Patents by Inventor Masashi Kumagai
Masashi Kumagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8568856Abstract: The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to a resist. The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 ?m, and wherein the average crystal grain size [of copper] is no greater than 0.8 ?m at 1 ?m from the insulator film in the cross-section of the copper layer. Preferably, the insulator film is a polyimide film.Type: GrantFiled: August 22, 2006Date of Patent: October 29, 2013Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Katsuyuki Tsuchida, Hironori Kobayashi, Ryu Murakami, Masashi Kumagai
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Patent number: 8449751Abstract: The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.Type: GrantFiled: October 3, 2007Date of Patent: May 28, 2013Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Masashi Kumagai, Mikio Hanafusa
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Publication number: 20130045207Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype G and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.Type: ApplicationFiled: February 18, 2011Publication date: February 21, 2013Applicants: SYMPHOGEN A/S, MEIJI SEIKA PHARMA CO., LTD.Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
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Publication number: 20130022603Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype I and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.Type: ApplicationFiled: February 18, 2011Publication date: January 24, 2013Applicants: SYMPHOGEN A/S, MEIJI SEIKA KAISHA, LTD.Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
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Publication number: 20130022604Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype B and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.Type: ApplicationFiled: February 18, 2011Publication date: January 24, 2013Applicants: SYMPHOGEN A/S, MEIJI SEIKA PHARMA CO., LTD.Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
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Publication number: 20130004500Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype A and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.Type: ApplicationFiled: February 18, 2011Publication date: January 3, 2013Applicants: SYMPHOGEN A/S, MEIJI SEIKA PHARMA CO., LTD.Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
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Publication number: 20130004499Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype E and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.Type: ApplicationFiled: February 18, 2011Publication date: January 3, 2013Applicants: SYMPHOGEN A/S, Meiji Seika Pharma Co., Ltd.Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Jun Saito, Hiroshi Nagaso, Masashi Kumagai, Yasuyo Hagiwara
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Patent number: 8182594Abstract: An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.Type: GrantFiled: September 26, 2006Date of Patent: May 22, 2012Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Eiji Hino, Masashi Kumagai
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Patent number: 8084044Abstract: An object of the present invention is to provide a protein or peptide antigen and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa. According to the present invention, there is provided a protein or peptide derived from Pseudomonas aeruginosa outer membrane protein PA0427 and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa.Type: GrantFiled: March 30, 2007Date of Patent: December 27, 2011Assignee: Meiji Seika Kaisha, Ltd.Inventors: Jiro Tanaka, Fukuichi Ohsawa, Takafumi Okutomi, Hiroshi Nagaso, Masashi Kumagai, Takahisa Suzuki, Keiko Otsuka
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Publication number: 20110110022Abstract: A portable terminal apparatus for implementing a sure waterproof function with small components and a small number of components is provided. The portable terminal apparatus with a waterproof structure includes a first casing 1 having an opening 14, a cable 5 for electrically connecting an electronic circuit of the inside of the first casing 1 to another electronic circuit through the opening 14, and a waterproof packing 7 which has an insertion hole 7b formed to penetrate so as to allow the cable 5 to be inserted and which is inserted into the opening 14. The waterproof packing 7 has a cylindrical shape and includes a first waterproof press-fitting rib 7c on an outside and a second waterproof press-fitting rib 7d on an inside, and the first waterproof press-fitting rib 7c and the second waterproof press-fitting rib 7d are disposed in positions mutually displaced in a length direction.Type: ApplicationFiled: February 2, 2009Publication date: May 12, 2011Applicant: PANASONIC CORPORATIONInventors: Masashi Kumagai, Shingo Kume
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Publication number: 20100330100Abstract: An object is to provide: a protein antigen or a peptide antigen usable as a vaccine composition which has an ability to practically prevent or treat a Pseudomonas aeruginosa infection, and which can cope with the diversity of clinical isolates derived from patients with a Pseudomonas aeruginosa infection; and an antibody directed against the antigen. The present invention provides a protein antigen or a peptide antigen and an antibody directed against these, which are for use in diagnosis, prevention, or treatment of a disease associated with Pseudomonas aeruginosa. According to the present invention, a protein or a peptide derived from a Pseudomonas aeruginosa-outer membrane protein PA4710, and an antibody directed against these are provided, which are for use in diagnosis, prevention, or treatment of a disease associated with Pseudomonas aeruginosa.Type: ApplicationFiled: June 30, 2008Publication date: December 30, 2010Applicant: Meiji Seika Kaisha Ltd.Inventors: Jiro Tanaka, Hiroshi Nagaso, Masashi Kumagai, Keiko Otsuka, Hirotomo Akabane, Takahisa Suzuki
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Publication number: 20100291070Abstract: An object is to provide an antibody and a vaccine composition which have an ability to practically prevent or treat a Pseudomonas aeruginosa infection, and which can cope with the diversity of clinical isolates derived from patients infected with Pseudomonas aeruginosa. According to the present invention, an antibody against a PA1698 protein that is a type III secretion system component protein of Pseudomonas aeruginosa or against a peptide of the protein, and a vaccine composition comprising the protein or the peptide are provided.Type: ApplicationFiled: December 24, 2008Publication date: November 18, 2010Applicant: MEIJI SEIKA KAISHA, LTD.Inventors: Masashi Kumagai, Jiro Tanaka, Hiroshi Nagaso, Tomohisa Ninomiya, Keiko Otsuka, Hirotomo Akabane, Takahisa Suzuki
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Patent number: 7824534Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.Type: GrantFiled: December 9, 2005Date of Patent: November 2, 2010Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Katsuyuki Tsuchida, Hironori Kobayashi, Masashi Kumagai
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Publication number: 20100270163Abstract: The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.Type: ApplicationFiled: June 29, 2010Publication date: October 28, 2010Inventors: Masashi Kumagai, Mikio Hanafusa
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Publication number: 20100224496Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.Type: ApplicationFiled: February 23, 2010Publication date: September 9, 2010Inventors: Katsuyuki Tsuchida, Hironori Kobayashi, Masashi Kumagai
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Patent number: 7777078Abstract: The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.Type: GrantFiled: October 10, 2003Date of Patent: August 17, 2010Assignee: Nikko Materials Co., Ltd.Inventors: Masashi Kumagai, Mikio Hanafusa
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Patent number: 7771835Abstract: It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.Type: GrantFiled: October 26, 2006Date of Patent: August 10, 2010Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Masashi Kumagai, Mikio Hanafusa
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Patent number: 7678257Abstract: There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which the nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.Type: GrantFiled: October 12, 2007Date of Patent: March 16, 2010Assignee: Nikko Materials Co., Ltd.Inventors: Masashi Kumagai, Mikio Hanafusa
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Patent number: 7651783Abstract: A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.Type: GrantFiled: July 17, 2002Date of Patent: January 26, 2010Assignee: Nikko Materials Co., Ltd.Inventors: Katsuyuki Tsuchida, Masashi Kumagai, Fumiaki Akase
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Publication number: 20090155279Abstract: An object of the present invention is to provide a protein or peptide antigen and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa. According to the present invention, there is provided a protein or peptide derived from Pseudomonas aeruginosa outer membrane protein PA5158 and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa.Type: ApplicationFiled: October 27, 2006Publication date: June 18, 2009Inventors: Jiro Tanaka, Fukuichi Ohsawa, Takafumi Okutomi, Hiroshi Nagaso, Masashi Kumagai, Takahisa Suzuki, Keiko Otsuka