Abstract: In order to quickly and reliably establish link up, when a communication device detects power on or link down, an idle signal generation circuit generates an idle signal. Then, an I/F circuit transmits the idle signal to a communication device which is a communication partner through a selection circuit. Further, the I/F circuit transmits and receives learning signals to and from the communication device which is a communication partner. A Step 1 learning circuit, a Step 2 learning circuit, and a Step 3 learning circuit establish link up by using the learning signals. When not receiving a signal from a link detection circuit indicating that link up is established, a reset mask circuit transmits a reset signal generated by a reset signal generation circuit, to the Step 1 learning circuit, the Step 2 learning circuit, and the Step 3 learning circuit to allow them to learn again.

Abstract: A boron neutron capture therapy system has a neutron beam irradiation device, a patient restraint/placement portion, a three-dimensional diagnostic device, an irradiation table, a position adjustment mechanism, and a control unit. The boron neutron capture therapy system performs position determination with a sufficient degree of accuracy at the time of the boron neutron capture therapy. Further, the control unit, using the movement of the irradiation table, performs collision avoidance processing that changes the movement of the irradiation table before the patient restrained on the patient restraint/placement portion receives injury by colliding with the irradiation port, and thus, collision between the patient and the irradiation port can be avoided.

Abstract: A laminate processing method includes a water-soluble resin filling step of filling a water-soluble resin in a division groove formed in a dividing step, a modified layer removing step of positioning a cutting blade in the division groove formed in a back surface of a wafer to cut the division groove in a state in which the water-soluble resin is solidified or half-solidified, thereby removing a modified layer, and a water-soluble resin removing step of supplying cleaning water from the back surface of the wafer with a state in which an expandable tape is expanded being maintained, thereby removing the water-soluble resin being filled in a cut groove and the division groove.

Abstract: A laminate processing method includes a modified layer removing step of positioning a cutting blade to the region of the wafer corresponding to each of the division lines and cutting while supplying cutting water into which a water-soluble resin is mixed from the wafer side of the laminate, thereby removing the modified layer formed inside the wafer, a dividing step of, after the modified layer removing step is carried out, expanding the expandable tape, and dividing the laminate into individual image sensor chips, and a cleaning step of supplying cleaning water from the back surface of the wafer with a state in which the expandable tape is expanded being maintained, thereby cleaning the laminate.

Abstract: A wafer expanding method increases spacing between adjacent devices formed on a wafer. The method includes preparing an annular jig having a first restricting portion, a second restricting portion, and a curved restricting portion connecting the first restricting portion and the second restricting portion, mounting a ring frame supporting the wafer through an adhesive tape on a cylindrical frame fixing member, next mounting the annular jig on the ring frame, and next fixing the ring frame and the annular jig to the cylindrical frame fixing member, and operating a cylindrical pushing member having an outer circumference corresponding to an outer circumference of the wafer to push up an annular exposed portion of the adhesive tape defined between the wafer and the ring frame and thereby lift the wafer away from the ring frame, thereby expanding the annular exposed portion and increasing the spacing between the adjacent devices.

Abstract: A wafer expanding method for expanding a wafer having a plurality of rectangular devices respectively formed in a plurality of separate regions defined by a plurality of division lines, thereby increasing spacing between any adjacent ones of the devices, each rectangular device having a pair of shorter sides and a pair of longer sides. The wafer expanding method includes a jig preparing step of preparing an annular jig having an elliptical opening, the elliptical opening having a shorter portion for restricting a width of the annular exposed portion in a first direction where the shorter sides of the devices extend to a first width and a longer portion for restricting the width of the annular exposed portion in a second direction where the longer sides of the devices extend to a second width larger than the first width.

Abstract: Disclosed herein is a protective tape attaching method for attaching a protective tape to a wafer, the protective tape having a size corresponding to the size of the wafer. The protective tape attaching method includes: a bending step of bending a release paper to which an adhesive layer of the protective tape is previously attached, stretching the release paper to peel a front end portion of the protective tape from the release paper, and attaching the front end portion of the protective tape to the wafer; and an attaching step of pressing the other side of the protective tape opposite to the adhesive layer by using a pressure roller to thereby bring the adhesive layer of the protective tape into close contact with the wafer after performing the bending step.

Abstract: A wafer processing method includes applying a laser beam of such a wavelength as to be transmitted through a wafer to the wafer from a back surface of the wafer, with a focal point of the laser beam positioned at a predetermined point inside the wafer, to form division start points along streets, the division start point including a modified layer and a crack extending from the modified layer to a front surface of the wafer; and grinding the back surface of the wafer by a grinding wheel having a plurality of grindstones in an annular pattern, to thin the wafer and divide the wafer into individual device chips. In forming the division start points, a chuck table is heated to a predetermined temperature, whereby the cracks formed inside the wafer to extend from the modified layers to the front surface of the wafer are grown.

Abstract: An electronic device includes: a memory; and a processor connected to the memory and configured to receive signals from a plurality of sensors that detect an activity state of a user wearing, or having in its vicinity, the electronic device, wherein the processor reads out a program stored in the memory to perform the following processes: receiving the signals from the plurality of sensors; determining the activity state of the user based on the received signals; selecting one or more of sensors from the plurality of sensors on the basis of the determined activity state; deriving, on the basis of the determined activity state, information to be communicated to the user, the information to be communicated to the user being derived from the signals from the selected one or more of the sensors; and causing the derived information to be communicated to the user.

