Abstract: A bus bar and a detection element uses resin to mold and integrate, leading to a disadvantage of complicating manufacturing. The bus bar is sandwiched and fixed between a second mold member and a first mold member. A sensor substrate on which a detection element is mounted is installed above the second mold member. The detection element is fixedly disposed at a position facing the bus bar, and detects a current flowing through the bus bar.

Abstract: A power conversion device of the present invention includes a power conversion circuit configured to convert power; a conductor configured to transmit a current to the power conversion circuit; and a coreless current sensor configured to detect the current, in which the coreless current sensor includes: a magnetic field detection portion configured to detect a magnetic field of the current; and a shield portion that faces the magnetic field detection portion, the conductor includes: a first conductor portion that passes through a space between the magnetic field detection portion and the shield portion; and a second conductor portion connected to the first conductor portion via a first bent portion, and the first bent portion is formed such that the space between the magnetic field detection portion and the shield portion is not disposed in a direction perpendicular to a face of the second conductor portion closest to the shield portion.

Abstract: Insulating properties between a metallic member supporting a power semiconductor module and an input/output terminal of the power semiconductor module are secured. In a power conversion device in which a bus bar of a connecting member is connected to an input/output terminal and the like of a semiconductor module protruding through an opening of a metallic member, the connecting member includes extended portions which extend in a space between the bus bar and the opening of the metallic member.

Abstract: A power conversion device of the present invention includes a power conversion circuit configured to convert power; a conductor configured to transmit a current to the power conversion circuit; and a coreless current sensor configured to detect the current, in which the coreless current sensor includes: a magnetic field detection portion configured to detect a magnetic field of the current; and a shield portion that faces the magnetic field detection portion, the conductor includes: a first conductor portion that passes through a space between the magnetic field detection portion and the shield portion; and a second conductor portion connected to the first conductor portion via a first bent portion, and the first bent portion is formed such that the space between the magnetic field detection portion and the shield portion is not disposed in a direction perpendicular to a face of the second conductor portion closest to the shield portion.

Abstract: In a power conversion device according to the present invention, a capacitor module, includes a first capacitor element; a second capacitor element; a positive pole-side bus bar; and a negative pole-side bus bar disposed in a laminated state, in which the positive pole-side bus bar and the negative pole-side bus bar are laminated via an insulating member. The first capacitor element includes a first body portion, a first positive pole-side electrode, and a first negative pole-side electrode. The second capacitor element includes a second body portion, a second positive pole-side electrode, and a second negative pole-side electrode.

Abstract: Insulating properties between a metallic member supporting a power semiconductor module and an input/output terminal of the power semiconductor module are secured. In a power conversion device in which a bus bar of a connecting member is connected to an input/output terminal and the like of a semiconductor module protruding through an opening of a metallic member, the connecting member includes extended portions which extend in a space between the bus bar and the opening of the metallic member.

Abstract: A bus bar and a detection element uses resin to mold and integrate, leading to a disadvantage of complicating manufacturing. The bus bar is sandwiched and fixed between a second mold member and a first mold member. A sensor substrate on which a detection element is mounted is installed above the second mold member. The detection element is fixedly disposed at a position facing the bus bar, and detects a current flowing through the bus bar.

Abstract: An object of the present invention is to reduce the size of a power conversion apparatus and to improve the reliability. The power conversion apparatus includes a power semiconductor module, a driver circuit board mounted with a driver circuit, an AC-side relay conductor for transferring the alternating current, and an AC connector. The power semiconductor module includes an AC-side terminal connected to the AC-side relay conductor, and a control-side terminal connected to the driver circuit board. The AC connector is provided on the opposite side of the power semiconductor module through the driver circuit board. The driver circuit board includes a transformer for transforming voltage from low to high and supplying the transformed voltage to the driver circuit, and a line for connecting the transformer and the driver circuit. Further, the driver circuit board forms a through hold provided on the side opposite to the transformer with the driver circuit interposed therebetween.

Abstract: An electric circuit apparatus capable of enhancing connection workability is provided. An electric circuit apparatus includes: a connector that transmits one or a driving current and a signal to an electric circuit unit; a substrate connected to the connector; a first case member forming an housing space for the substrate and forming an opening portion; and an intermediate member interposed between the connector and the first case member, in which the intermediate member includes a connector-side opening portion through which the connector passes, a seal surface with the connector, and a fix in portion to be fixed on the first case member, and the fixing portion is formed so as to absorb a positional tolerance between the connector and the opening portion of the first case member.

