereby forming a first structure of at least the first cured resin and the electronic part, and mounting the first structure on a second bottom-covering material. A third step includes applying a second molten resin onto the first structure and placing a second top-covering material on the second molten resin. A fourth step includes curing the second molten resin, thereby forming a second structure of at least the second cured resin and the first structure. A fifth step includes cutting the second structure thereby forming a card.

Abstract: An IC card has a contact portion which is exposed on one surface of a printed circuit board and has multiple terminals provided to electrically contact an external device. Wirings are arranged on the other surface of the printed circuit board at a position facing the contact portion with the printed circuit board in between, and are printed at least at positions opposite to gaps between the terminals. The arrangement of the wirings thus prevents that portion of the IC card at the gaps from becoming thinner than the other portion of the IC card.