Abstract: A wafer processing method includes: cutting a device layer stacked on a semiconductor substrate along division lines to form cut grooves; positioning a focal point of a laser beam having a transmission wavelength to the semiconductor substrate inside an area of the semiconductor substrate corresponding to a predetermined one of the division lines and applying the laser beam to the wafer from a back surface of the wafer, thereby forming a plurality of modified layers inside the wafer along all of the division lines; and grinding the back surface of the wafer to be thinned, causing a crack to grow from each of the modified layers formed inside the area of the semiconductor substrate corresponding to the predetermined one of the division lines to the front surface side of the wafer, thereby dividing the wafer into individual device chips.

Abstract: A method of shaping a cutting blade, includes a modified layer forming step of forming a plurality of modified layers at different heights within a dressing member by irradiating the dressing member with a laser beam having a wavelength transmissible through the dressing member from one surface of the dressing member a plurality of times while a focusing point of the laser beam is positioned within the dressing member, and a blade shaping step of shaping the cutting blade into a predetermined shape formed by the plurality of modified layers by cutting the dressing member by the cutting blade until the cutting blade reaches the modified layers after performing the modified layer forming step.

Abstract: A wafer processing method for processing a wafer has a front side and a back side, the front side of the wafer being formed with a plurality of crossing streets for defining a plurality of separate regions where a plurality of devices are individually formed. The wafer processing method includes the steps of first attaching a protective tape to the front side of the wafer, next heating the protective tape and the wafer, next applying a laser beam having a transmission wavelength to the wafer to the back side of the wafer along the streets, thereby forming a modified layer inside the wafer along each street, and next grinding the back side of the wafer, thereby reducing a thickness of the wafer to a predetermined thickness and also dividing the wafer into individual chips along each street where the modified layer is formed as a division start point.

Abstract: According to an aspect, a magnesium fluoride sintered compact includes a disc-shaped magnesium fluoride sintered compact having a through hole passing through a center axis of the disc-shaped magnesium fluoride sintered compact. The magnesium fluoride sintered compact has a relative density of 95% or higher.

Abstract: A control circuit of a switching power-supply device that converts a first DC voltage supplied from an input power source into a second DC voltage by turning on/off a switching element connected between the input power source and an inductor and outputs the second DC voltage, the control circuit includes a drive circuit that, when a control signal to turn on the switching element is received, drives the switching element by supplying a plurality of drive voltages starting in order from a lowest drive voltage among the plurality of drive voltages, to a control terminal of the switching element.

Abstract: In order to quickly and reliably establish link up, when a communication device detects power on or link down, an idle signal generation circuit generates an idle signal. Then, an I/F circuit transmits the idle signal to a communication device which is a communication partner through a selection circuit. Further, the I/F circuit transmits and receives learning signals to and from the communication device which is a communication partner. A Step 1 learning circuit, a Step 2 learning circuit, and a Step 3 learning circuit establish link up by using the learning signals. When not receiving a signal from a link detection circuit indicating that link up is established, a reset mask circuit transmits a reset signal generated by a reset signal generation circuit, to the Step 1 learning circuit, the Step 2 learning circuit, and the Step 3 learning circuit to allow them to learn again.

Abstract: Disclosed herein is a protective tape attaching method for attaching a protective tape to a wafer, the protective tape having a size corresponding to the size of the wafer. The protective tape attaching method includes: a bending step of bending a release paper to which an adhesive layer of the protective tape is previously attached, stretching the release paper to peel a front end portion of the protective tape from the release paper, and attaching the front end portion of the protective tape to the wafer; and an attaching step of pressing the other side of the protective tape opposite to the adhesive layer by using a pressure roller to thereby bring the adhesive layer of the protective tape into close contact with the wafer after performing the bending step.

Abstract: A boron neutron capture therapy system has a neutron beam irradiation device, a patient restraint/placement portion, a three-dimensional diagnostic device, an irradiation table, a position adjustment mechanism, and a control unit. The boron neutron capture therapy system performs position determination with a sufficient degree of accuracy at the time of the boron neutron capture therapy. Further, the control unit, using the movement of the irradiation table, performs collision avoidance processing that changes the movement of the irradiation table before the patient restrained on the patient restraint/placement portion receives injury by colliding with the irradiation port, and thus, collision between the patient and the irradiation port can be avoided.

Abstract: A wafer held on a chuck table is processed by applying a laser beam to the wafer. The laser processing method includes positioning a height detecting unit in a work area of the wafer where the laser beam is to be applied, relatively moving the chuck table and the height detecting unit along a forward path in an X direction, detecting the height of the upper surface of the wafer along the forward path by using the height detecting unit, and storing height information at plural X coordinates on the forward path into a memory; and relatively moving the chuck table and the height detecting unit along a backward path in the X direction, detecting the height of the upper surface of the wafer along the backward path by using the height detecting unit, and storing height information at plural X coordinates on the backward path into the memory.

Abstract: A temporary receiving unit of a processing apparatus includes a first support rail having a first bottom wall and a first side wall for guiding a workpiece for sliding movement in unloading and loading directions of the workpiece by an unloading and loading unit, a second support rail disposed in an opposing relationship to the first support rail and having a second bottom wall and a second side wall for guiding a workpiece for sliding movement, a support rail actuation unit for actuating the first support rail and the second support rail in directions in which the first support rail and the second support rail approach each other and are spaced away from each other, and a load detection unit for detecting a load on the support rail actuation unit.

Abstract: A wafer processing method for processing a wafer has a front side and a back side, the front side of the wafer being formed with a plurality of crossing streets for defining a plurality of separate regions where a plurality of devices are individually formed. The wafer processing method includes the steps of first attaching a protective tape to the front side of the wafer, next heating the protective tape and the wafer, next applying a laser beam having a transmission wavelength to the wafer to the back side of the wafer along the streets, thereby forming a modified layer inside the wafer along each street, and next grinding the back side of the wafer, thereby reducing a thickness of the wafer to a predetermined thickness and also dividing the wafer into individual chips along each street where the modified layer is formed as a division start point.