Abstract: A vibration proofing device includes a bracket having an internal space, and a vibration proofing member inserted into the internal space. The internal space is open on an outer surface of the bracket. At least a pair of facing-each-other surfaces, against which the vibration proofing member is pressed, is formed in an inner surface of the bracket. A distance between the pair of the facing-each-other surfaces on a far side in an insertion direction of the vibration proofing member is the same, in at least some regions of the bracket, as that on a near side in the insertion direction. This provides the vibration proofing device and the bracket to allow for compactly configuring the device as a whole, while sufficiently securing a retaining force between the bracket and the vibration proofing member.

Abstract: The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.

Abstract: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.

Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.

Abstract: The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.

Abstract: An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process.

Abstract: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.

Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.

Abstract: A combustion apparatus according to the present invention can positively control and generate burnt gas recirculation with a simple structure. The combustion apparatus has an annular container (12) having an inner cylindrical portion (15) forming an inner circumferential side surface, an outer cylindrical portion (13) forming an outer circumferential side surface, an open end (26), and a close end (10). A flow (28) of air is formed so as to have a velocity component in the direction of a central axis (J) from the open end (26) to the close end (10) and a velocity component to swirl in a circumferential direction of the annular container (12). Fuel (23) is injected so as to have a velocity component in the direction of the central axis (J) from the close end (10) to the open end (26) and a velocity component directed radially outward.

Abstract: A combustion apparatus according to the present invention can positively control and generate burnt gas recirculation with a simple structure. The combustion apparatus has a cylindrical container (12) having a combustion chamber, a close end (10), and an open end (26), an inflow passages (20) for supplying combustion air into the combustion chamber in the cylindrical container (12), and a fuel nozzle (18) for supplying fuel into the combustion chamber in the cylindrical container (12). A flow (28) of air is formed so as to have a velocity component in a direction of a central axis (J) from the open end (26) to the close end (10) and a velocity component to swirl in a circumferential direction of said annular container (12). Fuel is injected so as to have a velocity component in the direction of the central axis (J) from the close end (10) to the open end (26) and a velocity component directed radially outward.

Abstract: Provided are a tetrafluoroethylene copolymer excellent in paste extrudability, which comprises a unit based on tetrafluoroethylene and a unit based on a monomer represented by a formula of CF2?CF—O—(CF2)nCF?CF2 (wherein n is an integer of from 1 to 6), wherein a content of the unit based on the monomer represented by the formula is from 0.1 to 0.5% by mass, wherein a particle size of a primary particle is from 0.1 to 0.5 ?m, wherein a standard specific gravity is from 2.14 to 2.25, wherein a paste extrusion pressure is from 24.5 to 73.5 MPa and wherein the copolymer remains not undergoing melt molding; a fine powder of a tetrafluoroethylene copolymer; and a production method and a paste extruded product thereof. The TFE copolymer is excellent in paste extrudability and the molded product thereof is excellent in heat resistance and transparency.

Abstract: Provided is a tetrafluoroethylene copolymer consisting of a unit based on tetrafluoroethylene and a unit based on a monomer represented by CF2?CFORf1Rf2 (where Rf1 is a polyfluoroalkylene group which may contain an etheric oxygen atom and Rf2 is a polyfluorocycloalkyl group which may contain an etheric oxygen atom), wherein a content of the latter is from 0.005 to 0.5% by mass. The tetrafluoroethylene copolymer is excellent both in paste extrudability and in heat resistance, has characteristics such as excellent transparency of a molded product, and is suitably applicable to paste extrusion and compression molding.

Abstract: Provided is a tetrafluoroethylene copolymer consisting of a unit based on tetrafluoroethylene and a unit based on a monomer represented by CF2?CFORf1Rf2 (where Rf1 is a polyfluoroalkylene group which may contain an etheric oxygen atom and Rf2 is a polyfluorocycloalkyl group which may contain an etheric oxygen atom), wherein a content of the latter is from 0.005 to 0.5% by mass. The tetrafluoroethylene copolymer is excellent both in paste extrudability and in heat resistance, has characteristics such as excellent transparency of a molded product, and is suitably applicable to paste extrusion and compression molding.

Abstract: Provided are a tetrafluoroethylene copolymer excellent in paste extrudability, which comprises a unit based on tetrafluoroethylene and a unit based on a monomer represented by a formula of CF2?CF—O—(CF2)nCF?CF2 (wherein n is an integer of from 1 to 6), wherein a content of the unit based on the monomer represented by the formula is from 0.1 to 0.5% by mass, wherein a particle size of a primary particle is from 0.1 to 0.5 ?m, wherein a standard specific gravity is from 2.14 to 2.25, wherein a paste extrusion pressure is from 24.5 to 73.5 MPa and wherein the copolymer remains not undergoing melt molding; a fine powder of a tetrafluoroethylene copolymer; and a production method and a paste extruded product thereof. The TFE copolymer is excellent in paste extrudability and the molded product thereof is excellent in heat resistance and transparency.

Abstract: There is disclosed a vessel for pretreatment of elementary analysis wherein the vessel is a ceramic vessel produced by chemical vapor deposition (CVD) method. And there is disclosed an inductively coupled plasma torch that has at least an induction coil and a nozzle and is used in an apparatus for elementary analysis by ICP method, wherein the nozzle is a ceramic nozzle produced by CVD method. Thus, there can be provided a vessel for pretreatment of elementary analysis that excels in heat resistance and chemical resistance such as acid resistance, and has high purity. There can be also provided an inductively coupled plasma torch used in an apparatus for analysis by ICP method that enables accurate elementary analysis and excels in durability, and an apparatus for elementary analysis by ICP method having this.

Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers.

Abstract: Finely ground polytetrafluoroethylene molding powder with or without a filler is subjected to high speed agitation in the presence of a medium consisting essentially of water and a hydrophobic organic liquid at a ratio of 0.5 to 1 liter per 1 Kg of the resin to agglomerate it. Hydrophobic organic liquids mean organic liquid which dissolve less than 15 wt. % in water at the temperature of agglomeration.The volumetric ratio of the organic liquid to water is in a range of 2 to 1/2.The agglomerated product having narrow particle size distribution and high bulk density and free flowing property can be obtained by the agitation for short time.