Abstract: An electric circuit apparatus capable of enhancing connection workability is provided. An electric circuit apparatus includes: a connector that transmits one or a driving current and a signal to an electric circuit unit; a substrate connected to the connector; a first case member forming an housing space for the substrate and forming an opening portion; and an intermediate member interposed between the connector and the first case member, in which the intermediate member includes a connector-side opening portion through which the connector passes, a seal surface with the connector, and a fix in portion to be fixed on the first case member, and the fixing portion is formed so as to absorb a positional tolerance between the connector and the opening portion of the first case member.

Abstract: An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows. The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part. The first flow path part is formed at a position facing the side wall that forms the housing space.

Abstract: A power converter is provided to improve connection reliability of internal components of the power converter. The power converter may include a power semiconductor module that converts DC current into AC current, a casing that forms a housing space for housing the power semiconductor module, an AC relay bus bar that is connected to an AC terminal of the power semiconductor module by weld connection, and an AC terminal block that is connected to an AC terminal of a motor. The AC relay bus bar may be supported by the casing through an insulating member, and the AC terminal block may be connected to the AC relay bus bar and supported by the casing.

Abstract: An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows. The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part. The first flow path part is formed at a position facing the side wall that forms the housing space.

Abstract: An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows . The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part . The first flow path part is formed at a position facing the side wall that forms the housing space.

Abstract: An object of the invention is to further improve connection reliability of internal components of a power converter. According to the invention, there is provided a power converter including a power semiconductor module that converts DC current into AC current; a casing that forms a housing space for housing the power semiconductor module; an AC relay bus bar that is connected to an AC terminal of the power semiconductor module by weld connection; and an AC terminal block that is connected to an AC terminal of a motor, wherein the AC relay bus bar is supported by the casing through an insulating member, and the AC terminal block, is connected to the AC relay bus bar and supported by the casing.

Abstract: In a power conversion device according to the present invention, a capacitor module, includes a first capacitor element; a second capacitor element; a positive pole-side bus bar; and a negative pole-side bus bar disposed in a laminated state, in which the positive pole-side bus bar and the negative pole-side bus bar are laminated via an insulating member. The first capacitor element includes a first body portion, a first positive pole-side electrode, and a first negative pole-side electrode. The second capacitor element includes a second body portion, a second positive pole-side electrode, and a second negative pole-side electrode.

Abstract: An object of the present invention is to reduce the size of a power conversion apparatus and to improve the reliability. The power conversion apparatus includes a power semiconductor module, a driver circuit board mounted with a driver circuit, an AC-side relay conductor for transferring the alternating current, and an AC connector. The power semiconductor module includes an AC-side terminal connected to the AC-side relay conductor, and a control-side terminal connected to the driver circuit board. The AC connector is provided on the opposite side of the power semiconductor module through the driver circuit board. The driver circuit board includes a transformer for transforming voltage from low to high and supplying the transformed voltage to the driver circuit, and a line for connecting the transformer and the driver circuit. Further, the driver circuit board forms a through hold provided on the side opposite to the transformer with the driver circuit interposed therebetween.

Abstract: An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion apparatus according to the present invention includes a power semiconductor module, a capacitor module, a flow path forming body that forms a flow path through which a cooling refrigerant flows . The flow path forming body includes a first flow path forming body that forms a first flow path part for cooling the power semiconductor module, and a second flow path forming body that forms a second flow path part for cooling the capacitor module. The first flow path forming body is provided on a side portion of the second follow path forming body and is integrally formed with the second flow path forming body. The second flow path forming body forms a housing space for housing the capacitor module above the second flow path part . The first flow path part is formed at a position facing the side wall that forms the housing space.

Abstract: Disclosed is a downsized an integrated power-converter apparatus in which a plurality of power converter apparatuses is integrated, and to shorten a wiring connection distance in the power converter apparatus. The power-converter apparatus includes a power semiconductor module, a DC-to-DC converter, a capacitor module, a flow-path forming body for forming a flow path through which a refrigerant flows, a case, and a first DC connector for transmitting the DC current. The power semiconductor module is arranged in a position facing the DC-DC converter with the flow-path forming body interposed therebetween. The DC connector is arranged on one specified surface side of the case. The surface of the case is formed along an arrangement direction of the power semiconductor module, the flow-path forming body, and the DC-DC converter. The capacitor module is arranged between the surface of the case and the flow-path forming body, and is connected to the DC connector.