Abstract: This invention is concerned with ceramic substrates for multilayer interconnection. This invention is also concerned with a raw batch for ceramic substrates which require a calcining temperature as low as 1,000.degree. C. or lower upon their production, are low in dielectric constant and have a coefficient of thermal expansion close to that of silicon and also with a process for the production of the substrates. This invention makes use of a raw batch which permits the use of a low resistance conductor such as Ag-Pd, Ag, Au or Cu and also the production of substrates by low-temperature calcination. The raw batch contains borosilicate silicate glass powder, and aluminum borate powder and at a weight ratio of 40-80 percent to 20-60 percent. The raw batch can additionally contain one or more specific oxides in particular proportions.