Abstract: At a time of cleaning a plate-like part such as a wafer or the like while rotating, for the purpose of reducing a contamination, a damage and an unevenness of process of the plate-like part which are caused by an amount of charged electricity of the plate-like part, chuck pins (chuck members) 201 which chuck the plate-like part 1 such as the wafer or the like and upper and lower cleaning plates 101 and 121 which oppose to the plate-like part 1 are constituted by a resin material containing carbon powders, and a desired potential difference is applied to a portion between the plate-like part and the cleaning plates by a voltage control unit 601 which is provided in an outer portion.

Abstract: The fluid treatment apparatus, as disclosed, comprises upper and lower Bernoulli-plates 12 and 14, each of which includes a metal plate 25 provided on overall outer surface thereof. On each of the metal plates 25, there is arranged a spiral-shaped circulating pipe 24 through which a heating medium or a cooling medium are circulated so as to rapidly heat or cool the upper and lower Bernoulli-plates. During the treatment of a wafer 16 by the apparatus, the upper and lower Bernoulli-plates are disposed in parallel with each other to define a narrow gap therebetween while a clearance between the wafer 16 and the upper Bernoulli-plate and a clearance between the wafer 16 and the lower Bernoulli-plate are kept to be equal to each other. Thus, the present invention can achieve various purpose such as a time saving for the cleaning, reduction of consumption of the cleaning liquid and inhibition of cleaning irregularity.

Abstract: To carry out very clean and low-cost fluid processing on both the front and rear surfaces of an object to be processed without generating rubbing particles and without leakage of fluid. A retention member for the object to be processed 18 that retains the object to be processed 17 and a rear shielding plate 15 that prevents the rear surface of the object to be processed from becoming contaminated by excessive fluid flow are mechanically separated. The rear shielding plate 15 is fixed in like manner to a front shielding plate 11, only the retention member for the object to be processed 18 is allowed to rotate making it possible to rigidly connect a supply pipe 22 (that supplies fluid through the rear shielding plate 15) to the rear shielding plate 15. Further, a circulation system is provided that collects fluid which underwent front surface processing in a collection tube 13, circulates that fluid and then supplies it to the rear surface of the object to be processed from a supply pipe.

Abstract: A substrate treating apparatus and method can recover a substrate treating liquid such as a cleaning liquid in an efficient manner and positively avoid occurrences of treatment defects such as formation of cleaning spots, water marks and the like. A fixed upper plate and a fixed lower plate are disposed in opposition to each other so as to define a space therebetween. A substrate such as a semiconductor wafer is inserted into the space between the fixed upper and lower plates, supported there by a support and adapted to be rotated through rotation of the support. A substrate treating medium such as a cleaning liquid is introduced into the space to treat the substrate while the substrate is rotating. The treating medium after having treated the substrate is discharged from the space through a discharge passage which is defined between an outer peripheral surface of the support and an inner surface of a housing which covers the outer peripheral surface of the support.

Abstract: To carry out very clean and low-cost fluid processing on both the front and rear surfaces of an object to be processed without generating rubbing particles and without leakage of fluid.

Abstract: A clean, recirculating and processing method which prevents surface contamination of an object, such as a semiconductor, semi-conductor wafer, glass for LCD or magnetic disk is provided which includes covering the front and rear surfaces of an object to be processed with front and rear shielding plates and allows the object to rotate relative to the front and rear shielding plates. The fluid is supplied between the front surface of the object and the front shielding plate allowing the front surface to be processed. The remaining fluid is collected and recirculated between the rear surface of the object and the rear shielding plate allowing the rear surface of the object to be processed. An apparatus for accomplishing the method is also disclosed.