Patents by Inventor Masashi Kumagai

Masashi Kumagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8568856
    Abstract: The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to a resist. The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 ?m, and wherein the average crystal grain size [of copper] is no greater than 0.8 ?m at 1 ?m from the insulator film in the cross-section of the copper layer. Preferably, the insulator film is a polyimide film.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: October 29, 2013
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Katsuyuki Tsuchida, Hironori Kobayashi, Ryu Murakami, Masashi Kumagai
  • Patent number: 8449751
    Abstract: The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: May 28, 2013
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Publication number: 20130045207
    Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype G and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.
    Type: Application
    Filed: February 18, 2011
    Publication date: February 21, 2013
    Applicants: SYMPHOGEN A/S, MEIJI SEIKA PHARMA CO., LTD.
    Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
  • Publication number: 20130022603
    Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype I and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.
    Type: Application
    Filed: February 18, 2011
    Publication date: January 24, 2013
    Applicants: SYMPHOGEN A/S, MEIJI SEIKA KAISHA, LTD.
    Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
  • Publication number: 20130022604
    Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype B and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.
    Type: Application
    Filed: February 18, 2011
    Publication date: January 24, 2013
    Applicants: SYMPHOGEN A/S, MEIJI SEIKA PHARMA CO., LTD.
    Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
  • Publication number: 20130004500
    Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype A and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.
    Type: Application
    Filed: February 18, 2011
    Publication date: January 3, 2013
    Applicants: SYMPHOGEN A/S, MEIJI SEIKA PHARMA CO., LTD.
    Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Hiroshi Nagaso, Masashi Kumagai
  • Publication number: 20130004499
    Abstract: Provided is a novel antibody having an excellent antibacterial activity against P. aeruginosa. By using plasmablasts obtained from cystic fibrosis patients with chronic P. aeruginosa pulmonary infection as starting materials, antibodies which bind to LPS of a P. aeruginosa strain of serotype E and which have excellent antibacterial activities in vitro and in vivo were successfully obtained.
    Type: Application
    Filed: February 18, 2011
    Publication date: January 3, 2013
    Applicants: SYMPHOGEN A/S, Meiji Seika Pharma Co., Ltd.
    Inventors: Jiro Tanaka, Peter Sejer Andersen, Takafumi Okutomi, Tsuneyoshi Inaba, Keiko Otsuka, Hirotomo Akabane, Yukari Hoshina, Jun Saito, Hiroshi Nagaso, Masashi Kumagai, Yasuyo Hagiwara
  • Patent number: 8182594
    Abstract: An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: May 22, 2012
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Eiji Hino, Masashi Kumagai
  • Patent number: 8084044
    Abstract: An object of the present invention is to provide a protein or peptide antigen and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa. According to the present invention, there is provided a protein or peptide derived from Pseudomonas aeruginosa outer membrane protein PA0427 and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: December 27, 2011
    Assignee: Meiji Seika Kaisha, Ltd.
    Inventors: Jiro Tanaka, Fukuichi Ohsawa, Takafumi Okutomi, Hiroshi Nagaso, Masashi Kumagai, Takahisa Suzuki, Keiko Otsuka
  • Publication number: 20110110022
    Abstract: A portable terminal apparatus for implementing a sure waterproof function with small components and a small number of components is provided. The portable terminal apparatus with a waterproof structure includes a first casing 1 having an opening 14, a cable 5 for electrically connecting an electronic circuit of the inside of the first casing 1 to another electronic circuit through the opening 14, and a waterproof packing 7 which has an insertion hole 7b formed to penetrate so as to allow the cable 5 to be inserted and which is inserted into the opening 14. The waterproof packing 7 has a cylindrical shape and includes a first waterproof press-fitting rib 7c on an outside and a second waterproof press-fitting rib 7d on an inside, and the first waterproof press-fitting rib 7c and the second waterproof press-fitting rib 7d are disposed in positions mutually displaced in a length direction.
    Type: Application
    Filed: February 2, 2009
    Publication date: May 12, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Masashi Kumagai, Shingo Kume
  • Publication number: 20100330100
    Abstract: An object is to provide: a protein antigen or a peptide antigen usable as a vaccine composition which has an ability to practically prevent or treat a Pseudomonas aeruginosa infection, and which can cope with the diversity of clinical isolates derived from patients with a Pseudomonas aeruginosa infection; and an antibody directed against the antigen. The present invention provides a protein antigen or a peptide antigen and an antibody directed against these, which are for use in diagnosis, prevention, or treatment of a disease associated with Pseudomonas aeruginosa. According to the present invention, a protein or a peptide derived from a Pseudomonas aeruginosa-outer membrane protein PA4710, and an antibody directed against these are provided, which are for use in diagnosis, prevention, or treatment of a disease associated with Pseudomonas aeruginosa.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 30, 2010
    Applicant: Meiji Seika Kaisha Ltd.
    Inventors: Jiro Tanaka, Hiroshi Nagaso, Masashi Kumagai, Keiko Otsuka, Hirotomo Akabane, Takahisa Suzuki
  • Publication number: 20100291070
    Abstract: An object is to provide an antibody and a vaccine composition which have an ability to practically prevent or treat a Pseudomonas aeruginosa infection, and which can cope with the diversity of clinical isolates derived from patients infected with Pseudomonas aeruginosa. According to the present invention, an antibody against a PA1698 protein that is a type III secretion system component protein of Pseudomonas aeruginosa or against a peptide of the protein, and a vaccine composition comprising the protein or the peptide are provided.
    Type: Application
    Filed: December 24, 2008
    Publication date: November 18, 2010
    Applicant: MEIJI SEIKA KAISHA, LTD.
    Inventors: Masashi Kumagai, Jiro Tanaka, Hiroshi Nagaso, Tomohisa Ninomiya, Keiko Otsuka, Hirotomo Akabane, Takahisa Suzuki
  • Patent number: 7824534
    Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: November 2, 2010
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Katsuyuki Tsuchida, Hironori Kobayashi, Masashi Kumagai
  • Publication number: 20100270163
    Abstract: The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.
    Type: Application
    Filed: June 29, 2010
    Publication date: October 28, 2010
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Publication number: 20100224496
    Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
    Type: Application
    Filed: February 23, 2010
    Publication date: September 9, 2010
    Inventors: Katsuyuki Tsuchida, Hironori Kobayashi, Masashi Kumagai
  • Patent number: 7777078
    Abstract: The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: August 17, 2010
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Patent number: 7771835
    Abstract: It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: August 10, 2010
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Patent number: 7678257
    Abstract: There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which the nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: March 16, 2010
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Patent number: 7651783
    Abstract: A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: January 26, 2010
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Katsuyuki Tsuchida, Masashi Kumagai, Fumiaki Akase
  • Publication number: 20090155279
    Abstract: An object of the present invention is to provide a protein or peptide antigen and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa. According to the present invention, there is provided a protein or peptide derived from Pseudomonas aeruginosa outer membrane protein PA5158 and an antibody against it, for use in the diagnosis, prevention, or treatment of diseases associated with Pseudomonas aeruginosa.
    Type: Application
    Filed: October 27, 2006
    Publication date: June 18, 2009
    Inventors: Jiro Tanaka, Fukuichi Ohsawa, Takafumi Okutomi, Hiroshi Nagaso, Masashi Kumagai, Takahisa Suzuki, Keiko Otsuka