Abstract: Disclosed herein is a device that includes a plurality of semiconductor chips mounted on a module substrate. Each of the semiconductor chips includes a reset terminal to which a reset signal is supplied, and an internal circuit that is initialized based on the reset signal. The module substrate includes a reset signal line connected commonly to the reset terminals of the semiconductor chips, and an anti-resonance element connected to the reset signal line.

Abstract: There is provided an azo compound for improvement in the dispersibility of an azo pigment into a water-insoluble solvent.

Abstract: The invention provides a colorant compound represented by the following general formula (1): wherein R1 and R2 represent independently from each other a species selected from at least one of a hydrogen atom, an alkyl group, and an aralkyl group. R3 represents a species selected from at least one of a hydrogen atom, a cyano group, and —COR5, where R5 is any of a hydroxyl group, an alkoxy group, and an amino group. R4 represents a species selected from at least one of a hydrogen atom, an alkyl group, an aryl group, and an aralkyl group. Cy represents an aryl group. Optionally, at least one anionic group may be present in the general formula (1).

Abstract: There is provided a colorant compound improved in the dispersibility of an azo pigment into a water-insoluble solvent. The colorant compound is represented by the following general formula (1). R1 denotes an alkyl group having 1 to 6 carbon atoms, or a phenyl group; R2 to R6 each denote a hydrogen atom, or a substituent represented by the following general formula (2); R7 to R11 each denote a hydrogen atom, a COOR12 group, or a CONR13R14 group; and R12 to R14 each denote a hydrogen atom, or an alkyl group having 1 to 3 carbon atoms; and P1 denotes a polymeric component; L1 denotes an alkylene group having 1 to 3 carbon atoms or an arylene group having 6 to 10 carbon atoms; and * denotes a binding site.

Abstract: To provide a yellow toner satisfying good toner particles and a superior coloring power, the toner has toner base particles having at least a binder resin, a colorant and a wax component, and contains as the colorant at least a coloring matter compound represented by the following general formula (1) and a pigment represented by the following formula (2).

Abstract: The invention provides a colorant compound represented by the following general formula (1): wherein R1 and R2 represent independently from each other a species selected from at least one of a hydrogen atom, an alkyl group, and an aralkyl group. R3 represents a species selected from at least one of a hydrogen atom, a cyano group, and —COR5, where R5 is any of a hydroxyl group, an alkoxy group, and an amino group. R4 represents a species selected from at least one of a hydrogen atom, an alkyl group, an aryl group, and an aralkyl group. Cy represents an aryl group. Optionally, at least one anionic group may be present in the general formula (1).

Abstract: A probe-immobilized carrier for detecting a target substance is manufactured such that a spot is prevented from being contaminated with another spot and a probe is prevented from nonspecifically adsorbing a background area in the manufacture of the probe-immobilized carrier and nonspecific adsorption cannot be occurred even after the formation of an array. A substrate containing a reactive group for immobilizing a probe thereon is used and the steps of: (i) supplying a liquid droplet containing a probe on the substrate; (ii) inactivating a reactive group existing in an area other than a supplying area of the substrate, and (iii) removing an unreacted probe existing in the supplied liquid droplet are carried out.

Abstract: A probe-immobilized carrier in which a probe capable of specifically binding to a target is immobilized on a substrate is manufactured by a method comprising the steps of: (1) coating the substrate with a reactive substance having a reactive group for immobilizing the probe on the substrate; (2) applying the probe to a surface of the substrate coated with the reactive substance; (3) immobilizing the applied probe on the substrate; and (4) applying an inactivating compound capable of inactivating the probe to a probe-immobilized area on the substrate to inactivate an unreacted probe remaining on the substrate in the probe-immobilized area.

Abstract: A memory module 10 is fitted with a “cover and heat sink” 5 having a U-shape in cross section in such a manner that the memory module 10 is inserted into a U-shaped deep recess of the “cover and heat sink” 5, and all packaged memory ICs 3 and the other components 2 mounted on each face of a printed circuit board 1 are covered by the “cover and heat sink” 5, with a silicone grease 6 being filled between the “cover and heat sink” 5 and the packaged memory ICs 3. The heat generated in each packaged memory IC 3 is conducted to the “cover and heat sink” 5 through the silicone grease 6, and the heat is radiated from the surface of the “cover and heat sink” 5 having a large surface area. In addition, since all the components 2 and 3 mounted on the printed circuit board 1 are covered with the “cover and heat sink” 5, the components 2 and 3 mounted on the printed circuit board 1 are protected from a mechanical shock.

Abstract: A memory module 10 is fitted with a “cover and heat sink” 5 having a U-shape in cross section in such a manner that the memory module 10 is inserted into a U-shaped deep recess of the “cover and heat sink” 5, and all packaged memory ICs 3 and the other components 2 mounted on each face of a printed circuit board 1 are covered by the “cover and heat sink” 5, with a silicone grease 6 being filled between the “cover and heat sink” 5 and the packaged memory ICs 3. The heat generated in each packaged memory IC 3 is conducted to the “cover and heat sink” 5 through the silicone grease 6, and the heat is radiated from the surface of the “cover and heat sink” 5 having a large surface area. In addition, since all the components 2 and 3 mounted on the printed circuit board 1 are covered with the “cover and heat sink” 5, the components 2 and 3 mounted on the printed circuit board 1 are protected from a mechanical shock.