Abstract: A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., and an Izod impact strength of approximately 1 kgf·cm/cm or more at 25° C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by &bgr; relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by &bgr;′ relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.

Abstract: In a method of producing a resin-sealed electronic device, a solder resist layer including a silicone family surfactant is coated on a printed circuit board. Thereafter, an electronic component is mounted on the solder resist layer through adhesives, and is sealed by sealing resin. The content of the silicone family surfactant in the solder resist layer is less than 3 wt %, more preferably, is in a range of 0.2 wt % to 1 wt %. Accordingly, adhering reliability of the sealing resin relative to the solder resist can be improved, thereby resulting in high reliability of the resin-sealed electronic device for a long time.

Abstract: In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side due to temperature change and defects in wire bonding in the wire bonding process. In a semiconductor device equipped with a sensor element for sensing stress fixed on a substrate, an adhesive for semiconductors is used which is prepared by compounding resin beads made of resin with a base adhesive made of flexible resin.

Abstract: A copper paste composition for low temperature firing on a ceramic substrate is comprised of inorganic components and organic vehicle components. The inorganic components mainly consist of cooper powder, cuprous oxide powder, cupric oxide powder and glass powder. The mixing ratio off the inorganic components of this composition is 100 parts by weight of copper powder, about 10 to 15 parts by weight of cuprous oxide powder, about 12 to 17 parts by weight of cupric oxide powder, and about 7 to 12 parts by weight of glass powder. The mixing ratio of the inorganic components with the organic vehicle components is about 95 to 70 parts by weight of the organic vehicle components. Also the the average particle size of the copper powder is in a range of about 0.5 to 3 .mu.m and the oxygen content of the copper powder is about 0.05 to 0.15 weight percent.

Abstract: A copper conductor composition comprising a copper powder, an inorganic oxide powder, a glass powder and an organic vehicle, said copper powder having an average particle size of 0.5 to 3 .mu.m, a tap density of 3.0 to 5.0 g/cm.sup.3, and an oxygen content of 0.05 to 0.15% by weight. Zinc oxide powder and, optionally, nickel powder are used as the inorganic oxide powder. The composition which contains the copper powder having such an oxygen content as low as 0.05 to 0.15% by weight, can provide copper conductors having excellent conductor properties such as solderability, adhesive strength and matching property to resistances.

Abstract: A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.

Abstract: A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.