Patents by Inventor Masashi Tsunabuchi

Masashi Tsunabuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Size reduction of chip mounting system
    Patent number: 7122399
    Abstract: A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: October 17, 2006
    Assignee: NEC Corporation
    Inventors: Shinji Watanabe, Masashi Tsunabuchi
  • Size reduction of chip mounting system
    Patent number: 6836959
    Abstract: A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: January 4, 2005
    Assignee: NEC Corporation
    Inventors: Shinji Watanabe, Masashi Tsunabuchi
  • Size reduction of chip mounting system
    Publication number: 20040168311
    Abstract: A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.
    Type: Application
    Filed: March 12, 2004
    Publication date: September 2, 2004
    Applicant: NEC CORPORATION
    Inventors: Shinji Watanabe, Masashi Tsunabuchi
  • Size reduction of chip mounting system
    Publication number: 20010049875
    Abstract: A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.
    Type: Application
    Filed: February 22, 2001
    Publication date: December 13, 2001
    Inventors: Shinji Watanabe, Masashi Tsunabuchi
  • Automatic reflow soldering apparatus
    Patent number: 5242096
    Abstract: An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: September 7, 1993
    Assignees: NEC Corporation, EIGHTECH TECTRON Co., Ltd.
    Inventors: Masashi Tsunabuchi, Taihei Takeshita, Tadanori Ishikura, Akifumi Takashima