Abstract: There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.

Abstract: A glass device including a thin glass substrate which has a glass thickness of 300 ?m or less is enabled to be provided more easily. In a method for manufacturing the glass device, one or more through holes are formed in a glass substrate, and a first wiring on a first surface side of the glass substrate and a second wiring on a second surface side of the glass substrate are electrically connected to each other via the through holes. After the first wiring is provided, the through holes are formed while the glass substrate is being thinned by etching. Then, wirings in the through holes and the second wiring are formed. The thinned glass substrate has a thickness of 50 ?m or more and 300 ?m or less. The through holes have the shape of a truncated cone.

Abstract: A glass core multilayer wiring board includes a glass substrate, a through electrode, a first layer structure, and a second layer structure. A through hole has a diameter decreasing from a first surface toward a second surface. The through electrode is along a side wall of the through hole. The first layer structure is on the first surface and the second layer structure is on the second surface. The second layer structure closes an opening in the second surface defining a bottom section. The through electrode has: a first layer on part of the side wall and on part or all of the bottom section of the through hole closing the opening of the through hole, a second layer covering the first layer, the side wall of the through hole exposed, and the bottom section, and a third layer is located on the second layer.

Abstract: A wiring board that facilitates narrowing a pitch of bonding terminals used for bonding to a semiconductor chip, providing finer wiring in a substrate and reducing cost, and is capable of achieving high connection reliability. A composite wiring board includes: a first wiring board; a second wiring board facing the first wiring board and bonded to the first wiring board, a distance from the second wiring board to the first wiring board being greater at a peripheral part than at a center part of the second wiring board; and a sealing resin layer interposed between the first wiring board and the second wiring board, the sealing resin layer covering an end face of the second wiring board.

Abstract: A glass core multilayer wiring board includes a glass substrate, a through electrode, a first layer structure, and a second layer structure. A through hole has a diameter decreasing from a first surface toward a second surface. The through electrode is along a side wall of the through hole. The first layer structure is on the first surface and the second layer structure is on the second surface. The second layer structure closes an opening in the second surface defining a bottom section. The through electrode has: a first layer on part of the side wall and on part or all of the bottom section of the through hole closing the opening of the through hole, a second layer covering the first layer, the side wall of the through hole exposed, and the bottom section, and a third layer is located on the second layer.

Abstract: There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.

Abstract: A glass device including a thin glass substrate which has a glass thickness of 300 ?m or less is enabled to be provided more easily. In a method for manufacturing the glass device, one or more through holes are formed in a glass substrate, and a first wiring on a first surface side of the glass substrate and a second wiring on a second surface side of the glass substrate are electrically connected to each other via the through holes. After the first wiring is provided, the through holes are formed while the glass substrate is being thinned by etching. Then, wirings in the through holes and the second wiring are formed. The thinned glass substrate has a thickness of 50 ?m or more and 300 ?m or less. The through holes have the shape of a truncated cone.