Patents by Inventor Masashi Ishibashi
Masashi Ishibashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240094640Abstract: A method for determining a spatially varying process offset for a lithographic process, the spatially varying process offset (MTD) varying over a substrate subject to the lithographic process to form one or more structures thereon. The method includes obtaining a trained model (MOD), having been trained to predict first metrology data based on second metrology data, wherein the first metrology data (OV) is spatially varying metrology data which relates to a first type of measurement of the one or more structures being a measure of yield and the second metrology data (PB) is spatially varying metrology data which relates to a second type of measurement of the one or more structures and correlates with the first metrology data; and using the model to obtain the spatially varying process offset (MTD).Type: ApplicationFiled: January 21, 2022Publication date: March 21, 2024Applicant: ASML NETHERLANDS B.V.Inventors: Thiago DOS SANTOS GUZELLA, Masashi ISHIBASHI, NoriaKi SANNO, Vahid BASTANI, Reza SAHRAEIAN, Putra SAPUTRA
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Patent number: 11774862Abstract: Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.Type: GrantFiled: October 14, 2021Date of Patent: October 3, 2023Assignee: ASML NETHERLANDS B.V.Inventors: Hakki Ergün Cekli, Masashi Ishibashi, Wendy Johanna Martina Van De Ven, Willem Seine Christian Roelofs, Elliott Gerard McNamara, Rizvi Rahman, Michiel Kupers, Emil Peter Schmitt-Weaver, Erik Henri Adriaan Delvigne
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Patent number: 11392044Abstract: A method, system and program for determining a position of a feature referenced to a substrate. The method includes measuring a position of the feature, receiving an intended placement of the feature and determining an estimate of a placement error based on knowledge of a relative position of a first reference feature referenced to a first layer on a substrate with respect to a second reference feature referenced to a second layer on a substrate. The updated position may be used to position the layer of the substrate having the feature, or another layer of the substrate, or another layer of another substrate.Type: GrantFiled: January 16, 2020Date of Patent: July 19, 2022Assignee: ASML Netherlands B.V.Inventors: Ralph Timotheus Huijgen, Marc Jurian Kea, Marcel Theodorus Maria Van Kessel, Masashi Ishibashi, Chi-Hsiang Fan, Hakki Ergün Cekli, Youping Zhang, Maurits Van Der Schaar, Liping Ren
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Publication number: 20220186433Abstract: The durability of a wire rope is improved. The wire rope includes a rope body having at least one strand each formed with a plurality of element wires twisted with each other; a lubricant interposed between the plurality of element wires of the at least one strand; and a resin layer coating the outer periphery of the rope body along with the lubricant, the lubricant containing a sulfur-containing organic molybdenum compound.Type: ApplicationFiled: March 8, 2022Publication date: June 16, 2022Applicants: TOYOFLEX CORPORATION, ASAHI INTECC CO., LTD.Inventors: Hiroki KIMURA, Masashi ISHIBASHI, Takaya HASHIMOTO
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Publication number: 20220035259Abstract: Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.Type: ApplicationFiled: October 14, 2021Publication date: February 3, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Hakki Ergün CEKLI, Masashi ISHIBASHI, Wendy Johanna Martina VAN DE VEN, Willem Seine Christian ROELOFS, Elliott Gerard MC NAMARA, Rizvi RAHMAN, Michiel KUPERS, Emil Peter SCHMITT-WEAVER, Erik Henri Adriaan DELVIGNE
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Patent number: 11175591Abstract: Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.Type: GrantFiled: April 21, 2017Date of Patent: November 16, 2021Assignee: ASML Netherlands B.V.Inventors: Hakki Ergün Cekli, Masashi Ishibashi, Wendy Johanna Martina Van De Ven, Willem Seine Christian Roelofs, Elliott Gerard McNamara, Rizvi Rahman, Michiel Kupers, Emil Peter Schmitt-Weaver, Erik Henri Adriaan Delvigne
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Publication number: 20200150547Abstract: A method, system and program for determining a position of a feature referenced to a substrate. The method includes measuring a position of the feature, receiving an intended placement of the feature and determining an estimate of a placement error based on knowledge of a relative position of a first reference feature referenced to a first layer on a substrate with respect to a second reference feature referenced to a second layer on a substrate. The updated position may be used to position the layer of the substrate having the feature, or another layer of the substrate, or another layer of another substrate.Type: ApplicationFiled: January 16, 2020Publication date: May 14, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Ralph Timotheus HUIJGEN, Marc Jurian Kea, Marcel Theodorus Maria Van Kessel, Masashi Ishibashi, Chi-Hsiang Fan, Hakki Ergün Cekli, Youping Zhang, Maurits Van Der Schaar, Liping Ren
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Patent number: 10578980Abstract: A method, system and program for determining a position of a feature referenced to a substrate. The method includes measuring a position of the feature, receiving an intended placement of the feature and determining an estimate of a placement error based on knowledge of a relative position of a first reference feature referenced to a first layer on a substrate with respect to a second reference feature referenced to a second layer on a substrate. The updated position may be used to position the layer of the substrate having the feature, or another layer of the substrate, or another layer of another substrate.Type: GrantFiled: November 23, 2017Date of Patent: March 3, 2020Assignee: ASML Netherlands B.V.Inventors: Ralph Timotheus Huijgen, Marc Jurian Kea, Marcel Theodorus Maria Van Kessel, Masashi Ishibashi, Chi-Hsiang Fan, Hakki Ergün Cekli, Youping Zhang, Maurits Van Der Schaar, Liping Ren
