Abstract: A heater includes a heat generation element which includes a heater wire which spreads in a planar manner, and a metal plate serving as a heat dissipation element which includes a material having a high thermal conductivity, which is placed on a vehicle windowpane side of the heat generation element, which is heated by heat from the heat generation element, and which irradiates heat to the vehicle windowpane side. The vehicle windowpane is heated by the heat irradiated from the metal plate serving as the heat dissipation element.

Abstract: A heater device according to the present invention comprises: a first line where an electrically-heated wire is routed to a region to be heated on a transparent substrate; and a second line that is connected to first and second power supply terminals and is wider than the first line. In addition, a wire break region is formed in the second line, a thermistor is connected so as to span the wire break region, and a portion of the first line is within the wire break region.

Abstract: A heater device is provided with: a transparent substrate; a heating wire arranged on a first face side of the transparent substrate; and a transparent adhesive layer formed on the first face side of the transparent substrate so as to cover the heating wire. The values of the thickness and viscosity of the adhesive layer are selected such that, when the heater device is affixed onto a windshield by means of the adhesive layer, a wedge angle of a concave portion that is formed on the transparent substrate in the vicinity of the heating wire due to a height of the heating wire is no greater than 0.1°.

Abstract: A heater includes a heat generation element which includes a heater wire which spreads in a planar manner, and a metal plate serving as a heat dissipation element which includes a material having a high thermal conductivity, which is placed on a vehicle windowpane side of the heat generation element, which is heated by heat from the heat generation element, and which irradiates heat to the vehicle windowpane side. The vehicle windowpane is heated by the heat irradiated from the metal plate serving as the heat dissipation element.

Abstract: In a vehicle mirror, a heat generating body of a heater generates heat so as to heat a mirror body. A central side portion and an outer peripheral side portion of the heat generating body configure a thick portion and a thin portion, and the thin portion generates a smaller amount of heat than the thick portion, such that a heating density of the mirror body by the heat generating body is lower on an outer peripheral side portion of the mirror body than at a central side portion of the mirror body. Accordingly, the temperature of an outer peripheral portion of the mirror body can be suppressed from rising suddenly on progression from the outer peripheral side toward the central side of the mirror body, thereby enabling stress arising in the outer peripheral portion of the mirror body to be suppressed.

Abstract: In a vehicle mirror, a heat generating body of a heater generates heat so as to heat a mirror body. A central side portion and an outer peripheral side portion of the heat generating body configure a thick portion and a thin portion, and the thin portion generates a smaller amount of heat than the thick portion, such that a heating density of the mirror body by the heat generating body is lower on an outer peripheral side portion of the mirror body than at a central side portion of the mirror body. Accordingly, the temperature of an outer peripheral portion of the mirror body can be suppressed from rising suddenly on progression from the outer peripheral side toward the central side of the mirror body, thereby enabling stress arising in the outer peripheral portion of the mirror body to be suppressed.

Abstract: A lubricant oil composition which is excellent in deposition resistance, corrosion resistance and wear resistance, despite its low phosphorus content and low sulfuric acid ash content, is provided by using a succinimide compound in combination with at least one selected from specific sulfur-containing compounds, specific heterocyclic compounds and reaction products thereof.

Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.

Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

Abstract: A lubricant oil composition containing an organic molybdenum compound which contains at least either one of a nitrogen (N) atom and an oxygen (O) atom in the molecule thereof and which may optionally contain a sulfur (S) atom, wherein a sulfur content of the organic molybdenum compound is 0.5% by mass or less based on the organic molybdenum compound. The lubricant oil composition, when used as a lubricant oil for a low-friction sliding material, exhibits an extremely low friction coefficient. A sliding mechanism having excellent low-friction property and wear resistance can be provided by combining the lubricant oil composition and a sliding member having a DLC film on its sliding face.

Abstract: A lubricant oil composition which is excellent in deposition resistance, corrosion resistance and wear resistance, despite its low phosphorus content and low sulfuric acid ash content, is provided by using a succinimide compound in combination with at least one selected from specific sulfur-containing compounds, specific heterocyclic compounds and reaction products thereof.

Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

Abstract: Disclosed is an epoxy resin composition that cures with high thermal conductivity and low thermal expansion and is capable of dissipating heat efficiently and displaying good dimensional stability when applied to encapsulation of semiconductor devices or to printed wiring boards. The epoxy resin composition is formulated from epoxy resins 50 wt % or more of which is a diphenyl ether type epoxy resin represented by the following general formula (1) (wherein n is a number of ?0 and m is an integer of 1-3) and curing agents 20 wt % or more of which is a diphenyl ether type phenolic resin represented by the following general formula (2) (wherein n is a number of ?0 and m is an integer of 1-3).

Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.

Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

Abstract: This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and can be used in applications such as lamination, molding, casting and adhesion. The epoxy resins of this invention are represented by the following formula (3) wherein Y1 denotes a glycidyloxyarylmethyl group represented by —CH2—Ar—OG, Y2 and Y3 denote independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group, Ar denotes a phenylene group which can be substituted with up to two hydrocarbon groups and G denotes a glycidyl group.

Abstract: This invention relates to an aromatic oligomer which is useful as a modifier of epoxy resin compositions, to a phenolic resin composition comprising said aromatic oligomer and to an epoxy resin composition comprising said aromatic oligomer and is useful for encapsulating electric and electronic parts and as a circuit board material. The aromatic oligomer of this invention is obtained by polymerizing monomers mainly consisting of aromatic olefins comprising 20 wt % or more of acenaphthylenes and shows a softening point of 80-250° C. The phenolic resin composition or epoxy resin composition of this invention is obtained by incorporating 3-200 parts by weight of the aromatic oligomer per 100 parts by weight of phenolic resin or epoxy resin. The cured epoxy resin of this invention is obtained by curing the epoxy resin composition.