Patents by Inventor Masashi Kunii

Masashi Kunii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110314330
    Abstract: A management apparatus and a management method that enable parsing processing to be executed efficiently by means of a working memory of a fixed size are proposed. One or more predefined rules are divided into one or more rule segments that comprise a condition and a conclusion that each form part of the rule, and the rule segments obtained through the division are stored in the secondary storage, and when an event notification from the information processing device is received, one or more related rule segments are selected and, by linking the selected one or more rule segments in the memory as required, a rule parsing network is constructed that indicates relationships between rules in the memory, an inference is derived on the basis of the constructed rule parsing network, and rule segments that are not readily used in inference derivation are deleted from the memory.
    Type: Application
    Filed: March 11, 2010
    Publication date: December 22, 2011
    Inventors: Tomohiro Morimura, Masashi Kunii, Yutaka Kudo
  • Publication number: 20110231715
    Abstract: A management system, which manages an information processing system by identifying a cause location based on previously defined analysis rule information, displays a status that is a condition of the analysis rule information but is not receivable, based on acquirable status information of the apparatuses making up the information processing system or information about statuses received in the past.
    Type: Application
    Filed: October 23, 2009
    Publication date: September 22, 2011
    Inventors: Masashi Kunii, Tomohiro Morimura, Takaki Kuroda
  • Patent number: 6338193
    Abstract: A method for processing a terminal of a cable including a plurality of fine coaxial cables arranged in parallel and a terminal-processed tape-shaped cable are provided. After sheaths closer to the terminal of a plurality of fine coaxial cables are removed to expose outer conductors, the outer conductors thus exposed are removed in such a way that the entirety of the outer conductors thus exposed are covered with a solder layer, then the solder layer and the outer conductors are separated at a processing groove formed at a predetermined position on this solder layer, and respective portions of the outer conductors closer to the end of the cable relative to the position of the separation are removed in a lump.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: January 15, 2002
    Assignee: Hitachi Cable Ltd.
    Inventors: Masashi Kunii, Hideki Saito, Hajime Kimura, Takaaki Ichikawa
  • Patent number: 6326549
    Abstract: A method for processing a terminal of a cable including a plurality of fine coaxial cables arranged in parallel and a terminal-processed tape-shaped cable are provided. After sheaths closer to the terminal of a plurality of fine coaxial cables are removed to expose outer conductors, the outer conductors thus exposed are removed in such a way that the entirety of the outer conductors thus exposed are covered with a solder layer, then the solder layer and the outer conductors are separated at a processing groove formed at a predetermined position on this solder layer, and respective portions of the outer conductors closer to the end of the cable relative to the position of the separation are removed in a lump.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: December 4, 2001
    Assignee: Hitachi Cable Ltd.
    Inventors: Masashi Kunii, Hideki Saito, Hajime Kimura, Takaaki Ichikawa
  • Publication number: 20010018980
    Abstract: A method for processing a terminal of a cable including a plurality of fine coaxial cables arranged in parallel and a terminal-processed tape-shaped cable are provided. After sheaths closer to the terminal of a plurality of fine coaxial cables are removed to expose outer conductors, the outer conductors thus exposed are removed in such a way that the entirety of the outer conductors thus exposed are covered with a solder layer, then the solder layer and the outer conductors are separated at a processing groove formed at a predetermined position on this solder layer, and respective portions of the outer conductors closer to the end of the cable relative to the position of the separation are removed in a lump.
    Type: Application
    Filed: February 1, 2001
    Publication date: September 6, 2001
    Applicant: Hitachi Cable Ltd.
    Inventors: Masashi Kunii, Hideki Saito, Hajime Kimura, Takaaki Ichikawa