Abstract: To provide a novel resin having excellent dielectric properties, a method for producing the resin, a curable resin composition, and a cured product. The resin contains constituent units described in Group (1). R1 each independently represent a methylene group, a methylene oxy group, a methylene oxy methylene group, or an oxy methylene group. R2 and R3 each independently represent a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons. R4, R5, and R6 each independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy group, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons.

Abstract: The present invention provides a polyfunctional dimethylnaphthalene formaldehyde resin which is polyfunctional, rich in reactivity and useful as a variety of raw materials to be modified, specifically a dimethylnaphthalene formaldehyde resin obtained by allowing (1) one kind or two or more kinds of a dimethylnaphthalene having one methyl group on each of two benzene rings in a naphthalene ring thereof and selected from the group consisting of 1,5-dimethylnaphthalene, 1,6-dimethylnaphthalene, 2,6-dimethylnaphthalene, 1,7-dimethylnaphthalene, 1,8-dimethylnaphthalene and 2,7-dimethylnaphthalene; and (2) formaldehyde to react with each other in the presence of water and an acid catalyst, the polyfunctional dimethylnaphthalene formaldehyde resin having a mean value of the number of hydrogen atoms substituted by the reaction among the six hydrogen atoms directly bonded on the naphthalene ring in the dimethylnaphthalene of from 1.8 to 3.5.

Abstract: A composition for forming an underlayer film for lithography for imparting excellent optical characteristics and etching resistance to an underlayer film for lithography, an underlayer film being formed of the composition and having a high refractive index (n) and a low extinction coefficient (k), being transparent, having high etching resistance, containing a significantly small amount of a sublimable component, and a method for forming a pattern using the underlayer film are provided. The composition for forming an underlayer film contains a naphthalene formaldehyde polymer having a specific unit obtained by reacting naphthalene and/or alkylnaphthalene with formaldehyde, and an organic solvent.

Abstract: The aromatic hydrocarbon resin can be used as a coating material and a resist resin for a semiconductor, and has a high carbon concentration and a low oxygen concentration. A composition for forming an underlayer film for lithography that has excellent etching resistance as an underlayer film for a multilayer resist process, an underlayer film formed with the same, and a pattern forming method using the same are disclosed. An aromatic hydrocarbon is reacted with an aromatic aldehyde in the presence of an acidic catalyst, thereby providing an aromatic hydrocarbon resin that has a high carbon concentration of from 90 to 99.9% by mass and a low oxygen concentration of from 0 to 5% by mass. A composition for forming an underlayer film for lithography contains the resin and an organic solvent, an underlayer film is formed with the same, and a pattern forming method uses the same.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4], provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included This resin is excellent in heat resistance and useful for thermosetting resins.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4] provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4] provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4] provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included.

Abstract: A modified dimethylnaphthalene formaldehyde resin obtained by modifying a polyfunctional dimethylnaphthalene formaldehyde resin having a constituent unit represented by the following general formula [1] in a molecule thereof with at least one member selected from the group consisting of a phenol represented by the following general formula [2], a naphthol represented by the following general formula [3] and a naphthol represented by the following general formula [4] provided that at least any of the naphthol represented by the general formula [3] or the naphthol represented by the general formula [4] must be included.

Abstract: The aromatic hydrocarbon resin can be used as a coating material and a resist resin for a semiconductor, and has a high carbon concentration and a low oxygen concentration. A composition for forming an underlayer film for lithography that has excellent etching resistance as an underlayer film for a multilayer resist process, an underlayer film formed with the same, and a pattern forming method using the same are disclosed. An aromatic hydrocarbon is reacted with an aromatic aldehyde in the presence of an acidic catalyst, thereby providing an aromatic hydrocarbon resin that has a high carbon concentration of from 90 to 99.9% by mass and a low oxygen concentration of from 0 to 5% by mass. A composition for forming an underlayer film for lithography contains the resin and an organic solvent, an underlayer film is formed with the same, and a pattern forming method uses the same.

Abstract: A modified dimethylnaphthalene formaldehyde resin is disclosed, which is excellent in heat resistance and useful for thermosetting resins which are used for an electrical insulating material, a resin for resist, a semiconductor sealing resin, an adhesive for printed wiring board, a matrix resin for electrical laminate or prepreg to be mounted in electrical instruments, electronic instruments, industrial instruments, etc.

Abstract: The present invention provides a polyfunctional dimethylnaphthalene formaldehyde resin which is polyfunctional, rich in reactivity and useful as a variety of raw materials to be modified, specifically a dimethylnaphthalene formaldehyde resin obtained by allowing (1) one kind or two or more kinds of a dimethylnaphthalene having one methyl group on each of two benzene rings in a naphthalene ring thereof and selected from the group consisting of 1,5-dimethylnaphthalene, 1,6-dimethylnaphthalene, 2,6-dimethylnaphthalene, 1,7-dimethylnaphthalene, 1,8-dimethylnaphthalene and 2,7-dimethylnaphthalene; and (2) formaldehyde to react with each other in the presence of water and an acid catalyst, the polyfunctional dimethylnaphthalene formaldehyde resin having a mean value of the number of hydrogen atoms substituted by the reaction among the six hydrogen atoms directly bonded on the naphthalene ring in the dimethylnaphthalene of from 1.8 to 3.5.

Abstract: A composition for forming an underlayer film for lithography for imparting excellent optical characteristics and etching resistance to an underlayer film for lithography, an underlayer film being formed of the composition and having a high refractive index (n) and a low extinction coefficient (k), being transparent, having high etching resistance, containing a significantly small amount of a sublimable component, and a method for forming a pattern using the underlayer film are provided. The composition for forming an underlayer film contains a naphthalene formaldehyde polymer having a specific unit obtained by reacting naphthalene and/or alkylnaphthalene with formaldehyde, and an organic solvent.

Abstract: Provided is a method of producing a low viscosity phenol-modified aromatic hydrocarbon formaldehyde resin (C), including subjecting an aromatic hydrocarbon formaldehyde resin (A) and a phenol (B) to condensation reaction under the presence of an acid catalyst. The method includes: terminating, when a reaction mixture has a viscosity at 25° C. of 200 to 1,500 mPa·S, the condensation reaction by adding an inorganic basic compound and/or a tertiary amine compound having a boiling point of 300° C. or more; and distilling and removing the phenol (B) unreacted and a low boiling component after termination of the condensation reaction, whereby there can be produced a low viscosity phenol-modified aromatic hydrocarbon formaldehyde resin which is kept in a liquid state and contains small amounts of unreacted phenols, and in which increase in viscosity is small even after removal of low boiling components.

Abstract: Provided is a method of producing a low viscosity phenol-modified aromatic hydrocarbon formaldehyde resin (C), including subjecting an aromatic hydrocarbon formaldehyde resin (A) and a phenol (B) to condensation reaction under the presence of an acid catalyst. The method includes: terminating, when a reaction mixture has a viscosity at 25° C. of 200 to 1,500 mPa·S, the condensation reaction by adding an inorganic basic compound and/or a tertiary amine compound having a boiling point of 300° C. or more; and distilling and removing the phenol (B) unreacted and a low boiling component after termination of the condensation reaction, whereby there can be produced a low viscosity phenol-modified aromatic hydrocarbon formaldehyde resin which is kept in a liquid state and contains small amounts of unreacted phenols, and in which increase in viscosity is small even after removal of low boiling components.