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Patent number: 10545410Abstract: A lithographic process includes clamping a substrate onto a substrate support, measuring positions across the clamped substrate, and applying a pattern to the clamped substrate using the positions measured. A correction is applied to the positioning of the applied pattern in localized regions of the substrate, based on recognition of a warp-induced characteristic in the positions measured across the substrate. The correction may be generated by inferring one or more shape characteristics of the warped substrate using the measured positions and other information. Based on the one or more inferred shape characteristics, a clamping model is applied to simulate deformation of the warped substrate in response to clamping. A correction is calculated based on the simulated deformation.Type: GrantFiled: February 7, 2017Date of Patent: January 28, 2020Assignee: ASML Netherlands B.V.Inventors: Hakki Ergun Cekli, Masashi Ishibashi, Leon Paul Van Dijk, Richard Johannes Franciscus Van Haren, Xing Lan Liu, Reiner Maria Jungblut, Cedric Marc Affentauschegg, Ronald Henricus Johannes Otten
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Publication number: 20190339211Abstract: A method, system and program for determining a position of a feature referenced to a substrate. The method includes measuring a position of the feature, receiving an intended placement of the feature and determining an estimate of a placement error based on knowledge of a relative position of a first reference feature referenced to a first layer on a substrate with respect to a second reference feature referenced to a second layer on a substrate. The updated position may be used to position the layer of the substrate having the feature, or another layer of the substrate, or another layer of another substrate.Type: ApplicationFiled: November 23, 2017Publication date: November 7, 2019Inventors: Ralph Timotheus HUIJGEN, Marc Jurian KEA, Marcel Theodorus Maria VAN KESSEL, Masashi ISHIBASHI, Chi-Hsiang FAN, Hakki Ergün CEKLI, Youping ZHANG, Maurits VAN DER SCHAAR, Liping REN
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Publication number: 20190137892Abstract: Measurements are obtained from locations across a substrate before or after performing a lithographic process step. Examples of such measurements include alignment measurements made prior to applying a pattern to the substrate, and measurements of a performance parameter such as overlay, after a pattern has been applied. A set of measurement locations is selected from among all possible measurement locations. At least a subset of the selected measurement locations are selected dynamically, in response to measurements obtained using a preliminary selection of measurement locations. Preliminary measurements of height can be used to select measurement locations for alignment. In another aspect, outlier measurements are detected based on supplementary data such as height measurements or historic data.Type: ApplicationFiled: April 21, 2017Publication date: May 9, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Hakki Ergün CEKLI, Masashi ISHIBASHI, Wendy Johanna Marthina VAN DE VEN, Willem Seine Christian ROELOFS, Elliott Gerard MC NAMARA, Rizvi RAHMAN, Michiel KUPERS, Emil Peter SCHMITT-WEAVER, Erilk Henri Adriaan DELVIGNE
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Publication number: 20190079411Abstract: A lithographic process includes clamping a substrate onto a substrate support, measuring positions across the clamped substrate, and applying a pattern to the clamped substrate using the positions measured. A correction is applied to the positioning of the applied pattern in localized regions of the substrate, based on recognition of a warp-induced characteristic in the positions measured across the substrate. The correction may be generated by inferring one or more shape characteristics of the warped substrate using the measured positions and other information. Based on the one or more inferred shape characteristics, a clamping model is applied to simulate deformation of the warped substrate in response to clamping. A correction is calculated based on the simulated deformation.Type: ApplicationFiled: February 7, 2017Publication date: March 14, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Hakki Ergun CEKLI, Masashi ISHIBASHI, Leon Paul VAN DIJK, Richard Johannes Franciscus VAN HAREN, Xing Lan LIU, Reiner Maria JUNGBLUT, Cedric Marc AFFENTAUSCHEGG, Ronald Henricus Johannes OTTEN
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Patent number: 4699743Abstract: An article comprising a magnetic shielding thermoplastic polymeric material containing a powdery ferrite and a heat shrinkable thermoplastic polymeric material layer. Due to its specific structure, this article is excellent in applicability over any electrical component, and may provide over the component a cover having excellent magnetic shielding and mechanical strength properties. It may also bring about a substantial increase in inductance of the component.Type: GrantFiled: August 30, 1985Date of Patent: October 13, 1987Assignee: Fujikura LtdInventors: Koichi Nakamura, Masashi Ishibashi, Hideki Kameda, Minoru Makiyo
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Patent number: 4555422Abstract: An article comprising a magnetic shielding thermoplastic polymeric material containing a powdery ferrite and a heat shrinkable thermoplastic polymeric material layer. Due to its specific structure, this article is excellent in applicability over any electrical component, and may provide over the component a cover having excellent magnetic shielding and mechanical strength properties. It may also bring about a substantial increase in inductance of the component.Type: GrantFiled: January 10, 1984Date of Patent: November 26, 1985Assignee: Fujikura LtdInventors: Koichi Nakamura, Masashi Ishibashi, Hideki Kameda, Minoru Makiyo